| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/11/2010 | US20100283136 Qfn semiconductor package |
| 11/11/2010 | US20100283135 Lead frame for semiconductor device |
| 11/11/2010 | US20100283134 High Power Ceramic on Copper Package |
| 11/11/2010 | US20100283131 Discontinuous Thin Semiconductor Wafer Surface Features |
| 11/11/2010 | US20100283130 Semiconductor device and manufacturing method thereof |
| 11/11/2010 | US20100283129 Semiconductor device and method for fabricating the same |
| 11/11/2010 | US20100283128 Dicing Structures for Semiconductor Substrates and Methods of Fabrication Thereof |
| 11/11/2010 | US20100283127 Method for packing semiconductor components and product produced according to the method |
| 11/11/2010 | US20100283121 Electrical fuses and resistors having sublithographic dimensions |
| 11/11/2010 | US20100283120 Fuse chambers on a substrate |
| 11/11/2010 | US20100283114 Chip-type semiconductor ceramic electronic component |
| 11/11/2010 | US20100283110 Integrated sensor chip unit |
| 11/11/2010 | US20100283096 Semiconductor device and method for fabricating the same |
| 11/11/2010 | US20100283088 Substrate-level interconnection and micro-electro-mechanical system |
| 11/11/2010 | US20100283059 Semiconductor device and method for manufacturing same |
| 11/11/2010 | US20100283052 Metrology Systems and Methods for Lithography Processes |
| 11/11/2010 | US20100282502 Multilayer printed wiring board |
| 11/11/2010 | US20100282443 Heat dissipation device |
| 11/11/2010 | US20100282300 Method for producing an electrode made with molybdenum oxide |
| 11/11/2010 | DE202010012070U1 Von Druckgefälle getriebene Kühlplatte Of pressure gradient driven cooling plate |
| 11/11/2010 | DE202009007810U1 Anordnung zur Lichtabgabe mit Leuchtelementen und damit gekoppeltem Kühlsystem Arrangement to emit light with light elements and thus coupled cooling system |
| 11/11/2010 | DE202004021772U1 Waferverbindung unter Verwendung von Reaktivfolien zum massiv parallelen Häusen mikro-elektromechanischer Systeme Wafer bonding using reactive foils for massively parallel housings micro-electro-mechanical systems |
| 11/11/2010 | DE19950026B4 Leistungshalbleitermodul The power semiconductor module |
| 11/11/2010 | DE10300532B4 System mit mindestens einer Test-Sockel-Vorrichtung zum Testen von Halbleiter-Bauelementen System with at least one test-socket device for testing of semiconductor devices |
| 11/11/2010 | DE10293997B4 Leistungshalbleitermodul The power semiconductor module |
| 11/11/2010 | DE102010028696A1 Hochleistungskeramik auf Kupferbaustein High Performance Ceramics copper block |
| 11/11/2010 | DE102009022877A1 Electrical assembly comprises cooler structure and electrical component on metal-ceramic substrate having electrical module, where electrical module comprises two metal-ceramic substrates |
| 11/11/2010 | DE102009019313A1 Arrangement for use as air convection device for cooling of heat generated structural unit, has ventilator unit with air ventilation unit or exhaust fan unit, where screening case cover is attached with arrangement |
| 11/11/2010 | DE102009016953A1 Konversionseinheit mit mehreren Konversionsmodulen, Inbetriebnahmeverfahren der Konversionseinheit und eine solche Konversionseinheit aufweisende optische Anordnung Conversion unit with multiple conversion modules, start-up process of the conversion unit and such a conversion unit having optical arrangement |
| 11/11/2010 | DE102009014794B3 Verfahren zum Herstellen eines für Hochvoltanwendungen geeigneten festen Leistungsmoduls und damit hergestelltes Leistungsmodul A method of manufacturing a suitable for high voltage applications fixed power module and power module thus prepared |
| 11/11/2010 | DE102008016665B4 Verkapselungsverfahren und Vorrichtung Encapsulation methods and apparatus |
| 11/11/2010 | DE102006046182B4 Halbleiterelement mit einer Stützstruktur sowie Herstellungsverfahren Semiconductor element having a support structure and manufacturing method |
| 11/11/2010 | DE102004061099B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls mit ESD-Schutzbeschaltung Method for producing a power semiconductor module with ESD protection circuit |
| 11/11/2010 | DE102004059353B4 Halbleiter-Leistungsmodul Semiconductor power module |
| 11/11/2010 | DE10048377B4 Halbleiter-Leistungsmodul mit elektrisch isolierender Wärmesenke und Verfahren zu seiner Herstellung Semiconductor power module having an electrically insulating heat sink and method for its preparation |
| 11/11/2010 | CA2760003A1 Thermally conductive foam product |
| 11/10/2010 | EP2249383A2 Semiconductor apparatus and heat conductive sheet |
| 11/10/2010 | EP2249382A1 Circuit board module and electronic apparatus |
| 11/10/2010 | EP2249381A1 Semiconductor chip and semiconductor device |
| 11/10/2010 | EP2248921A1 Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material |
| 11/10/2010 | EP2248406A1 Heat sink device |
| 11/10/2010 | EP2248398A2 System and method for integrated waveguide packaging |
| 11/10/2010 | EP2248168A1 Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die |
| 11/10/2010 | EP2248167A2 Thermally conductive periodically structured gap fillers and method for utilizing same |
| 11/10/2010 | EP2248165A1 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive |
| 11/10/2010 | EP2248164A2 Microstructure modification in copper interconnect structure |
| 11/10/2010 | EP2248161A1 Leadless integrated circuit package having high density contacts |
| 11/10/2010 | EP2247995A1 Thermal interface with non-tacky surface |
| 11/10/2010 | EP2151148B1 Method for producing a circuit board having a cavity for the integration of components |
| 11/10/2010 | EP1956110B1 Metal-based composite material containing both micro-sized carbon fiber and nano-sized carbon fiber |
| 11/10/2010 | CN201629936U Radiating device with improved radiating efficiency |
| 11/10/2010 | CN201629935U Heat pipe type radiator for power amplifying module of broadcast television transmitter |
| 11/10/2010 | CN201629397U Integrated circuit combination |
| 11/10/2010 | CN201629330U Densely arranged integrated circuit lead frame piece |
| 11/10/2010 | CN201629329U Lead frame |
| 11/10/2010 | CN201629328U Heat radiator structure |
| 11/10/2010 | CN201629327U External heat radiator sealing structure for formal locking hole heat dissipation block of resin circuit board |
| 11/10/2010 | CN201629326U Normal chip packaging structure with exposed substrate and rectangular heat sink having locking hole and connected with external radiator |
| 11/10/2010 | CN201629325U Packaging structure with printed circuit board, flip chip and fully encapsulated heat dissipating block |
| 11/10/2010 | CN201629324U Normal chip packaging structure with exposed substrate and inverted-T-shaped heat sink connected with external radiator |
| 11/10/2010 | CN201629323U Packaging structure with printed circuit board, flip chip and heat dissipating block with locking hole and protruded surface |
| 11/10/2010 | CN201629322U Normal chip packaging structure with exposed substrate and inverted-T-shaped heat sink having locking hole and connected with external radiator |
| 11/10/2010 | CN201629321U Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap |
| 11/10/2010 | CN201629320U Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap via boss |
| 11/10/2010 | CN201629319U Flip sealing structure of resin circuit board chip with heat dissipation block |
| 11/10/2010 | CN201629318U Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole |
| 11/10/2010 | CN201629317U Packaging structure with printed circuit board, flip chip, heat dissipating block with locking hole and external heat dissipating cap |
| 11/10/2010 | CN201629316U Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss |
| 11/10/2010 | CN201629315U Projection packaging structure of surface of heat-dissipation block with inversion locking hole of chip with exposed internal foot |
| 11/10/2010 | CN201629314U Normal chip packaging structure with exposed substrate and rectangular radiator |
| 11/10/2010 | CN201629313U Locking hole radiating block external cooling plate encapsulating structure for flipped chip with exposed inner pin |
| 11/10/2010 | CN201629312U External heat radiator sealing structure for formal rectangle heat dissipation block of resin circuit board |
| 11/10/2010 | CN201629311U Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and radiator with external boss |
| 11/10/2010 | CN201629310U Normal chip packaging structure with exposed substrate and heat sink connected with external radiator |
| 11/10/2010 | CN201629309U Packaging structure with printed circuit board, positively arranged chip and heat dissipating block |
| 11/10/2010 | CN201629308U Packaging structure with printed circuit board, positively arranged chip and heat dissipating block with protruded surface |
| 11/10/2010 | CN201629307U Normal chip packaging structure with embedded substrate and heat sink |
| 11/10/2010 | CN201629306U Rectangular locking hole radiating block encapsulating structure of flip chip with embedded inner pin |
| 11/10/2010 | CN201629305U Radiating and packaging structure of lead frame |
| 11/10/2010 | CN201629304U Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and external heat dissipating cap |
| 11/10/2010 | CN201629303U Packaging structure with printed circuit board, positively arranged chip, rectangular heat dissipating block and external radiator |
| 11/10/2010 | CN1997906B System and method for measuring time dependent dielectric breakdown |
| 11/10/2010 | CN1964039B 功率半导体模块 Power semiconductor module |
| 11/10/2010 | CN1949512B System lsi |
| 11/10/2010 | CN1937887B Structure and method for reducing warp of substrate |
| 11/10/2010 | CN1835227B 半导体封装 The semiconductor package |
| 11/10/2010 | CN1791320B Electronic apparatus |
| 11/10/2010 | CN1783464B Heat dissipation system for multiple integrated circuits mounted on a printed circuit board |
| 11/10/2010 | CN1731915B 多层电路板装置 Multi-layer circuit board apparatus |
| 11/10/2010 | CN1677654B Radiating module |
| 11/10/2010 | CN1423678B Flame retardant phosphorus element-containing epoxy resin compositions |
| 11/10/2010 | CN101884103A Electrostatic discharge prevention circuit |
| 11/10/2010 | CN101884102A Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization |
| 11/10/2010 | CN101883806A Phosphorus-containing epoxy resin and phosphorus-containing epoxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and the resin composition |
| 11/10/2010 | CN101883483A Three-plate mini-type heat radiator |
| 11/10/2010 | CN101883472A PCB encapsulation of surface patch capacitor, method thereof, PCB and equipment |
| 11/10/2010 | CN101882627A Phase change memory device and manufacturing method thereof |
| 11/10/2010 | CN101882625A Light sensor using wafer-level packaging |
| 11/10/2010 | CN101882616A Integrated circuit |
| 11/10/2010 | CN101882613A Integrated circuit with chip seal ring |