Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/24/2010CN101894817A Semiconductor module for stacking and stacked semiconductor module
11/24/2010CN101894816A Semiconductor device
11/24/2010CN101894815A Semiconductor device and method of manufacturing the same
11/24/2010CN101894814A Solder bump ubm structure
11/24/2010CN101894813A Semiconductor packaging structure and manufacture method thereof
11/24/2010CN101894812A Evaporator for cooling chip and manufacture method thereof
11/24/2010CN101894811A Quad flat package structure having exposed heat sink, electronic assembly and manufacturing methods thereof
11/24/2010CN101894810A Composite underfill, semiconductor package and its forming method
11/24/2010CN101894809A Stackable packaging structure with embedded connecting substrate and manufacturing method thereof
11/24/2010CN101894808A Electronic device and method of manufacturing the same
11/24/2010CN101894795A Integrated circuit system with hierarchical capacitor and method of manufacture thereof
11/24/2010CN101894793A Integrated circuit system with through silicon via and method of manufacture thereof
11/24/2010CN101894772A Method for enhancing reliability of chip welding spot, printed circuit board and electronic device
11/24/2010CN101894770A Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof
11/24/2010CN101894766A Method for manufacturing solder lug
11/24/2010CN101894764A Semiconductor structure and manufacture method thereof
11/24/2010CN101894762A Metal heat-conducting substrate and manufacturing method thereof
11/24/2010CN101894761A Substrate for open window type ball grid array package structure and manufacturing method thereof
11/24/2010CN101893799A Liquid crystal display panel and manufacturing method thereof
11/24/2010CN101893774A Liquid crystal display panel and manufacturing method thereof
11/24/2010CN101893170A Unitized LED illumination lamp
11/24/2010CN101317266B Bumpless flip-chip assembly with a compliant interposer contractor
11/24/2010CN101315899B Production method of label type integration circuit soft plate and structure thereof
11/24/2010CN101281900B Systematism package with structure for preventing ball pad from pollution as well as manufacturing method thereof
11/24/2010CN101257003B Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor device
11/24/2010CN101238556B Method and apparatus for producing porous silica
11/24/2010CN101170122B Non-volatile multi-bit memory device, its manufacture method and operation method
11/24/2010CN101132004B Semiconductor device and method for manufacturing same
11/24/2010CN101079441B Semiconductor device and its forming method
11/23/2010USRE41948 Semiconductor device having multi-layered wiring
11/23/2010US7840803 Authentication of integrated circuits
11/23/2010US7840732 Stacked card address assignment
11/23/2010US7839652 Semiconductor device and printed circuit board
11/23/2010US7839644 Fixing apparatus for heat sink
11/23/2010US7839643 Heat spreader for memory modules
11/23/2010US7839641 Condenser for power module and power module
11/23/2010US7839005 Light emitting diode with sealant having filling particles
11/23/2010US7839004 Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame
11/23/2010US7839003 Semiconductor device including a coupling conductor having a concave and convex
11/23/2010US7839002 Partially underfilled solder grid arrays
11/23/2010US7839001 Methods for making substrates and substrates formed therefrom
11/23/2010US7839000 Solder structures including barrier layers with nickel and/or copper
11/23/2010US7838998 Mounting substrate and semiconductor device
11/23/2010US7838996 Semiconductor device
11/23/2010US7838995 Semiconductor device having p-n column portion
11/23/2010US7838994 Semiconductor device and radiation detector employing it
11/23/2010US7838993 Semiconductor device
11/23/2010US7838992 Wafer level package having a stress relief spacer and manufacturing method thereof
11/23/2010US7838991 Metallurgy for copper plated wafers
11/23/2010US7838990 High-frequency hermetically-sealed circuit package
11/23/2010US7838989 Semiconductor component and apparatus for production of a semiconductor component
11/23/2010US7838988 Stud bumps as local heat sinks during transient power operations
11/23/2010US7838987 Electronic device, standoff member, and method of manufacturing electronic device
11/23/2010US7838986 Illumination device
11/23/2010US7838985 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
11/23/2010US7838984 Adhesive tape, connected structure and semiconductor package
11/23/2010US7838983 Packaged semiconductor device and method of manufacturing the packaged semiconductor device
11/23/2010US7838982 Semiconductor package having connecting bumps
11/23/2010US7838981 Component assembly
11/23/2010US7838980 TO263 device package having low moisture sensitivity
11/23/2010US7838979 Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same
11/23/2010US7838978 Semiconductor device
11/23/2010US7838977 Packages for electronic devices implemented with laminated board with a top and a bottom patterned metal layers
11/23/2010US7838976 Semiconductor device having a semiconductor chip enclosed by a body structure and a base
11/23/2010US7838975 Flip-chip package with fan-out WLCSP
11/23/2010US7838974 Intergrated circuit packaging with improved die bonding
11/23/2010US7838973 Semiconductor device
11/23/2010US7838972 Lead frame and method of manufacturing the same, and semiconductor device
11/23/2010US7838971 Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages
11/23/2010US7838968 Semiconductor device and method of fabricating same
11/23/2010US7838967 Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips
11/23/2010US7838966 Semiconductor devices including resistor elements comprising a bridge and base elements and related methods
11/23/2010US7838954 Semiconductor structure with solder bumps
11/23/2010US7838939 ESD protection element
11/23/2010US7838937 Circuits providing ESD protection to high voltage laterally diffused metal oxide semiconductor (LDMOS) transistors
11/23/2010US7838936 Semiconductor device and manufacturing method thereof, and liquid crystal display device
11/23/2010US7838924 MOS device with substrate potential elevation
11/23/2010US7838918 Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus
11/23/2010US7838892 Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip
11/23/2010US7838891 Light emitting device having a plurality of light emitting cells and package mounting the same
11/23/2010US7838881 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device
11/23/2010US7838878 Semiconductor-based sub-mounts for optoelectronic devices with conductive paths to facilitate testing and binning
11/23/2010US7838873 Structure for stochastic integrated circuit personalization
11/23/2010US7838417 Semiconductor package with a chip on a support plate
11/23/2010US7838395 Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same
11/23/2010US7838386 Method and system for patterning alignment marks on a transparent substrate
11/23/2010US7838349 Semiconductor device and method of manufacturing the same
11/23/2010US7838310 Tunable alignment geometry
11/23/2010US7838101 Ribbon bonding tool and process
11/23/2010US7836943 Normal-flow heat exchanger
11/23/2010US7836706 Thermal management system for evaporative spray cooling
11/23/2010CA2592266C Method of bonding substrates
11/18/2010WO2010132745A1 Power semiconductor heatsinking
11/18/2010WO2010132724A1 System-in packages
11/18/2010WO2010132582A1 High performance rf rx module
11/18/2010WO2010132277A1 Enhanced electromigration performance of copper lines in metallization systems of semiconductor devices by surface alloying
11/18/2010WO2010131828A1 Coupling press apparatus
11/18/2010WO2010131706A1 Semiconductor device
11/18/2010WO2010131659A1 Cover glass for a solid-state imaging element package
11/18/2010WO2010131529A1 Circuit board and method for manufacturing same
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