Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/17/2010CN201638802U Novel integrated circuit substrate
11/17/2010CN201638256U Radio frequency identification tag package
11/17/2010CN201630595U Desk capable of regulating temperature
11/17/2010CN1853272B Electronic package having a folded flexible substrate and method of manufacturing the same
11/17/2010CN1774159B 等离子体显示器面板组件 The plasma display panel assembly
11/17/2010CN101889485A Cooling device utilizing internal synthetic jets
11/17/2010CN101889391A Method for manufacturing package, package, electronic device, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock
11/17/2010CN101889358A High aperture ratio pixel layout for display device
11/17/2010CN101889344A Embedded package security tamper mesh
11/17/2010CN101889343A Hybrid microscale-nanoscale neuromorphic integrated circuit
11/17/2010CN101889342A Heat transfer composite, associated device and method
11/17/2010CN101889341A Interposer substrate and semiconductor device
11/17/2010CN101889333A Substrate and method for manufacturing the same
11/17/2010CN101889332A Substrate and method for manufacturing the same
11/17/2010CN101888765A Heat sink
11/17/2010CN101888764A Gas flow guiding cover and electronic device using same
11/17/2010CN101888743A Fixing device combination
11/17/2010CN101887935A Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
11/17/2010CN101887915A Power mosfet package
11/17/2010CN101887906A Image display system
11/17/2010CN101887905A Image display system and manufacturing method thereof
11/17/2010CN101887898A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array base plate and manufacturing method thereof
11/17/2010CN101887896A Semiconductor chip and method of repair design of the same
11/17/2010CN101887895A Power transistor chip internally provided with enhancement metal-oxide-semiconductor field effect transistor (MOSFET) and applying circuit thereof
11/17/2010CN101887894A Static discharge protective device
11/17/2010CN101887893A Film transistor array substrate and manufacturing method thereof
11/17/2010CN101887892A Pixel structure and display panel comprising same
11/17/2010CN101887891A Electronic apparatus, high-voltage power source and printed circuit board
11/17/2010CN101887889A LED integrated circuit module and LED display module
11/17/2010CN101887888A Power semiconductor module including substrates spaced from each other
11/17/2010CN101887887A 3d integration structure and method using bonded metal planes
11/17/2010CN101887886A Multi-die package and manufacturing method thereof
11/17/2010CN101887885A Stacking structure of semiconductor packages
11/17/2010CN101887884A Semiconductor device
11/17/2010CN101887883A MTM antifuse element structure and preparation method thereof
11/17/2010CN101887882A Integrated circuit layout structure and manufacturing method thereof
11/17/2010CN101887881A Interconnecting assembly, manufacture method and repairing method thereof
11/17/2010CN101887880A Multilayer printed wiring board
11/17/2010CN101887879A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887878A Photosensor package
11/17/2010CN101887877A Lead frame, semiconductor device and manufacturing method of the lead frame
11/17/2010CN101887876A Semiconductor package, lead frame, and wiring board with the same
11/17/2010CN101887875A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887874A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887873A Heat sink mounting structure and method
11/17/2010CN101887872A Radiating packaging structure of semiconductor chip
11/17/2010CN101887871A Chip packaging structure, chip packaging mould and chip packaging technology
11/17/2010CN101887870A Semiconductor chip package and quad flat non-pin package
11/17/2010CN101887869A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887860A Manufacturing method of electronic elements and encapsulation structures thereof
11/17/2010CN101887859A Method for forming through holes on base material and base material with through holes
11/17/2010CN101887853A Method for producing low-k film, semiconductor device, and method for manufacturing the same
11/17/2010CN101887194A Electrode equipment and detection method
11/17/2010CN101886802A Lamp
11/17/2010CN101886770A Efficient energy-saving and environment-friendly street lamp adopting surface mounted LED
11/17/2010CN101885851A Isocyanuric ring-containing terminal hydrogenpolysiloxane
11/17/2010CN101630677B High-frequency quick-recovery diode
11/17/2010CN101599454B Semiconductor element isolating structure and forming method thereof
11/17/2010CN101567322B Encapsulating structure and encapsulating method of chip
11/17/2010CN101521205B Memory array and method for manufacturing same
11/17/2010CN101499455B Power supply structure used for structural special application integrated circuit
11/17/2010CN101471300B Image sensor and method for manufacturing the sensor
11/17/2010CN101436580B Structure and method for measuring stack pair
11/17/2010CN101425530B Active matrix display device
11/17/2010CN101425493B Back end integrated wlcsp structure without aluminum pads
11/17/2010CN101404266B Thermoelectricity separated light emitting diode seat body and its cooling unit structure
11/17/2010CN101399169B Film-forming method, film-forming apparatus, storage medium, and semiconductor device
11/17/2010CN101364571B Semiconductor device and method for fabricating the same
11/17/2010CN101355845B Substrate with conductive projection and technique thereof
11/17/2010CN101336477B Chip stage integrated radio frequency passive device, manufacturing method thereof and system comprising the same
11/17/2010CN101330068B Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
11/17/2010CN101312164B Alxgayin1-x-yn substrate and cleaning method for the same, and AIN substrate and cleaning method for the same
11/17/2010CN101300675B Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed fingers
11/17/2010CN101271235B Liquid crystal display device and method of fabricating the same
11/17/2010CN101268559B Light-emitting device, method for manufacturing same, molded body and sealing member
11/17/2010CN101266952B Novel full-press high-power IGBT multi-mode rack porcelain tube shell
11/17/2010CN101266942B Semiconductor device and method for fabricating the same
11/17/2010CN101231968B Inlaying inner connecting line structure and double inlaying process
11/17/2010CN101097915B Electrostatic discharge protection method and device for semiconductor device
11/17/2010CN101064305B Semiconductor device and method for manufacturing the same
11/17/2010CN101060125B Film transistor array substrate and fabricating method thereof
11/16/2010USRE41927 TFT LCD device having multi-layered pixel electrodes
11/16/2010USRE41924 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
11/16/2010US7836420 Integrated circuit system with assist feature
11/16/2010US7835153 Heat sink mount for providing non-rigid support of overhanging portions of heat sink
11/16/2010US7835151 Flow distribution module and a stack of flow distribution modules
11/16/2010US7834540 Organic electroluminescence device and manufacturing method thereof
11/16/2010US7834470 Semiconductor device and programming method
11/16/2010US7834469 Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame
11/16/2010US7834468 Passivated nanoparticles, method of fabrication thereof, and devices incorporating nanoparticles
11/16/2010US7834467 Layer between interfaces of different components in semiconductor devices
11/16/2010US7834466 Semiconductor die with die pad pattern
11/16/2010US7834465 Semiconductor device, and manufacturing method of semiconductor device
11/16/2010US7834464 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
11/16/2010US7834462 Electric device, stack of electric devices, and method of manufacturing a stack of electric devices
11/16/2010US7834461 Semiconductor apparatus
11/16/2010US7834460 Method for manufacturing an electronic component and corresponding electronic component
11/16/2010US7834459 Semiconductor device and semiconductor device manufacturing method
11/16/2010US7834456 Electrical contacts for CMOS devices and III-V devices formed on a silicon substrate
11/16/2010US7834455 Semiconductor device
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