Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/08/2010CN101911267A Semiconductor device and method for manufacturing same
12/08/2010CN101911266A Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
12/08/2010CN101911265A Electronic member wherein barrier-seed layer is formed on base
12/08/2010CN101911264A Electronic member wherein barrier-seed layer is formed on base
12/08/2010CN101911257A ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer
12/08/2010CN101910253A Silsesquioxane resins
12/08/2010CN101909417A Radiating device and manufacture method thereof
12/08/2010CN101909416A Heat dissipating device
12/08/2010CN101909415A Heat dissipation device and fixing frame thereof
12/08/2010CN101908563A Capacitor and metal-oxide-metal capacitor
12/08/2010CN101908554A Organic electro-luminescence display device and method for fabricating the same
12/08/2010CN101908533A Bilaterally displayed OLED (Organic Light-emitting Device) and preparation method thereof
12/08/2010CN101908532A Thin double-faced display OLED (Organic Light Emitting Diode) device and manufacturing method thereof
12/08/2010CN101908531A Multilayer electroluminescent device
12/08/2010CN101908528A Electronic packaging structure and substrate thereof
12/08/2010CN101908527A Reverse interleaved stack structure of integrated circuit module
12/08/2010CN101908526A Alignment mark arrangement and alignment mark structure
12/08/2010CN101908525A Semiconductor device and method of manufacturing the same
12/08/2010CN101908524A Antioxidation method for finishing fuse
12/08/2010CN101908523A Electronic device, conductive compositon, metal filling apparatus, and electronic decive manufacturing method
12/08/2010CN101908522A Dicing structures for semiconductor substrates and methods of fabrication thereof
12/08/2010CN101908521A Semiconductor device and method of manufacturing the same
12/08/2010CN101908520A Structure for connecting lead frame and plastic compound
12/08/2010CN101908519A Lead frame and packaging structure therewith
12/08/2010CN101908518A Semiconductor board member
12/08/2010CN101908517A Bonding pad, manufacturing method and bonding method thereof
12/08/2010CN101908516A Tin-silver convex block structure of flip chip and manufacturing method thereof
12/08/2010CN101908515A Semiconductor device and method of manufacturing the same
12/08/2010CN101908514A Semiconductor device
12/08/2010CN101908513A Radiator
12/08/2010CN101908512A Twist-secured assembly of a power semiconductor module mountable on a heat sink
12/08/2010CN101908511A Gallium nitride schottky rectifier with metal substrate and production method thereof
12/08/2010CN101908510A Semiconductor device with heat-radiating and packaging structure and manufacturing method thereof
12/08/2010CN101908501A Diffusion barrier and forming method thereof
12/08/2010CN101908490A Circuit substrate module with heat radiator and production method thereof
12/08/2010CN101907922A Touch system
12/08/2010CN101907807A Display device having oxide thin film transistor and fabrication method thereof
12/08/2010CN101907233A Light-emitting diode illumination platform
12/08/2010CN101907232A Light fitting and illuminating apparatus thereof
12/08/2010CN101907231A Compact LED lamp and manufacture method thereof
12/08/2010CN101906288A Thermal interface material, electronic device with same and preparation method
12/08/2010CN101906238A Epoxy resin composition and semiconductor device
12/08/2010CN101906236A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
12/08/2010CN101905388A Solder alloy and a semiconductor device using the solder alloy
12/08/2010CN101593743B Integrated circuit element
12/08/2010CN101582425B Dynamic random access memory and memory array
12/08/2010CN101567356B Circuit board structure and manufacture method thereof
12/08/2010CN101556035B Radiator structure of semiconductor lighting fixture
12/08/2010CN101553103B Heat radiator with heat pipes and leveling manufacture method of heated parts thereof
12/08/2010CN101552270B Pixel structure, thin-film transistor array substrate, display panel and display apparatus
12/08/2010CN101546803B 光学半导体器件 The optical semiconductor device
12/08/2010CN101546711B Conducting wire frame and method for manufacturing same
12/08/2010CN101542725B Cooler for power module
12/08/2010CN101540308B Semiconductor chip package
12/08/2010CN101527296B Integrated circuit and method for manufacturing same
12/08/2010CN101498428B Illuminating apparatus
12/08/2010CN101494180B Forming method for semiconductor device and semiconductor device
12/08/2010CN101493656B Exposure condition setting method, substrate processing unit and computer program
12/08/2010CN101488462B Modulated multi-die package construction and method thereof
12/08/2010CN101483970B Circuit board
12/08/2010CN101483179B Thin-film transistor array substrate
12/08/2010CN101471239B Test pattern of semiconductor device and manufacturing method thereof
12/08/2010CN101463985B LED lamp
12/08/2010CN101459162B Solid illuminating device
12/08/2010CN101452899B Nitride semiconductor device and method of manufacturing the same
12/08/2010CN101447640B Semiconductor light emitting device and method for manufacturing the same
12/08/2010CN101436552B Method for manufacturing package structure with reconfigured crystal particle by net-shaped structure
12/08/2010CN101431291B Processing method for high-power switch power supply commutation bridge and water cooling board
12/08/2010CN101425512B Stacked semiconductor package and method for manufacturing the same
12/08/2010CN101409273B Ball-placing side surface structure for package substrate and manufacturing method thereof
12/08/2010CN101392335B Method for preparing tungsten copper composite encapsulation material
12/08/2010CN101385133B Method of forming a semiconductor device having asymmetric dielectric regions and structure thereof
12/08/2010CN101360393B Circuit board construction embedded with semi-conductor chip and preparation thereof
12/08/2010CN101359620B Semiconductor structure manufacturing method
12/08/2010CN101345226B IC device and method of manufacturing the same
12/08/2010CN101338885B LED lamp
12/08/2010CN101335321B Method for manufacturing light emitting device
12/08/2010CN101335259B Fuse for semiconductor device
12/08/2010CN101308728B Plated terminations
12/08/2010CN101304026B Layout method for mask, semiconductor device and method for manufacturing the same
12/08/2010CN101299419B Semiconductor device and manufacture method thereof
12/08/2010CN101295691B 半导体封装结构 Semiconductor package structure
12/08/2010CN101290926B 半导体装置 Semiconductor device
12/08/2010CN101287350B Heat sink
12/08/2010CN101283119B Method of surface treatment for the inhibition of whiskers
12/08/2010CN101271870B Silicon epitaxial wafer
12/08/2010CN101252103B Flash memory device and method of forming the device
12/08/2010CN101238572B Methods of forming through-wafer interconnects and structures resulting therefrom
12/08/2010CN101236920B Semiconductor wafer with improved crack protection
12/08/2010CN101232040B Light emitting device, driving method of light emitting device and electronic device
12/08/2010CN101232038B Structure of high-density phase transition memory and process of preparation thereof
12/08/2010CN101221960B Pixel structure
12/08/2010CN101211942B CMOS image sensor and method of manufacturing thereof
12/08/2010CN101211914B Spiral inductor
12/08/2010CN101211882B Printed circuit board and element module packaging structure and encapsulation method
12/08/2010CN101211845B Semiconductor fabrication process for manufacturing adjacent contact body and semiconductor apparatus
12/08/2010CN101206100B Pole-shaped radiator with thermal fin
12/08/2010CN101197408B Light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
12/08/2010CN101183706B Embedded electronic component structure and method of producing the same
12/08/2010CN101179006B Method for protecting an alignment mark
1 ... 564 565 566 567 568 569 570 571 572 573 574 575 576 577 578 579 580 581 582 583 584 ... 2262