Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/14/2014US8859417 Gate electrode(s) and contact structure(s), and methods of fabrication thereof
10/14/2014US8859415 Method of forming wiring of a semiconductor device
10/14/2014US8859414 Electronic assemblies including mechanically secured protruding bonding conductor joints
10/14/2014US8859400 Gallium nitride devices with conductive regions
10/14/2014US8859395 Techniques for curvature control in power transistor devices
10/14/2014US8859392 Manufacturing method of power semiconductor
10/14/2014US8859390 Structure and method for making crack stop for 3D integrated circuits
10/14/2014US8859362 Integrated circuit fabrication
10/14/2014US8859347 Semiconductor-on-insulator with back side body connection
10/14/2014US8859340 Molded interposer package and method for fabricating the same
10/14/2014US8859338 Method of manufacturing a semiconductor device and semiconductor device
10/14/2014US8859337 Thermal matching in semiconductor devices using heat distribution structures
10/14/2014US8859336 Method of packaging semiconductor die with cap element
10/14/2014US8859334 Electronic device manufacturing method and chip assembly
10/14/2014US8859333 Integrated circuit package and a method for dissipating heat in an integrated circuit package
10/14/2014US8859307 Semiconductor device and method for manufacturing same
10/14/2014US8859300 On chip inductor with frequency dependent inductance
10/14/2014US8859103 Glass wafers for semiconductor fabrication processes and methods of making same
10/14/2014US8858865 Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module
10/14/2014US8858700 Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
10/14/2014US8857714 Ballistic sight system
10/14/2014US8857050 Methods of making an environment protection coating system
10/14/2014US8857047 Thin foil semiconductor package
10/14/2014US8857022 Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors
10/09/2014WO2014165245A1 Porous alumina templates for electronic packages
10/09/2014WO2014164915A1 Metal-insulator-metal (mim) capacitor
10/09/2014WO2014164433A1 Floating high vacuum seal cartridge
10/09/2014WO2014164402A1 Copper pillar attach substrate
10/09/2014WO2014164186A1 Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
10/09/2014WO2014163687A1 Stacked memory package, method of manufacturing thereof and pinout designs of ic package substrate
10/09/2014WO2014163442A1 Curable composition
10/09/2014WO2014163441A1 Curable composition
10/09/2014WO2014163440A1 Curable composition
10/09/2014WO2014163439A1 Curable composition
10/09/2014WO2014163438A1 Curable composition
10/09/2014WO2014163122A1 Curable resin composition for coating/protecting materials for light-emitting semiconductors
10/09/2014WO2014162973A1 Underfill film, sealing sheet, production method for semiconductor device, and semiconductor device
10/09/2014WO2014162951A1 Semiconductor device manufacturing method
10/09/2014WO2014161715A1 Device and method for welding by means of ultrasound
10/09/2014WO2014161222A1 Junction box of photovoltaic power generation assembly
10/09/2014US20140302669 Pillar Structure having a Non-Planar Surface for Semiconductor Devices
10/09/2014US20140302643 Connection device, method for manufacturing connection structure, method for manufacturing stacked chip component and method for mounting electronic component
10/09/2014US20140302641 Stiffened semiconductor die package
10/09/2014US20140302623 Optical devices and methods of fabricating the same
10/09/2014US20140302317 Bonding wire for high-speed signal line
10/09/2014US20140301058 Wiring substrate and semiconductor device
10/09/2014US20140301056 Method and System for Optimizing Routing Layers and Board Space Requirements for a Ball Grid Array Land Pattern
10/09/2014US20140301055 Printed circuit board including through region and semiconductor package formed by using the same
10/09/2014US20140301050 Substrate assembly, method of manufacturing substrate assembly and method of manufacturing chip package
10/09/2014US20140300849 Chip-on-film package and device assembly including the same
10/09/2014US20140300410 Cascoded semiconductor devices
10/09/2014US20140300009 Package structure and method for manufacturing same
10/09/2014US20140300008 Wafer scale technique for interconnecting vertically stacked dies
10/09/2014US20140300007 Semiconductor apparatus
10/09/2014US20140300006 Conductive structures, systems and devices including conductive structures and related methods
10/09/2014US20140300005 Multilevel interconnect structures and methods of fabricating same
10/09/2014US20140300004 Semiconductor packages and methods of fabricating the same
10/09/2014US20140300003 Semiconductor device and interconnect substrate
10/09/2014US20140300002 Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation
10/09/2014US20140300001 Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board
10/09/2014US20140300000 Semiconductor Device and Method
10/09/2014US20140299999 Integrated circuit package assemblies including a glass solder mask layer
10/09/2014US20140299998 Method for making contact with a semiconductor and contact arrangement for a semiconductor
10/09/2014US20140299997 Spacer process for on pitch contacts and related structures
10/09/2014US20140299996 Semiconductor device having groove-shaped via-hole
10/09/2014US20140299995 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
10/09/2014US20140299994 Semiconductor device having groove-shaped via-hole
10/09/2014US20140299993 Semiconductor device having groove-shaped via-hole
10/09/2014US20140299992 Filling cavities in semiconductor structures having adhesion promoting layer in the cavities
10/09/2014US20140299991 Display device and manufacturing method thereof
10/09/2014US20140299990 Semiconductor device
10/09/2014US20140299989 Semiconductor device with air gap and method for fabricating the same
10/09/2014US20140299988 Self-forming embedded diffusion barriers
10/09/2014US20140299987 Semiconductor device having groove-shaped via-hole
10/09/2014US20140299986 Semiconductor device manufacturing method and semiconductor device
10/09/2014US20140299985 Bump structures for multi-chip packaging
10/09/2014US20140299984 Chip and manufacturing method thereof
10/09/2014US20140299983 Joint structure and semiconductor device storage package
10/09/2014US20140299982 Semiconductor device and method of manufacturing the same
10/09/2014US20140299981 High Power Single-Die Semiconductor Package
10/09/2014US20140299980 Semiconductor packages including a heat spreader and methods of forming the same
10/09/2014US20140299979 Semiconductor device and a method for manufacturing a semiconductor device
10/09/2014US20140299978 Quad flat non-lead package
10/09/2014US20140299977 Semiconductor Device
10/09/2014US20140299976 Semiconductor package and manufacturing method thereof
10/09/2014US20140299972 Semiconductor device having a through contact
10/09/2014US20140299970 Semiconductor integrated circuit device
10/09/2014US20140299966 Hermetic packaging of integrated circuit components
10/09/2014US20140299963 Interposer device
10/09/2014US20140299960 Semiconductor device having groove-shaped via-hole
10/09/2014US20140299926 Semiconductor Device and Method for Manufacturing the Same
10/09/2014US20140299911 Method for Producing Optoelectronic Semiconductor Components, Lead Frame Composite, and Optoelectronic Semiconductor Component
10/09/2014US20140299887 Semiconductor devices comprising getter layers and methods of making and using the same
10/09/2014US20140299878 Semiconductor device and stacked semiconductor device
10/09/2014DE112013000693T5 Halbleiterelement-Temperatur-Erfassungssystem und Halbleitermodul und Halbleitermodul-System Semiconductor element-temperature detecting system and the semiconductor module and the semiconductor module system
10/09/2014DE112011106030T5 Selbstreparaturlogik für eine Stapelspeicherarchitektur Auto repair logic for a stack architecture
10/09/2014DE102014105013A1 Übertragen und Empfangen digitaler und analoger Signale über einen Isolator hinweg Transmitting and receiving digital and analog signals via an insulator away
10/09/2014DE102014104989A1 Integrierte Schaltungs-Gehäusebaugruppen, die eine Glas-Lötstoppmaskenschicht enthalten Integrated circuit package assemblies, which contain a glass-solder resist layer,
10/09/2014DE102014104630A1 Hochleistungs-Einzelchip-Halbleiter-Package High-performance single-chip semiconductor package
10/09/2014DE102014104378A1 Halbleitergehäuse und verfahren zu dessen herstellung Semiconductor package and method for its production
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