Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2010
11/30/2010US7843054 Chip package and manufacturing method thereof
11/30/2010US7843053 Stack package made of chip scale packages
11/30/2010US7843052 Semiconductor devices and fabrication methods thereof
11/30/2010US7843051 Semiconductor package and method of fabricating the same
11/30/2010US7843050 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
11/30/2010US7843049 Semiconductor device and manufacturing method thereof
11/30/2010US7843048 Multi-chip discrete devices in semiconductor packages
11/30/2010US7843047 Encapsulant interposer system with integrated passive devices and manufacturing method therefor
11/30/2010US7843046 Flat leadless packages and stacked leadless package assemblies
11/30/2010US7843045 capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids; reaction of 1,3-bis(3-aminophenoxy)benzene, for example, and an acid component
11/30/2010US7843044 Semiconductor device
11/30/2010US7843043 Structure of a lead-frame matrix of photoelectron devices
11/30/2010US7843042 Wafer level integration package
11/30/2010US7843041 Thin-film circuit device having a low strength region, method for manufacturing the thin-film circuit device, and electronic apparatus
11/30/2010US7843033 Shielded integrated circuit pad structure
11/30/2010US7843023 Electromechanical switch
11/30/2010US7843014 Small size transistor semiconductor device capable of withstanding high voltage
11/30/2010US7843010 Crystalline semiconductor film and method for manufacturing the same
11/30/2010US7843008 Semiconductor device
11/30/2010US7842969 Low clamp voltage ESD device and method therefor
11/30/2010US7842959 Light emitting device having a plurality of light emitting cells and package mounting the same
11/30/2010US7842949 IC with comparator receiving expected and mask data from pads
11/30/2010US7842948 Flip chip semiconductor die internal signal access system and method
11/30/2010US7842933 System and method for measuring overlay errors
11/30/2010US7842891 Sealing board and method for producing the same
11/30/2010US7842889 base material, metallization layers formed on base material, and Sn solder portion formed on part of surface of metallization layers, wherein the electronic part further comprises Ag film formed on surface of Sn solder portion and Au film formed on Ag film; oxidation resistance
11/30/2010US7842887 Multilayer printed circuit board
11/30/2010US7842604 Low-k b-doped SiC copper diffusion barrier films
11/30/2010US7842602 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
11/30/2010US7842598 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
11/30/2010US7842563 Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor
11/30/2010US7842555 Integrated transistor module and method of fabricating same
11/30/2010US7842553 Cooling micro-channels
11/30/2010US7842552 Semiconductor chip packages having reduced stress
11/30/2010US7842546 Integrated circuit module and method of packaging same
11/30/2010US7842540 Room temperature metal direct bonding
11/30/2010US7842525 Method and apparatus for personalization of semiconductor
11/30/2010US7842385 Coated nano particle and electronic device using the same
11/30/2010US7842381 Thermally conductive EMI shield
11/30/2010US7842356 Substrate processing methods
11/30/2010US7841863 Spring interconnect structures
11/30/2010US7841862 Dielectric sheet
11/30/2010US7841843 Valveless micro air delivery device
11/30/2010US7841387 Pump-free water-cooling system
11/30/2010US7841078 Method of optimizing land grid array geometry
11/29/2010CA2704870A1 Heatsink and method of fabricating same
11/25/2010WO2010134511A1 Semiconductor device and method for manufacturing semiconductor device
11/25/2010WO2010134371A1 Electronic component element
11/25/2010WO2010134306A1 Electronic component mounting method and electronic component mounting structure
11/25/2010WO2010134234A1 Method of producing flexible semiconductor device
11/25/2010WO2010134231A1 Semiconductor device and method for manufacturing same
11/25/2010WO2010134230A1 Semiconductor device and method for manufacturing same
11/25/2010WO2010134180A1 Method for bonding high heat conductive insulating resin
11/25/2010WO2010134160A1 Heat exchanger and method of manufacturing the same
11/25/2010WO2010133935A1 A method of implanting electronics in objects
11/25/2010WO2010133767A1 Manufacturing method and electronic module with new routing possibilites
11/25/2010WO2010133195A1 Device for the flexible protection of structural elements from environmental influences
11/25/2010WO2010133189A1 Materials comprising carbon nanoparticles and the use thereof
11/25/2010WO2010133136A1 Integrated circuit
11/25/2010WO2010104274A3 Lead frame and method for manufacturing the same
11/25/2010US20100298682 Analyte Monitoring Device and Methods of Use
11/25/2010US20100298681 Analyte Monitoring Device and Methods of Use
11/25/2010US20100297857 Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector
11/25/2010US20100297841 Method for providing a redistribution metal layer in an integrated circuit
11/25/2010US20100297814 Electronic system modules and method of fabrication
11/25/2010US20100296946 Pressure sensing device for electronic device and pressure sensing method and thermal dissipation device thereof
11/25/2010US20100295649 Integrated transformer
11/25/2010US20100295421 Electronic component, electronic apparatus, and base member manufacturing method
11/25/2010US20100295191 Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device
11/25/2010US20100295190 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device
11/25/2010US20100295189 Method for repairing chip and stacked structure of chips
11/25/2010US20100295188 Semiconductor device having deep contact structure and method of manufacturing the same
11/25/2010US20100295187 Semiconductor device and method for fabricating the same
11/25/2010US20100295186 Semiconductor module for stacking and stacked semiconductor module
11/25/2010US20100295185 Nonvolatile Memory Device and Method of Manufacturing the Same
11/25/2010US20100295184 Method Of Manufacturing Semiconductor Device Including Wiring Layout And Semiconductor Device
11/25/2010US20100295183 Method for providing electrical connections to spaced conductive lines
11/25/2010US20100295182 Semiconductor device and method for manufacturing the same
11/25/2010US20100295181 Redundant metal barrier structure for interconnect applications
11/25/2010US20100295180 Wire bonding structure and manufacturing method thereof
11/25/2010US20100295179 Bga semiconductor device having a dummy bump
11/25/2010US20100295178 Semiconductor chip package and manufacturing method thereof
11/25/2010US20100295177 Electronic component mounting structure, electronic component mounting method, and electronic component mounting board
11/25/2010US20100295176 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
11/25/2010US20100295175 Wafer level chip scale package
11/25/2010US20100295174 Wiring substrate and semiconductor device
11/25/2010US20100295173 Composite Underfill and Semiconductor Package
11/25/2010US20100295172 Power semiconductor module
11/25/2010US20100295171 Electronic device and method
11/25/2010US20100295170 Semiconductor device
11/25/2010US20100295169 Semiconductor substrate and method of connecting semiconductor die to substrate
11/25/2010US20100295168 Semiconductor package using conductive plug to replace solder ball
11/25/2010US20100295167 Semiconductor device and method of forming the same
11/25/2010US20100295166 Semiconductor package
11/25/2010US20100295165 Stress-engineered interconnect packages with activator-assisted molds
11/25/2010US20100295164 Airgap micro-spring interconnect with bonded underfill seal
11/25/2010US20100295162 Semiconductor device
11/25/2010US20100295161 Method for Semiconductor Leadframes in Low Volume and Rapid Turnaround
11/25/2010US20100295160 Quad flat package structure having exposed heat sink, electronic assembly and manufacturing methods thereof
11/25/2010US20100295155 Techniques for capacitively coupling signals with an integrated circuit
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