Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/10/2010CN101882612A Electrostatic protection device
11/10/2010CN101882611A 集成电路芯片 IC chip
11/10/2010CN101882610A Semiconductor structure and manufacturing method thereof
11/10/2010CN101882609A Lead frame for semiconductor package body
11/10/2010CN101882608A Bump pad structure and method for manufacturing the same
11/10/2010CN101882607A Package structure of chip with conductor layer
11/10/2010CN101882606A Heat-dissipation semiconductor encapsulation structure and manufacturing method thereof
11/10/2010CN101882605A Chip packaging structure
11/10/2010CN101882600A Manufacturing method of metallic film stacks and integrated circuit containing the metallic film stacks
11/10/2010CN101882598A Electric through connection and forming method thereof
11/10/2010CN101882587A Structure for achieving wire bonding and packaging and production method thereof
11/10/2010CN101882585A Method for arranging radiator of integrated circuit and integrated circuit component
11/10/2010CN101882473A Kong-clan heat dissipation method
11/10/2010CN101881403A LED street lamp utilizing radiating fins and heat pipe to conduct heat
11/10/2010CN101881399A Backlight module
11/10/2010CN101881381A White light emitting diode and white light emitting diode lamp
11/10/2010CN101881380A Heat dissipation structure for LED chip
11/10/2010CN101880515A High-reliability and low-viscosity underfill
11/10/2010CN101880514A Single-component under-filler with favorable repairing property and preparation method thereof
11/10/2010CN101880375A Special curing agent for high-thermal-conductivity epoxy resin potting material, and potting material prepared from the same
11/10/2010CN101621092B Light-emitting diode
11/10/2010CN101476683B Side projection type LED backlight module
11/10/2010CN101459046B Test construction for light doped drain doping region square resistor and manufacturing method thereof
11/10/2010CN101452931B Integrated circuit device
11/10/2010CN101443904B Base for power module
11/10/2010CN101436603B Imaging die set
11/10/2010CN101435567B LED light fitting
11/10/2010CN101413652B LED light source device
11/10/2010CN101395290B Semiconductor device, its manufacturing method, and sputtering target material for use in the method
11/10/2010CN101388364B Electric isolation region forming method adopting low temperature process, single chip integration method
11/10/2010CN101378624B Module structure integrating perimeter circuit and manufacturing method thereof
11/10/2010CN101371352B Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
11/10/2010CN101355039B Encapsulation body for image sensing element and preparation method thereof
11/10/2010CN101345250B Integrated circuit device and memory array
11/10/2010CN101345229B LCD drive integrated circuit chip and package
11/10/2010CN101341592B Semiconductor module
11/10/2010CN101335247B Semiconductor device and manufacture method thereof
11/10/2010CN101334154B Large power LED lamp possessing radiating module structure
11/10/2010CN101330814B Radiating device
11/10/2010CN101330042B Conductive plug and preparation method thereof
11/10/2010CN101299433B Image pickup member module, lens unit using the same and portable electronic device
11/10/2010CN101291572B Heat radiating device
11/10/2010CN101271882B 半导体元件 Semiconductor components
11/10/2010CN101271669B Method for driving light emitting device, and light emitting device
11/10/2010CN101258593B Isolated chip-to-chip contact
11/10/2010CN101256973B Method for fabricating layered microelectronic contact
11/10/2010CN101236957B Conductive layer structure for chip encapsulation module and its making method
11/10/2010CN101231972B Flexible display device and fabricating method thereof
11/10/2010CN101197345B Mram cell structure and magnetoresistance random access memory structure
11/10/2010CN101193532B Heat radiator
11/10/2010CN101193529B Heat radiator
11/10/2010CN101193527B Liquid-cooling heat radiator
11/10/2010CN101188922B Heat radiator
11/10/2010CN101188247B An organic electric luminescent display and its making method
11/10/2010CN101174610B Wafer and method for recognizing error manufacture process using the same
11/10/2010CN101170118B Image sensor encapsulation, image sensor module and their making method
11/10/2010CN101170095B Semiconductor package and stacked layer type semiconductor package
11/10/2010CN101165886B Semiconductor packaging member for semiconductor device stacking and its manufacture method
11/10/2010CN101165883B Transparent carbon nanotube electrode using conductive dispersant and production method thereof
11/10/2010CN101159300B Copper base high power LED packaging
11/10/2010CN101150101B Integrated heat radiation method, system and corresponding heat radiation device
11/10/2010CN101141861B Fastener
11/10/2010CN101136378B Semiconductor device, packaging air tightness detecting method and distribution device
11/10/2010CN101131973B Heat radiating device
11/10/2010CN101111138B Heat sink assembly
11/10/2010CN101102642B 多层印刷电路板 Multilayer printed circuit board
11/10/2010CN101101899B Laminose board, manufacturing method thereof, electronic element and device with the laminose board
11/10/2010CN101083277B 显示装置及其制造方法 Display device and method of manufacturing
11/09/2010US7830940 Nitride semiconductor laser element having nitride semiconductor substrate and nitride semiconductor layer laminated thereon with nitride semiconductor substrate and nitride semiconductor layer having recesses formed in high dislocation density region of nitride semiconductor substrate and nitride semiconductor layer having portions with different film thicknesses
11/09/2010US7830667 Flexible wiring substrate and method for producing the same
11/09/2010US7830665 Easily disassembling cooling apparatus
11/09/2010US7830664 Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
11/09/2010US7830412 Method and apparatus for shielding correction pixels from spurious charges in an imager
11/09/2010US7830028 Semiconductor test structures
11/09/2010US7830027 Level realignment following an epitaxy step
11/09/2010US7830026 Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip
11/09/2010US7830025 Contact layout structure
11/09/2010US7830024 Package and fabricating method thereof
11/09/2010US7830023 Resin molded semiconductor device
11/09/2010US7830022 Semiconductor package
11/09/2010US7830020 Integrated circuit package system employing device stacking
11/09/2010US7830019 Via bottom contact and method of manufacturing same
11/09/2010US7830018 Partitioned through-layer via and associated systems and methods
11/09/2010US7830017 Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
11/09/2010US7830015 Memory device with improved data retention
11/09/2010US7830014 Method for fabricating semiconductor device and semiconductor device
11/09/2010US7830013 Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof
11/09/2010US7830012 Polycarbosilane substituted with a benzyl or diazo group and/or a polysilazane having a substituent capable of absorbing light; blocks ultraviolet light applied to a porous insulating film
11/09/2010US7830011 Semiconductor element and wafer level chip size package therefor
11/09/2010US7830010 dielectric material having upper hydrophobic surface comprising silylating agent, conductive polysiloxane material having upper surface embedded within, and noble metal alloy cap; semiconductors; corrosion resistance, oxidation resistance
11/09/2010US7830009 Semiconductor package and method of manufacturing the same
11/09/2010US7830008 Gold wire for connecting semiconductor chip
11/09/2010US7830007 Electronic device, method of producing the same, and semiconductor device
11/09/2010US7830006 Structurally-enhanced integrated circuit package and method of manufacture
11/09/2010US7830005 Bond pad array for complex IC
11/09/2010US7830004 Packaging with base layers comprising alloy 42
11/09/2010US7830003 Mechanical isolation for MEMS devices
11/09/2010US7830002 Device with chiplets and adaptable interconnections
11/09/2010US7830000 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
11/09/2010US7829998 Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
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