Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/08/2010CN101173159B Epoxy resin encapsulating material composition
12/08/2010CN101144741B Temperature detector
12/08/2010CN101142280B Curable silicone composition and electronic device produced therefrom
12/08/2010CN101140936B Integrated memory cell array
12/08/2010CN101120433B Method for fabricating and assembling printable semiconductor elements
12/08/2010CN101118720B Display device and pixel circuit layout method
12/08/2010CN101106121B Wiring substrate, semiconductor device, and method of manufacturing the same
12/08/2010CN101090139B Adhesion type area sensor and display device having adhesion type area sensor
12/08/2010CN101027336B Epoxy resin composition, cured product thereof, semiconductor sealing material, new phenolic resin, new epoxy resin, method for producing the new phenolic resin, and method for producing the new epoxy
12/08/2010CN101019228B Semiconductor device and its manufacturing method
12/07/2010USRE41980 Semiconductor interconnect formed over an insulation and having moisture resistant material
12/07/2010US7848828 Method and apparatus for managing manufacturing equipment, method for manufacturing device thereby
12/07/2010US7848002 Method for aligning die to substrate
12/07/2010US7847939 Overlay measurement target
12/07/2010US7847420 Surface mounting structure for ball grid array
12/07/2010US7847419 Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers
12/07/2010US7847418 Semiconductor device
12/07/2010US7847417 Flip-chip mounting substrate and flip-chip mounting method
12/07/2010US7847416 Wafer level package and method of fabricating the same
12/07/2010US7847415 Method for manufacturing a multichip module assembly
12/07/2010US7847414 Chip package structure
12/07/2010US7847413 Semiconductor device and method of manufacturing the same
12/07/2010US7847412 Isolating chip-to-chip contact
12/07/2010US7847411 Electronic device and method of manufacturing the same
12/07/2010US7847410 Interconnect of group III-V semiconductor device and fabrication method for making the same
12/07/2010US7847409 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
12/07/2010US7847408 Integrated clock and power distribution
12/07/2010US7847406 Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
12/07/2010US7847405 Semiconductor device and manufacturing method of semiconductor device
12/07/2010US7847404 Circuit board assembly and packaged integrated circuit device with power and ground channels
12/07/2010US7847403 Semiconductor device having no cracks in one or more layers underlying a metal line layer
12/07/2010US7847402 BEOL interconnect structures with improved resistance to stress
12/07/2010US7847400 Semiconductor package substrate structure and manufacturing method thereof
12/07/2010US7847399 Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
12/07/2010US7847398 Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing
12/07/2010US7847397 Nanoparticles with covalently bonded stabilizer
12/07/2010US7847396 Semiconductor chip stack-type package and method of fabricating the same
12/07/2010US7847395 Package and package assembly of power device
12/07/2010US7847394 Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
12/07/2010US7847393 Conductive connecting pins for a package substrate
12/07/2010US7847392 Semiconductor device including leadframe with increased I/O
12/07/2010US7847391 Manufacturing method for integrating a shunt resistor into a semiconductor package
12/07/2010US7847390 Semiconductor device
12/07/2010US7847389 Semiconductor package, electronic part and electronic device
12/07/2010US7847388 Method of manufacturing a semiconductor device
12/07/2010US7847387 Electrical device and method
12/07/2010US7847386 Reduced size stacked semiconductor package and method of making the same
12/07/2010US7847385 Stacked die structure with an underlying copper-topped die
12/07/2010US7847384 Semiconductor package and manufacturing method thereof
12/07/2010US7847383 Multi-chip package for reducing parasitic load of pin
12/07/2010US7847382 Integrated circuit packaging system with package stacking and method of manufacture thereof
12/07/2010US7847381 Package for an integrated circuit
12/07/2010US7847380 Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card
12/07/2010US7847379 Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same
12/07/2010US7847378 Compliant wirebond pedestal
12/07/2010US7847375 Electronic device and method of manufacturing same
12/07/2010US7847369 Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure
12/07/2010US7847352 Semiconductor device and method for manufacturing the same
12/07/2010US7847349 Single-cycle FFT butterfly calculator
12/07/2010US7847317 Low-capacitance electrostatic discharge protection diodes
12/07/2010US7847287 Inverter, logic circuit including an inverter and methods of fabricating the same
12/07/2010US7847198 Wiring board and method for manufacturing the same, and semiconductor device
12/07/2010US7846998 Sealant epoxy-resin molding material, and electronic component device
12/07/2010US7846832 Semiconductor device and fabrication method thereof
12/07/2010US7846830 Semiconductor device and method for manufacturing same
12/07/2010US7846829 Stacked solder balls for integrated circuit device packaging and assembly
12/07/2010US7846815 Eutectic flow containment in a semiconductor fabrication process
12/07/2010US7846814 Semiconductor layer structure and method of making the same
12/07/2010US7846779 Power device package and method of fabricating the same
12/07/2010US7846778 Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
12/05/2010CA2706253A1 Integrated heat exchanger
12/02/2010WO2010138897A2 Acousto-optic deflector applications in laser processing of dielectric or other materials
12/02/2010WO2010138480A2 Stacked semiconductor device assembly
12/02/2010WO2010138326A2 Esd protection structure
12/02/2010WO2010138221A1 Silicone composition for producing transparent silicone materials and optical devices
12/02/2010WO2010137899A2 Leadframe and method for manufacturing the same
12/02/2010WO2010137711A1 Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
12/02/2010WO2010137651A1 Solder material, heat dissipation base using same, and electronic device
12/02/2010WO2010137445A1 Adhesive composition, adhesive sheet for connection of circuit member, and process for manufacture of semiconductor device
12/02/2010WO2010137443A1 Adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device
12/02/2010WO2010137442A1 Adhesive composition, adhesive sheet, and process for manufacture of semiconductor device
12/02/2010WO2010137420A1 Wiring board and method for manufacturing same
12/02/2010WO2010137098A1 Semiconductor device
12/02/2010WO2010136974A2 Semiconductor chip and method of manufacturing a semiconductor chip
12/02/2010WO2010136898A1 Cooling device
12/02/2010WO2010136017A1 Cooled electric unit
12/02/2010WO2010117076A3 Optical device and method of producing the same
12/02/2010WO2010104543A3 Integrated circuits secure from invasion and methods of manufacturing the same
12/02/2010WO2010081465A3 Molding compound-enclosed power semiconductor element
12/02/2010US20100304509 Contactless technique for evaluating a fabrication of a wafer
12/02/2010US20100302829 Semiconductor module and data memory module having the same
12/02/2010US20100302474 Source driver, method for manufacturing same, and liquid crystal module
12/02/2010US20100301497 Dicing tape-integrated film for semiconductor back surface
12/02/2010US20100301496 Structure and Method for Power Field Effect Transistor
12/02/2010US20100301495 Semiconductor device and method for manufacturing same
12/02/2010US20100301494 Re-establishing a hydrophobic surface of sensitive low-k dielectrics in microstructure devices
12/02/2010US20100301493 Packaged electronic devices havng die attach regions with selective thin dielectric layer
12/02/2010US20100301492 Method of stiffening coreless package substrate
12/02/2010US20100301491 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
12/02/2010US20100301490 Profiled contact for semiconductor device
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