Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/01/2010CN1921092B Semiconductor device, lead frame and electronic equipment using the semiconductor device
12/01/2010CN1664686B Thin film transistor arraying panel and its manufacture method
12/01/2010CN101904004A Wafer level chip scale package and process of manufacture
12/01/2010CN101904003A Electronic assembly manufacturing method
12/01/2010CN101904002A Package-on-package secure module having BGA mesh cap
12/01/2010CN101904001A Corrugated-fin type radiator
12/01/2010CN101904000A Power circuit
12/01/2010CN101903999A Method of coating fine wires and curable composition therefor
12/01/2010CN101903974A Method for manufacturing thin film multilayer device, method for manufacturing display device, and thin film multilayer device
12/01/2010CN101903437A Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device
12/01/2010CN101902899A Electromagnetic wave suppression sheet, device, and electronic apparatus
12/01/2010CN101902895A Cooling system
12/01/2010CN101902892A Heat radiator fixing device
12/01/2010CN101902141A Power module assembly
12/01/2010CN101901831A SCR ESD protection structure with high maintaining voltage
12/01/2010CN101901824A Organic electro-luminescence display device and method for fabricating the same
12/01/2010CN101901823A Integrated circuit structure and method for forming the same
12/01/2010CN101901814A Thin film device, flexible circuit board including thin film device, and method for manufacturing thin film device
12/01/2010CN101901801A Semiconductor chip and semiconductor device including the same
12/01/2010CN101901799A Integrated circuit packaging structure and packaging method
12/01/2010CN101901798A Semiconductor device and manufacturing method of the same
12/01/2010CN101901797A Power electronics power module with imbedded gate circuitry
12/01/2010CN101901796A Tape carrier package, individual tape carrier package product, and method of manufacturing the same
12/01/2010CN101901795A 功率半导体模块 Power semiconductor module
12/01/2010CN101901794A Plastic lead frame structure with reflective and conductor metal layer and preparation method thereof
12/01/2010CN101901793A Aluminum bond pads with enhanced wire bond stability
12/01/2010CN101901792A Contact device for a power semiconductor module
12/01/2010CN101901791A Die set for multi-packaging assembly and method for making the die set and the multi- packaging assembly
12/01/2010CN101901790A Flat thin type heat pipe
12/01/2010CN101901789A Internal insulation type plastic semiconductor element and preparation method thereof
12/01/2010CN101901788A Resin sealing type semiconductor device, and manufacturing method thereof
12/01/2010CN101901772A Method of manufacturing electronic device and electronic device
12/01/2010CN101901769A Micro-blasting treatment for lead frames
12/01/2010CN101901751A Semiconductor component and method of manufacture
12/01/2010CN101901750A Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
12/01/2010CN101901638A Stacked busbar assembly with integrated cooling device
12/01/2010CN101901568A 显示装置 The display device
12/01/2010CN101900916A Pixel structure, driving circuit and driving method of display device
12/01/2010CN101900501A Novel heat pipe radiator
12/01/2010CN101900258A LED (Light-Emitting Diode) light and polygonal heat sink structure thereof
12/01/2010CN101900254A Heat radiating LED lamp
12/01/2010CN101899289A Wave-absorbing heat dissipation material
12/01/2010CN101899288A 热界面材料及其制备方法 Thermal interface material and method
12/01/2010CN101899195A Dam composition and method for fabrication of multilayer semiconductor device
12/01/2010CN101562140B Packaging method of improving antistatic capability of integrated circuit chip
12/01/2010CN101556417B FFS type TFT-LCD array substrate structure and manufacture method thereof
12/01/2010CN101552245B Crystal coated packing procedure
12/01/2010CN101521188B Lead frame structure and surface sticking semiconductor packaging structure formed by same
12/01/2010CN101501840B Chip attack protection
12/01/2010CN101471373B Image sensor and method for manufacturing the sensor
12/01/2010CN101465332B Semiconductor chip, method of fabricating the same and semiconductor chip stack package
12/01/2010CN101457915B LED lamp
12/01/2010CN101447438B Manufacturing method of semiconductor device
12/01/2010CN101409288B Semiconductor device with contact stabilization and method for manufacturing the same
12/01/2010CN101404275B Circuit device
12/01/2010CN101378023B 半导体封装件及其制法 The semiconductor package Jiqizhifa
12/01/2010CN101359671B Active array substrate, liquid crystal display board and method for manufacturing liquid crystal display board
12/01/2010CN101356638B Semiconductor device and method for manufacturing semiconductor device
12/01/2010CN101335225B Metal pad formation method and metal pad structure using the same
12/01/2010CN101312161B Electronic structure and manufacturing method
12/01/2010CN101295692B 半导体装置 Semiconductor device
12/01/2010CN101276803B Semiconductor chip
12/01/2010CN101268596B Temperature protection circuit, power supply, and electronic device
12/01/2010CN101241913B CMOS device, semiconductor device and a method of fabricating the device
12/01/2010CN101241866B Making method of protrusion block structure with reinforced object
12/01/2010CN101236958B Semiconductor package
12/01/2010CN101226929B Semiconductor package structure and manufacturing method thereof
12/01/2010CN101226921B Substrate capable of detecting connection point thickness and detecting method thereof
12/01/2010CN101202287B Array substrate, method of manufacturing the same, and method of repairing line in the same
12/01/2010CN101193531B Heat radiator
12/01/2010CN101183671B Image sensor and its manufacture method, and dark pixel interconnect patterns
12/01/2010CN101179914B Method and apparatus for fixing heat exchanger
12/01/2010CN101179102B LED lamp and producing process
12/01/2010CN101163386B Heat radiating method and heat radiator using the method and electronic device thereof
12/01/2010CN101154668B Substrate for display device, its manufacturing method and display device
12/01/2010CN101154601B Semiconductor device and manufacturing method thereof
12/01/2010CN101131983B Connector and light transmitting receiving module
12/01/2010CN101110419B Integrated circuit structure with metallic programmable sheet metal used for generating identification data and manufacturing method thereof
12/01/2010CN101048863B 电子部件模块以及无线通信设备 Electronics module and a wireless communication device
12/01/2010CN101034698B Overlay accuracy measurement vernier and method of forming the same
11/2010
11/30/2010USRE41975 Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same
11/30/2010US7843700 Semiconductor device
11/30/2010US7843695 Apparatus and method for thermal management using vapor chamber
11/30/2010US7843693 Method and system for removing heat
11/30/2010US7843292 Coil for producing a magnetic field
11/30/2010US7843074 Underfill for light emitting device
11/30/2010US7843073 Semiconductor device and method for fabricating the same
11/30/2010US7843072 Semiconductor package having through holes
11/30/2010US7843069 Wire bond pads
11/30/2010US7843067 Method and structure of integrated rhodium contacts with copper interconnects
11/30/2010US7843066 Semiconductor device
11/30/2010US7843065 Flash memory device and fabricating method thereof
11/30/2010US7843064 Structure and process for the formation of TSVs
11/30/2010US7843063 incorporation of cobalt into a copper interconnect structure in order to modify the microstructure to achieve bamboo-style grain boundaries in sub-90 nm technologies
11/30/2010US7843062 Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature
11/30/2010US7843059 Electronic parts packaging structure
11/30/2010US7843058 Flip chip packages with spacers separating heat sinks and substrates
11/30/2010US7843057 Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
11/30/2010US7843056 Integrated circuit micro-module
11/30/2010US7843055 Semiconductor device having an adhesion promoting layer and method for producing it
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