Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/09/2010US7829997 Interconnect for chip level power distribution
11/09/2010US7829996 includes substrate, film structure including adhesive film (silicon dioxide) and stack (silicon dioxide), and protective film (silicon dioxide), with alternating dielectric films (silicon dioxide) and metal films (chromium, aluminum, and silver); mobile phones
11/09/2010US7829995 Semiconductor device and method of fabrication
11/09/2010US7829994 Semiconductor substrate elastomeric stack
11/09/2010US7829993 Semiconductor apparatus
11/09/2010US7829992 Semiconductor device and method for manufacturing semiconductor device
11/09/2010US7829991 Stackable ceramic FBGA for high thermal applications
11/09/2010US7829990 Stackable semiconductor package including laminate interposer
11/09/2010US7829989 Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
11/09/2010US7829986 Integrated circuit package system with net spacer
11/09/2010US7829985 BGA package having half-etched bonding pad and cut plating line and method of fabricating same
11/09/2010US7829984 Integrated circuit package system stackable devices
11/09/2010US7829983 Semiconductor device
11/09/2010US7829982 Lead frame, sensor including lead frame and method of forming sensor including lead frame
11/09/2010US7829981 Semiconductor device packages with electromagnetic interference shielding
11/09/2010US7829980 Magnetoresistive device and method of packaging same
11/09/2010US7829979 High permeability layered films to reduce noise in high speed interconnects
11/09/2010US7829978 Closed loop CESL high performance CMOS device
11/09/2010US7829976 Microelectronic devices and methods for forming interconnects in microelectronic devices
11/09/2010US7829975 Multichip semiconductor device, chip therefor and method of formation thereof
11/09/2010US7829971 Semiconductor apparatus
11/09/2010US7829967 Resin for optical-semiconductor-element encapsulation containing polyimide and optical semiconductor device obtained with the same
11/09/2010US7829924 Semiconductor device and method for fabricating the same
11/09/2010US7829889 Method and semiconductor structure for monitoring etch characteristics during fabrication of vias of interconnect structures
11/09/2010US7829881 Semiconductor light emitting device having roughness and method of fabricating the same
11/09/2010US7829864 Microfabricated miniature grids
11/09/2010US7829798 Electronic control unit and process of producing the same
11/09/2010US7829459 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device
11/09/2010US7829427 Method of fabricating a high Q factor integrated circuit inductor
11/09/2010US7829386 Power semiconductor packaging method and structure
11/09/2010US7829385 Taped semiconductor device and method of manufacture
11/09/2010US7829382 Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
11/09/2010US7829144 Method of forming a metal film for electrode
11/09/2010US7828047 Cooling unit
11/09/2010US7828045 Heat sink and information processor using heat sink
11/09/2010US7827681 Method of manufacturing electronic component integrated substrate
11/09/2010CA2568811C Nickel powder, conductive paste, and multilayer electronic component using same
11/04/2010WO2010127370A2 Series current limiting device
11/04/2010WO2010126511A1 Die connection monitoring system and method
11/04/2010WO2010126499A1 Printed circuit board cooling assembly
11/04/2010WO2010126448A2 Novel bonding process and bonded structures
11/04/2010WO2010126302A2 Semiconductor package with nsmd type solder mask and method for manufacturing the same
11/04/2010WO2010126255A2 Heat sink for a protrusion-type ic package
11/04/2010WO2010125935A1 Power module
11/04/2010WO2010125925A1 Electronic component mounting device and method for producing the same
11/04/2010WO2010125814A1 Device mounting structure and device mounting method
11/04/2010WO2010125800A1 Bonded structure and bonding method for bonded structure
11/04/2010WO2010125682A1 Semiconductor device and manufacturing method thereof
11/04/2010WO2010125639A1 Power semiconductor device
11/04/2010WO2010125164A1 Through substrate vias
11/04/2010WO2010125043A1 Supply cell and integrated circuit comprising such supply cells
11/04/2010WO2010124967A1 Composite electronic circuit assembly
11/04/2010WO2010105125A3 Cooling device and electronic device comprising the cooling device
11/04/2010WO2010095899A3 Semiconductor package processing system
11/04/2010US20100280346 Analyte Monitoring Device and Methods of Use
11/04/2010US20100280345 Analyte Monitoring Device and Methods of Use
11/04/2010US20100279501 Semiconductor device and method of manufacturing the same
11/04/2010US20100279464 Fabrication method of semiconductor integrated circuit device
11/04/2010US20100278211 Method and system of testing a semiconductor device
11/04/2010US20100277963 Ic card
11/04/2010US20100276818 Device comprising an organic component and an encapsulation layer with a moisture-reactive material
11/04/2010US20100276817 Semiconductor device
11/04/2010US20100276816 Separate probe and bond regions of an integrated circuit
11/04/2010US20100276815 Integrated circuit communication system with differential signal and method of manufacture thereof
11/04/2010US20100276814 Methods for packaging microelectronic devices and microelectronic devices formed using such methods
11/04/2010US20100276813 Injection molded soldering process and arrangement for three-dimensional structures
11/04/2010US20100276812 Epitaxial wafer and manufacturing method thereof
11/04/2010US20100276811 Semiconductor Component with Terminal Contact Surface
11/04/2010US20100276810 Semiconductor device and fabrication method thereof
11/04/2010US20100276809 T-connections, methodology for designing t-connections, and compact modeling of t-connections
11/04/2010US20100276808 Surface mounting electronic component and manufacturing method thereof
11/04/2010US20100276807 Fabrication of metal film stacks having improved bottom critical dimension
11/04/2010US20100276806 Plastic package and method of fabricating the same
11/04/2010US20100276805 Integrated circuit chip with reduced ir drop
11/04/2010US20100276804 Semiconductor device including ruthenium electrode and method for fabricating the same
11/04/2010US20100276803 Semiconductor device and method of manufacturing the same
11/04/2010US20100276802 Semiconductor device and method of manufacturing the semiconductor device
11/04/2010US20100276801 Semiconductor device and method to manufacture thereof
11/04/2010US20100276800 Semiconductor module
11/04/2010US20100276799 Semiconductor Chip Package with Stiffener Frame and Configured Lid
11/04/2010US20100276798 Semiconductor device
11/04/2010US20100276797 Semiconductor device
11/04/2010US20100276796 Reworkable electronic device assembly and method
11/04/2010US20100276795 Semiconductor package and method for manufacturing the same
11/04/2010US20100276794 System and method for multi-chip module die extraction and replacement
11/04/2010US20100276793 High pin density semiconductor system-in-a-package
11/04/2010US20100276792 Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure
11/04/2010US20100276791 Semiconductor device
11/04/2010US20100276787 Wafer Backside Structures Having Copper Pillars
11/04/2010US20100276786 Through Substrate Vias
11/04/2010US20100276784 Electronic components on trenched substrates and method of forming same
11/04/2010US20100276782 Semiconductor device mounted with fuse memory
11/04/2010US20100276769 Semiconductor device
11/04/2010US20100276766 Shielding for a micro electro-mechanical device and method therefor
11/04/2010US20100276755 Electrostatic discharge protection device and method for fabricating the same
11/04/2010US20100276695 Display device and manufacturing method thereof
11/04/2010US20100276690 Silicon Wafer Having Testing Pad(s) and Method for Testing The Same
11/04/2010US20100275989 Semiconductor device and manufacturing method thereof
11/04/2010DE202010011786U1 Kühlvorrichtung Cooler
11/04/2010DE202010011785U1 Thermosiphonkühler Thermosiphonkühler
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