Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/18/2010WO2010131462A1 Solid-state image pickup element
11/18/2010WO2010131393A1 Wiring structure, wiring substrate, liquid crystal display panel, and method for manufacturing wiring structure
11/18/2010WO2010131391A1 Semiconductor device and electronic device provided with same
11/18/2010WO2010131317A1 Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device
11/18/2010WO2010131078A1 Integrated circuit and integrated circuit package
11/18/2010WO2010130597A1 Light emitting diode module and lighting unit comprising a light emitting diode module
11/18/2010WO2010130487A1 Sensor array for detecting pressure
11/18/2010WO2010098943A3 Antifuse
11/18/2010WO2010095826A3 Method for generating laser beam irradiation trajectory
11/18/2010WO2010090820A3 Ic package with capacitors disposed on an interposal layer
11/18/2010WO2010068490A8 Die-to-die power consumption optimization
11/18/2010US20100292555 Analyte Monitoring Device and Methods of Use
11/18/2010US20100292554 Analyte Monitoring Device and Methods of Use
11/18/2010US20100292553 Analyte Monitoring Device and Methods of Use
11/18/2010US20100292552 Analyte Monitoring Device and Methods of Use
11/18/2010US20100291735 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
11/18/2010US20100290303 Semiconductor device
11/18/2010US20100290202 Semiconductor package, lead frame, and wiring board with the same
11/18/2010US20100290201 Electronic component, manufacturing method for electronic component, and electronic device
11/18/2010US20100289524 Method for Fabrication of a Semiconductor Element and Structure Thereof
11/18/2010US20100289160 Lens support and wirebond protector
11/18/2010US20100289159 Semiconductor Die Collet and Method
11/18/2010US20100289158 Adhesive film, dicing die bonding film and semiconductor device using the same
11/18/2010US20100289157 Circuit board having bypass pad
11/18/2010US20100289155 Semiconductor package
11/18/2010US20100289154 Method and core materials for semiconductor packaging
11/18/2010US20100289153 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
11/18/2010US20100289152 Strip conductor structure for minimizing thermomechanocal loads
11/18/2010US20100289151 Semiconductor device
11/18/2010US20100289150 Semiconductor device, designing method for semiconductor device, computer-readable medium, and manufacturing method for semiconductor device
11/18/2010US20100289149 Semiconductor component and assumbly with projecting electrode
11/18/2010US20100289148 Semiconductor power module
11/18/2010US20100289147 Semiconductor die having a redistribution layer
11/18/2010US20100289146 Electronic System and Method for Manufacturing a Three-Dimensional Electronic System
11/18/2010US20100289145 Wafer chip scale package with center conductive mass
11/18/2010US20100289144 3d integration structure and method using bonded metal planes
11/18/2010US20100289143 METHOD FOR PRODUCING LOW-k FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME
11/18/2010US20100289142 Integrated circuit packaging system with coin bonded interconnects and method of manufacture thereof
11/18/2010US20100289141 Semiconductor device
11/18/2010US20100289140 Semiconductor package and manufacturing method of the semiconductor package
11/18/2010US20100289139 Hardwired switch of die stack and operating method of hardwired switch
11/18/2010US20100289138 Substrate structure for flip-chip interconnect device
11/18/2010US20100289137 Heat sink package
11/18/2010US20100289136 Semiconductor package
11/18/2010US20100289135 Semiconductor chip package
11/18/2010US20100289134 Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof
11/18/2010US20100289133 Stackable Package Having Embedded Interposer and Method for Making the Same
11/18/2010US20100289132 Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package
11/18/2010US20100289131 Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure
11/18/2010US20100289130 Method and Apparatus for Vertical Stacking of Integrated Circuit Chips
11/18/2010US20100289129 Copper plate bonding for high performance semiconductor packaging
11/18/2010US20100289128 Integrated circuit packaging system with leads and transposer and method of manufacture thereof
11/18/2010US20100289127 Semiconductor device
11/18/2010US20100289126 Semiconductor Device and Method of Forming a 3D Inductor from Prefabricated Pillar Frame
11/18/2010US20100289125 Enhanced electromigration performance of copper lines in metallization systems of semiconductor devices by surface alloying
11/18/2010US20100289124 Printable Semiconductor Structures and Related Methods of Making and Assembling
11/18/2010US20100289118 Semiconductor device
11/18/2010US20100289112 Method and apparatus of core timing prediction of core logic in the chip-level implementation process through an over-core window on a chip-level routing layer
11/18/2010US20100289111 System and Method for Designing Cell Rows
11/18/2010US20100289110 Semiconductor device
11/18/2010US20100289095 Semiconductor device
11/18/2010US20100289092 Power mosfet package
11/18/2010US20100289064 Method for fabrication of a semiconductor device and structure
11/18/2010US20100289055 Silicone leaded chip carrier
11/18/2010US20100289054 Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
11/18/2010US20100289021 Scribe line structure and method for dicing a wafer
11/18/2010US20100288632 Analyte Monitoring Device and Methods of Use
11/18/2010DE19630002B4 Elektronisches Wärmestrahlungsbauteil und Verfahren zum Herstellen eines Wärmestrahlungsbauteils Electronic component and heat radiation method for producing a heat radiation member
11/18/2010DE112009000140T5 Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat A method for reversibly attaching a device wafer on a carrier substrate
11/18/2010DE102010018579A1 Housing for integrated circuit, comprises semiconductor chip with one or multiple electric contacts, and z-axis interconnection with matrix of electrically conductive elements
11/18/2010DE102010015903A1 Ausrichtung eines rekonfigurierten Wafers Orientation of a reconfigured wafer
11/18/2010DE102010001215A1 Halbleitervorrichtung Semiconductor device
11/18/2010DE102009015718A1 Testsystem und Verfahren zum Verringern der Schäden in Saatschichten in Metallisierungssystem von Halbleiterbauelementen Test system and method for reducing the damage to seed layers in metallization of semiconductor components
11/18/2010DE102009012394A1 Housing component, particularly for optoelectronic components, has metallic element and non-metallic element, where the non-metallic element has session layer system on sub-range
11/18/2010DE102009002993A1 Leistungshalbleitermodul mit beabstandeten Schaltungsträgern Power semiconductor module having spaced circuit boards
11/18/2010DE102006043884B4 Halbleiterdrucksensor und Form zum Formen des Sensors A semiconductor pressure sensor and mold for molding of the sensor
11/18/2010DE102005042790B4 Integrierte Schaltungsanordnung und Verfahren zum Betrieb einer solchen Integrated circuit arrangement and method for operating such a
11/17/2010EP2251903A1 Heat sink mounting method
11/17/2010EP2251902A1 Structure for attaching component having heating body mounted thereon
11/17/2010EP2251369A1 One-pack type epoxy resin composition and use thereof
11/17/2010EP2250672A1 Semiconductor stack assembly having reduced thermal spreading resistance and methods of making same
11/17/2010EP2250671A1 Integrated circuit with mosfet fuse element
11/17/2010EP2250669A1 Through substrate annular via including plug filler
11/17/2010EP2250668A1 Metal housing part and method for producing the housing part
11/17/2010EP2250667A1 Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member
11/17/2010EP2250227A1 Self-filleting die attach paste
11/17/2010EP2250126A2 Doped tin tellurides for thermoelectric applications
11/17/2010EP1264341B1 Method of preventing bridging between polycrystalline micro-scale features
11/17/2010CN201639916U Mixed thin-channel cooler
11/17/2010CN201639912U Radiator for high temperature circuit
11/17/2010CN201639903U Radiating module
11/17/2010CN201639902U Support structure and heat dissipation device combination
11/17/2010CN201638810U Raised block structure of chip package
11/17/2010CN201638809U Wafer-level packaging structure
11/17/2010CN201638808U Multilayer metallization structure of composite material on back side of chip
11/17/2010CN201638807U Multilayer metallization structure on back side of chip
11/17/2010CN201638806U 散热器 Heat sink
11/17/2010CN201638805U Radiator fin set and radiator using the same
11/17/2010CN201638804U Stepless-adjustment power controller
11/17/2010CN201638803U Transistor-packaging structure
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