Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/16/2010US7834454 Electronic structures including barrier layers defining lips
11/16/2010US7834453 Contact structure having a compliant bump and a test pad
11/16/2010US7834451 Film tray for fabricating flexible display
11/16/2010US7834450 Semiconductor package having memory devices stacked on logic device
11/16/2010US7834449 Highly reliable low cost structure for wafer-level ball grid array packaging
11/16/2010US7834448 Fluid cooled semiconductor power module having double-sided cooling
11/16/2010US7834447 Compliant thermal contactor
11/16/2010US7834446 Electronic device and method for coping with electrostatic discharge
11/16/2010US7834444 Heatplates for heatsink attachment for semiconductor chips
11/16/2010US7834443 Semiconductor device with molten metal preventing member
11/16/2010US7834442 Electronic package method and structure with cure-melt hierarchy
11/16/2010US7834441 Multilayer substrate and method of manufacturing the same
11/16/2010US7834440 Semiconductor device with stacked memory and processor LSIs
11/16/2010US7834439 Semiconductor module and method of manufacturing the same
11/16/2010US7834438 Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device
11/16/2010US7834437 Semiconductor package with passive elements
11/16/2010US7834436 Semiconductor chip package
11/16/2010US7834435 Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
11/16/2010US7834434 LED illumination system
11/16/2010US7834433 Semiconductor power device
11/16/2010US7834432 Chip package having asymmetric molding
11/16/2010US7834431 Leadframe for packaged electronic device with enhanced mold locking capability
11/16/2010US7834430 Drop-mold conformable material as an encapsulation for an integrated circuit package system
11/16/2010US7834429 Lead frame and method of manufacturing the same and semiconductor device
11/16/2010US7834428 Apparatus and method for reducing noise in mixed-signal circuits and digital circuits
11/16/2010US7834427 Integrated circuit having a semiconductor arrangement
11/16/2010US7834426 High-k dual dielectric stack
11/16/2010US7834417 Antifuse elements
11/16/2010US7834402 Semiconductor integrated circuit device
11/16/2010US7834401 Semiconductor device and fabrication method for the same
11/16/2010US7834400 Semiconductor structure for protecting an internal integrated circuit and method for manufacturing the same
11/16/2010US7834381 Layout of power source regions and power switch regions in a semiconductor integrated circuit device
11/16/2010US7834378 SCR controlled by the power bias
11/16/2010US7834351 Semiconductor device
11/16/2010US7834350 Semiconductor device with test pads and pad connection unit
11/16/2010US7834325 Radiation image information capturing apparatus and method of detecting temperature of amplifier thereof
11/16/2010US7834275 Secure electronic entity such as a passport
11/16/2010US7834273 Multilayer printed wiring board
11/16/2010US7834264 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
11/16/2010US7833910 Film substrate, fabrication method thereof, and image display substrate
11/16/2010US7833902 Semiconductor device and method of fabricating the same
11/16/2010US7833901 Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiO2 layer
11/16/2010US7833896 Aluminum cap for reducing scratch and wire-bond bridging of bond pads
11/16/2010US7833843 Method for forming a memory cell comprising a semiconductor junction diode crystallized adjacent to a silicide
11/16/2010US7833838 Method and apparatus for increasing the immunity of new generation microprocessors from ESD events
11/16/2010US7833836 Stack MCP and manufacturing method thereof
11/16/2010US7833835 Multi-layer fin wiring interposer fabrication process
11/16/2010US7833833 Method of manufacturing a semiconductor device
11/16/2010US7833830 3D interconnect with protruding contacts
11/16/2010US7833829 MEMS devices and methods of assembling micro electromechanical systems (MEMS)
11/16/2010US7833827 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base
11/16/2010US7833815 Microelectromechanical system package and the method for manufacturing the same
11/16/2010US7833810 Method of fabricating isolation structures for CMOS image sensor chip scale packages
11/16/2010US7833605 Vacuum heat insulator
11/16/2010US7832648 Semiconductor device and an information management system therefor
11/16/2010US7832092 Method of manufacturing a printed wiring board lead frame package
11/16/2010CA2534787C Boron nitride agglomerated powder
11/16/2010CA2398221C Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation
11/11/2010WO2010129908A1 Discontinuous thin semiconductor wafer surface features
11/11/2010WO2010129903A1 Panelized backside processing for thin semiconductors
11/11/2010WO2010129647A1 Thermally conductive foam product
11/11/2010WO2010129592A1 Packaging techniques and configurations
11/11/2010WO2010129484A1 Die exposed chip package
11/11/2010WO2010129423A2 Esd protection utilizing radiated thermal relief
11/11/2010WO2010129420A1 High strength photovoltaic module and array
11/11/2010WO2010129172A2 Dual interconnection in stacked memory and controller module
11/11/2010WO2010129091A2 Low thermal resistance and robust chip-scale-package (csp), structure and method
11/11/2010WO2010128688A1 Electroless palladium plating solution
11/11/2010WO2010128361A1 Semiconductor device for a high voltage application
11/11/2010WO2010128067A1 Heat exchange device with an increased heat exchange coefficient and method for manufacturing such a device
11/11/2010WO2010128017A1 Variable capacitance integrated electronic circuit module
11/11/2010WO2010127949A1 Miniature microwave component for surface-mounting
11/11/2010WO2010127709A1 A transition from a chip to a waveguide port
11/11/2010US20100285770 Wireless communication system
11/11/2010US20100284155 Power Semiconductor Module Including Substrates Spaced from Each Other
11/11/2010US20100283504 Method for fabrication of a semiconductor element and structure thereof
11/11/2010US20100283160 Panelized Backside Processing for Thin Semiconductors
11/11/2010US20100283159 Circuit Substrate and Method for Utilizing Packaging of the Circuit Substrate
11/11/2010US20100283158 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
11/11/2010US20100283157 Interconnect structures with patternable low-k dielectrics and method of fabricating same
11/11/2010US20100283156 Semiconductor device
11/11/2010US20100283155 Methods Of Forming A Plurality Of Conductive Lines In The Fabrication Of Integrated Circuitry, Methods Of Forming An Array Of Conductive Lines, And Integrated Circuitry
11/11/2010US20100283154 Sputtering target and semiconductor device manufactured using the same
11/11/2010US20100283153 Ohmic Contact Having Silver Material
11/11/2010US20100283152 Integrated circuits including ild structure, systems, and fabrication methods thereof
11/11/2010US20100283151 Techniques for packaging multiple device components
11/11/2010US20100283150 Semiconductor device
11/11/2010US20100283149 Structure and method of forming a pad structure having enhanced reliability
11/11/2010US20100283148 Bump Pad Structure
11/11/2010US20100283147 method for producing a plurality of chips and a chip produced accordingly
11/11/2010US20100283146 Semiconductor structure and method of fabricating the same
11/11/2010US20100283145 Stack structure with copper bumps
11/11/2010US20100283144 In-situ cavity circuit package
11/11/2010US20100283143 Die Exposed Chip Package
11/11/2010US20100283142 Mold lock on heat spreader
11/11/2010US20100283141 Semiconductor chip package
11/11/2010US20100283140 Package on package to prevent circuit pattern lift defect and method of fabricating the same
11/11/2010US20100283139 Semiconductor Device Package Having Chip With Conductive Layer
11/11/2010US20100283138 Nickel-Based Bonding of Semiconductor Wafers
11/11/2010US20100283137 Qfn semiconductor package
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