Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/25/2010US20100295139 mems package
11/25/2010US20100295097 Field-effect transistor
11/25/2010US20100295094 ESD Protection Apparatus and Electrical Circuit Including Same
11/25/2010US20100295066 Semiconductor substrate and methods for the production thereof
11/25/2010US20100295045 Tape carrier package, individual tape carrier package product, and method of manufacturing the same
11/25/2010US20100295044 Semiconductor device and method of manufacturing the same
11/25/2010US20100295043 Semiconductor device
11/25/2010US20100295034 Semiconductor device
11/25/2010US20100294358 Semiconductor package
11/25/2010DE202010012201U1 Kühlkörper mit integriertem Lüfter Heat sink with integrated fan
11/25/2010DE10222306B4 Schutzstruktur gegen elektrostatische Entladungen Protection structure against electrostatic discharges
11/25/2010DE102010016798A1 Halbleiterchip-Package A semiconductor chip package
11/25/2010DE102010016726A1 Halbleiter-Bauelement Semiconductor component
11/25/2010DE102010016696A1 Halbleiter-Bauelement Semiconductor component
11/25/2010DE102010001668A1 Leistungstransistorbaugruppe mit integrierter Sammelschiene Power transistor module with integrated busbar
11/25/2010DE102010000093A1 Halbleitervorrichtung mit einzelnem Schaltungselement A semiconductor device with single circuit element
11/25/2010DE102009022255A1 Leuchtdiode mit Kühlkörper LED with heatsink
11/25/2010DE102009003294A1 Control device for controlling hydraulic transmission of motor vehicle, has spring elastic elements arranged between base plate and bearing surface of heat sink, and formed of contact surfaces or metallic contact points
11/25/2010DE102007028791B4 Thermoelektrische Umwandlungsvorrichtung und Herstellungsverfahren dafür Thermoelectric conversion device and manufacturing method thereof
11/25/2010DE102007019885B4 Kühlkörper mit matrixförmig strukturierter Oberfläche Heatsink with matrix-patterned surface
11/25/2010DE102006046986B4 Haltekomponente mit integrierter Erdung für ein Kühlkörper-Modul Support component with integrated grounding for a heat sink module
11/25/2010DE102005044124B4 Verfahren zur Herstellung einer integrierten Schaltung mit Gate-Selbstschutz, und integrierte Schaltung mit Gate-Selbstschutz A method of fabricating an integrated circuit with self-protection gate, and an integrated circuit with gate self-protection
11/24/2010EP2254152A2 Solid state switch arrangement
11/24/2010EP2254150A1 Method and system for chip to chip communication utilizing selectable directional antennas
11/24/2010EP2253919A2 High Performance Heat Transfer Device, Methods Of Manufacture Thereof And Articles Comprising The Same
11/24/2010EP2253918A2 Enclosure For Heat Transfer Devices, Methods Of Manufacture Thereof And Articles Comprising The Same
11/24/2010EP2253671A1 Silicone Resin Composition for Optical Semiconductor Devices and an Optical Semiconductor Device
11/24/2010EP2253045A1 Radio frequency (rf) integrated circuit (ic) packages with integrated aperture-coupled patch antenna(s)
11/24/2010EP2252641A1 Curable reaction resin system
11/24/2010EP2252640A1 Modified reaction resin
11/24/2010EP1726165B1 Video processor alignment clamping spring
11/24/2010EP1664652B1 System for configuring the geometric parameters for a micro channel heat exchanger
11/24/2010EP1570519B1 Method of cutting semiconductor wafer and use of a protective sheet for that cutting method
11/24/2010EP1569503B1 Method for supplying solder
11/24/2010EP1535315B1 Glass-type planar substrate, use thereof, and method for the production thereof
11/24/2010EP1285261B1 Field effect transistor device for ultra-fast nucleic acid sequencing
11/24/2010CN201656940U Thyristor switch with high heat radiation efficiency
11/24/2010CN201656793U Rectifying device TO-220 frame
11/24/2010CN201655810U Miniature surface mount diode
11/24/2010CN201655806U Radio-frequency laterally diffused metal oxide semiconductor field-effect transistor
11/24/2010CN201655805U Half bridge drive circuit chip
11/24/2010CN201655801U Novel power semiconductor
11/24/2010CN201655799U Thin type bridge rectifier with pin structure
11/24/2010CN201655795U Thin bridge rectifier applied for circuit boards
11/24/2010CN201655793U Flexible circuit board
11/24/2010CN201655792U Small-power field effect transistor packaging structure
11/24/2010CN201655791U Non-pin integrated circuit component with high-density contacts
11/24/2010CN201655790U Copper-aluminum wire hybrid-bonded semiconductor chip package
11/24/2010CN201655789U Integrated circuit with layout structure
11/24/2010CN201655788U Through hole structure with insulating layer
11/24/2010CN201655787U Semiconductor encapsulation structure
11/24/2010CN201655786U Water-cooling radiator for high-power thyristor
11/24/2010CN201655785U Micro-channel heat sink for electronic packaging device
11/24/2010CN201655784U Combined radiator stand of large-power semiconductor device
11/24/2010CN201655783U Heat dissipating body with radial-type fin groups and heat dissipating device with same
11/24/2010CN201655782U Surface-mounted radiator
11/24/2010CN201655781U Silicone epitaxial planar triode
11/24/2010CN201655780U Chip card mould board
11/24/2010CN201655779U Cascaded encapsulating piece and dual-interface intelligent card therewith
11/24/2010CN201654822U COB soft substrate module and RFID tag employing same
11/24/2010CN201654662U Cpu radiator
11/24/2010CN201654651U Fixing device assembly of radiator
11/24/2010CN1934190B Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices
11/24/2010CN1645597B Semiconductor device and method of manufacturing same
11/24/2010CN101897083A Anisotropic conductive joint package
11/24/2010CN101897021A Semiconductor switching device with gate connection
11/24/2010CN101897020A Cooling body of at least one electrical component
11/24/2010CN101897019A Fixing clamp
11/24/2010CN101897018A Semiconductor device and method for manufacturing the same
11/24/2010CN101897013A An interconnect structure and a method of fabricating the same
11/24/2010CN101897011A Cooling fin and manufacturing method of the cooling fin
11/24/2010CN101896549A Photosemiconductor package sealing resin material
11/24/2010CN101896529A Solid power formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards
11/24/2010CN101896054A Radiating device
11/24/2010CN101896053A Heat radiating module
11/24/2010CN101896052A Heat radiating module
11/24/2010CN101896051A Double-fan heat radiation module and electronic device using same
11/24/2010CN101896050A Thermal power electronic device, method for cooling electronic device, and light-emitting diode
11/24/2010CN101896049A Heat radiating module and production method thereof
11/24/2010CN101894868A Gallium nitride semiconductor device with improved forward conduction
11/24/2010CN101894861A Semiconductor device
11/24/2010CN101894860A Electroluminescent display panel and pixel structure thereof
11/24/2010CN101894857A Organic light emitting device
11/24/2010CN101894856A Organic light-emitting diode (OLED) display screen
11/24/2010CN101894845A TFT (Thin Film Transistor) array structure and manufacturing method thereof
11/24/2010CN101894838A Integrated inductor
11/24/2010CN101894834A Bridge drive circuit chip
11/24/2010CN101894830A Stack type package structure and manufacturing method thereof
11/24/2010CN101894829A Stacked encapsulating structure
11/24/2010CN101894828A Silicon wafer with testing weld pad and testing method thereof
11/24/2010CN101894827A Test wafer for gluing and edge cleaning detection
11/24/2010CN101894826A Circuit connection device
11/24/2010CN101894825A 半导体封装 The semiconductor package
11/24/2010CN101894824A Bearing structure of electronic component and preparation method thereof
11/24/2010CN101894823A Composite material structure, circuit board structure comprising same and forming method thereof
11/24/2010CN101894822A Lead frame band construction for semiconductor packaging
11/24/2010CN101894821A Conductor structure for packaging and routing semiconductor and combination structure thereof
11/24/2010CN101894820A Wafer packaging structure and production method thereof
11/24/2010CN101894819A Substrate structure
11/24/2010CN101894818A Reliable contact
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