Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/02/2010US20100301489 Microstructure device including a metallization structure with self-aligned air gaps formed based on a sacrificial material
12/02/2010US20100301488 Semiconductor device
12/02/2010US20100301487 Improvements in or relating to integrated circuit reliability
12/02/2010US20100301486 High-aspect ratio contact element with superior shape in a semiconductor device for improving liner deposition
12/02/2010US20100301485 Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
12/02/2010US20100301484 Lga substrate and method of making same
12/02/2010US20100301483 Light-blocking layer sequence having one or more metal layers for an integrated circuit and method for the production of the layer sequence
12/02/2010US20100301482 Sram bit cell with self-aligned bidirectional local interconnects
12/02/2010US20100301481 Joint structure and electronic component
12/02/2010US20100301480 Semiconductor device having a conductive structure
12/02/2010US20100301479 Devices containing silver compositions deposited by micro-deposition direct writing silver conductor lines
12/02/2010US20100301478 Substrate Having a Coating Comprising Copper and Method for the Production Thereof by Means of Atomic Layer Deposition
12/02/2010US20100301477 Silicon-Based Thin Substrate and Packaging Schemes
12/02/2010US20100301476 Stacked package and method for forming stacked package
12/02/2010US20100301475 Forming Semiconductor Chip Connections
12/02/2010US20100301474 Semiconductor Device Package Structure and Method for the Same
12/02/2010US20100301473 Component built-in wiring board and manufacturing method of component built-in wiring board
12/02/2010US20100301472 Electronic component and manufacturing method thereof
12/02/2010US20100301470 Stud bumps as local heat sinks during transient power operations
12/02/2010US20100301469 Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
12/02/2010US20100301468 Semiconductor device and method of manufacturing the same
12/02/2010US20100301467 Wirebond structures
12/02/2010US20100301466 Semiconductor device
12/02/2010US20100301465 Lead frame, lead frame fabrication, and semiconductor device
12/02/2010US20100301464 Asterisk pad
12/02/2010US20100301463 Reduced soft error rate through metal fill and placement
12/02/2010US20100301462 Method and apparatus providing air-gap insulation between adjacent conductors using nanoparticles
12/02/2010US20100301461 Reliable interconnection
12/02/2010US20100301460 Semiconductor device having a filled trench structure and methods for fabricating the same
12/02/2010US20100301459 Method for manufacturing a semiconductor device and a semiconductor device
12/02/2010US20100301458 Alignment Target Contrast in a Lithographic Double Patterning Process
12/02/2010US20100301457 Lithography Masks, Systems, and Manufacturing Methods
12/02/2010US20100301456 Method for applying a structure to a semiconductor element
12/02/2010US20100301451 Semiconductor device, lower layer wiring designing device, method of designing lower layer wiring and computer program
12/02/2010US20100301436 Semiconductor device and method for making semiconductor device
12/02/2010US20100301435 Sensor geometry for improved package stress isolation
12/02/2010US20100301431 Thin semiconductor device having embedded die support and methods of making the same
12/02/2010US20100301397 Power and Ground Shield Mesh to Remove Both Capacitive and Inductive Signal Coupling Effects of Routing in Integrated Circuit Device
12/02/2010US20100301342 Increased grain size in metal wiring structures through flash tube irradiation
12/02/2010US20100301334 Semiconductor integrated circuit device and manufacture thereof
12/02/2010US20100301333 Semiconductor device and method of inspecting an electrical characteristic of a semiconductor device
12/02/2010US20100301332 Detecting a Fault State of a Semiconductor Arrangement
12/02/2010US20100300746 Encapsulation process and structure for electronic devices
12/02/2010US20100300736 Composite multi-layer substrate and module using the substrate
12/02/2010US20100300671 Heat sink and method for manufacturing same
12/02/2010US20100300670 Fixing apparatus for heat sink
12/02/2010DE212009000041U1 Kühlkörper für eine LED-Leuchte und LED-Leuchte, die den Kühlkörper aufweist Heatsink for LED lamp and LED lamp having the heat sink
12/02/2010DE202010014108U1 Wärmeverteiler mit mechanisch gesichertem Wärmekopplungselement Heat spreader with mechanically secured heat coupling element
12/02/2010DE202009018064U1 Gegenstände beim reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat Objects in the reversible attachment of a device wafer on a carrier substrate
12/02/2010DE10255636B4 Schaltkreis-Anordnung Circuit arrangement
12/02/2010DE102010027955A1 Gestapelte Busschienen-Anordnung mit integrierter Kühlung Stacked busbar arrangement with integrated cooling
12/02/2010DE102010017001A1 Wärmesenke und Verfahren zu deren Herstellung Heat sink and method for the preparation thereof
12/02/2010DE102010016517A1 Halbleiterbauelement Semiconductor device
12/02/2010DE102010016184A1 Prüfung von dielektrischen Filmen und Schichten Examination of dielectric films and layers
12/02/2010DE102009026558B3 Leistungshalbleitermodul mit beweglich gelagerten Schaltungsträgern und Verfahren zur Herstellung eines solchen Leistungshalbleitermoduls Power semiconductor module with a movably mounted circuit boards and methods for manufacturing such a power semiconductor module
12/02/2010DE102009026479A1 Power semiconductor module i.e. power converter, has band conductor connecting intermediate circuit capacitor and power semiconductor element, and conductor loop and ohmic resistor coupled to band conductor
12/02/2010DE102009023350A1 Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements An electronic device and method for manufacturing an electronic component
12/02/2010DE102009023251A1 Verfahren zur Herstellung eines Kontaktelements mit großem Aspektverhältnis und mit einer günstigeren Form in einem Halbleiterbauelement zur Verbesserung der Abscheidung einer Beschichtung A process for producing a contact element with a high aspect ratio and with a more favorable form in a semiconductor device for improving the deposition of a coating
12/02/2010DE102009023023A1 Leistungshalbleitermodul mit Verbindungseinrichtung Power semiconductor module with connecting means
12/02/2010DE102009022966A1 Oberflächenmontierbarer optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Halbleiterchips Surface mount optoelectronic semiconductor chip and method for producing a surface-mountable optoelectronic semiconductor chips
12/02/2010DE102009022644A1 Vorrichtung zum flexiblen Schutz von Bauelementen vor Umwelteinflüssen Device for flexible protection of components from environmental influences
12/02/2010DE102009022254A1 Electrical switching circuit i.e. Radio frequency identification-transponder, has electrical supply lines connecting functional determined specimen of two or multiple components with another component
12/02/2010DE102009015224A1 LED-Lichtquelle mit einer Vielzahl von LED-Chips und LED-Chip zur Verwendung in selbiger LED light source having a plurality of LED chips and LED chip for use at that
12/02/2010DE102005039165B4 Draht- und streifengebondetes Halbleiterleistungsbauteil und Verfahren zu dessen Herstellung Wire and streifengebondetes semiconductor power device and process for its preparation
12/02/2010CA2761748A1 Semiconductor devices on diffusion barrier coated substrates and methods of making the same
12/01/2010EP2256923A1 Piezoelectric device
12/01/2010EP2256833A1 Method of making light emitting Device with Silicon-containing encapsulant
12/01/2010EP2256805A2 Power semiconductor module with connector device
12/01/2010EP2256804A1 Aluminum-based bond-pad and manufacturing method thereof
12/01/2010EP2256803A1 Aluminum bond pads with enhanced wire bond stability
12/01/2010EP2256802A1 Semiconductor chip and method of manufacturing a semiconductor chip
12/01/2010EP2256801A2 Contact device for a power semiconductor module with a centring recess
12/01/2010EP2256800A1 Multilayer dielectric substrate, and semiconductor package
12/01/2010EP2256793A1 Ball-arranging substrate for forming bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls
12/01/2010EP2256785A2 Electronic Device
12/01/2010EP2256744A1 Non-volatile memory cell comprising a diode and a resistance-switching material
12/01/2010EP2256147A1 Thermosetting organic-inorganic hybrid transparent material
12/01/2010EP2255386A1 Method for fabricating through-substrate vias
12/01/2010EP2255383A2 Connection component with hollow inserts and method for making same
12/01/2010EP2255382A2 Hermetically-sealed packages for electronic components having reduced unused areas
12/01/2010EP2255376A1 Ultra high density capacity comprising pillar-shaped capacitors formed on both sides of a substrate
12/01/2010EP2255361A2 Magnetically de-coupling magnetic memory cells and bit/word lines for reducing bit selection errors
12/01/2010EP2095418B1 Wire and solder bond forming methods
12/01/2010EP1946371B1 Electrically programmable fuse
12/01/2010EP1678756B1 Semiconductor component comprising synthetic housing material, semiconductor chip and circuit support, and method for producing the same
12/01/2010EP1588420B1 Sealed and pressurized liquid cooling system for microprocessor
12/01/2010EP1444733B1 Electronic device carrier adapted for transmitting high frequency signals
12/01/2010CN201663540U Rectifier component
12/01/2010CN201663159U Strong coating adhesive type plastic package lead frame
12/01/2010CN201663158U Radiating mechanism of IGBT power module
12/01/2010CN201663157U Improved structure of fixed holder for integrated circuit radiator
12/01/2010CN201663156U Radiator for memory and memory device with same
12/01/2010CN201663155U Novel module isolation belt
12/01/2010CN201663154U Voltage withstand rectifier bridge
12/01/2010CN201663153U Packaging structure of imaging module
12/01/2010CN1997905B System and method for measuring negative bias thermal instability
12/01/2010CN1976027B Semiconductor structure and method of forming passive circuit element
12/01/2010CN1949523B Non-volatile memory devices and methods of forming the same
12/01/2010CN1940977B 半导体装置 Semiconductor device
12/01/2010CN1921110B Assembly with a power semiconductor module and a connector
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