Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/09/2010US20100308475 Composite of at least two semiconductor substrates and a production method
12/09/2010US20100308474 Semiconductor device and method for manufacturing the same
12/09/2010US20100308473 Method for making an electrically conducting mechanical interconnection member
12/09/2010US20100308472 Semiconductor chip having power supply line with minimized voltage drop
12/09/2010US20100308471 Electronic device and method for manufacturing the same
12/09/2010US20100308470 Semiconductor device and inductor
12/09/2010US20100308469 Method and apparatus of forming a via
12/09/2010US20100308468 Semiconductor device and semiconductor device fabrication method
12/09/2010US20100308467 Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die
12/09/2010US20100308466 Semiconductor device and method of manufacturing semiconductor device
12/09/2010US20100308465 Semiconductor device and method of manufacturing the same
12/09/2010US20100308464 Semiconductor device and method for fabricating the same
12/09/2010US20100308463 Interfacial capping layers for interconnects
12/09/2010US20100308461 Multi-chip semiconductor package
12/09/2010US20100308460 Method of Ball Grid Array Package Construction with Raised Solder Ball Pads
12/09/2010US20100308459 Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die
12/09/2010US20100308458 Semiconductor integrated circuit device
12/09/2010US20100308457 Semiconductor apparatus and manufacturing method of the same
12/09/2010US20100308456 Wafer-Level, Polymer-Based Encapsulation for Microstructure Devices
12/09/2010US20100308455 Method for Manufacturing Hetero-Bonded Wafer
12/09/2010US20100308454 Power semiconductor device package and fabrication method
12/09/2010US20100308453 Integrated circuit package including a thermally and electrically conductive package lid
12/09/2010US20100308452 Electronic module with feed through conductor between wiring patterns
12/09/2010US20100308451 Wiring substrate and method of manufacturing the same
12/09/2010US20100308450 Integrated package
12/09/2010US20100308449 Semiconductor packages and manufacturing method thereof
12/09/2010US20100308448 Semiconductor Device and Method of Manufacturing the Same
12/09/2010US20100308447 Semiconductor device
12/09/2010US20100308443 Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support
12/09/2010US20100308442 Semiconductor device, semiconductor wafer and manufacturing method of the same
12/09/2010US20100308441 Marking co2 laser-transparent materials by using absorption-material-assisted laser processing
12/09/2010US20100308438 Non-conformal masks, semiconductor device structures including the same, and methods
12/09/2010US20100308433 Semiconductor device and method of manufacturing same
12/09/2010US20100308421 Semiconductor device
12/09/2010US20100308386 Solid state image pickup device and method of producing solid state image pickup device
12/09/2010US20100308380 Dual damascene processing for gate conductor and active area to first metal level interconnect structures
12/09/2010US20100307810 Energy conditioning circuit arrangement for integrated circuit
12/09/2010US20100307802 Wiring Member, Method of Manufacturing the Wiring Member and Electronic Element
12/09/2010DE202009009087U1 Eingebetteter Sandwich-Hybridschaltkreis Embedded sandwich hybrid circuit
12/09/2010DE112008002633T5 Gestapelte Dual-Chip-Packages, Herstellungsverfahren und Systeme, die die Packages umfassen Stacked Dual-chip packages, manufacturing methods and systems that include the packages
12/09/2010DE102010017109A1 Kondensatoranordnung und Verfahren zu deren Herstellung Capacitor arrangement and methods for their preparation
12/09/2010DE102010016455A1 Halbleiterbauelement und Herstellungsverfahren A semiconductor device and manufacturing method
12/09/2010DE102010008617A1 Halbleitervorrichtung zum Treiben eines als Brücke geschalteten Leistungstransistors A semiconductor device for driving a power transistor connected as a bridge
12/09/2010DE102009039128A1 Ausrichtungsmarkierungs-Anordnung und Ausrichtungsmarkierungs-Aufbau Alignment mark arrangement and alignment mark structure
12/09/2010DE102009028360B3 Circuit supporting arrangement producing method for producing e.g. inverter module used in industrial application, involves soldering metal surface, lower metalized layer and fastening structure using brazing solder
12/09/2010DE102009026439A1 Sensorelement und Verfahren zur Herstellung eines solchen Sensor element and method for producing such
12/09/2010DE102009023854A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component
12/09/2010DE102009023849A1 Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip The optoelectronic semiconductor body and optoelectronic semiconductor chip
12/09/2010DE102007020257B4 Vereinheitlichte Teststruktur für belastungsabhängige Materialwanderungsprüfungen Standardized test structure for load-dependent migration of material tests
12/09/2010DE102006056363B4 Halbleitermodul mit mindestens zwei Substraten und Verfahren zur Herstellung eines Halbleitermoduls mit zwei Substraten A semiconductor module having at least two substrates and process for producing a semiconductor module with two substrates
12/09/2010DE102004025609B4 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module
12/09/2010DE102004022724B4 Anordnung von einem Halbleiterbauelement und einem Kühlkörper und Verfahren zur Herstellung einer derartigen Anordnung Arrangement of a semiconductor device and a heat sink and method for producing such an arrangement
12/08/2010EP2259669A1 Component-incorporating wiring board
12/08/2010EP2259666A1 Circuit board having built-in electronic parts and its manufacturing method
12/08/2010EP2259312A1 Inversely alternate stacked structure of integrated circuit modules
12/08/2010EP2259311A2 Method for embedding at least one component into a circuit board element
12/08/2010EP2259310A1 Integrated heat exchanger
12/08/2010EP2259309A2 Integrated circuit package including a thermally and electrically conductive package lid
12/08/2010EP2259308A1 Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module
12/08/2010EP2259307A2 Electronic device, conductive compositon, metal filling apparatus, and electronic decive manufacturing method
12/08/2010EP2259301A2 Method for preparing and assembling substrates
12/08/2010EP2259164A1 Thermal solution for electronic devices
12/08/2010EP2259018A1 Gap control for die or layer bonding using intermediate layers
12/08/2010EP2258154A1 Cooling device and method for the manufacturing thereof
12/08/2010EP2258147A1 Thermal storage system using phase change materials in led lamps
12/08/2010EP2257978A1 Method for integrating heat transfer members, and an led device
12/08/2010EP2257616A1 Thermally conductive silicone grease composition
12/08/2010EP1859483B1 Magnetic self-assembly for integrated circuit packages
12/08/2010EP1719168B1 Methods of fabricating interconnects for semiconductor components
12/08/2010EP1502066B1 Cooling unit with flow distributing element
12/08/2010CN201667334U Thyristor valve set structure of a novel heat tube reactive compensation device
12/08/2010CN201667333U Novel wafer level fan-out chip packaging structure
12/08/2010CN201667332U Semiconductor power module
12/08/2010CN201667331U Memory packaging structure
12/08/2010CN201667330U Flexible package substrate structure for protecting low-K dielectric layer chip
12/08/2010CN201666543U Radiating lamp shell of multi-blade flying type LED street lamp
12/08/2010CN1983615B Phase-change memory device and method of manufacturing same
12/08/2010CN1979683B Nonvolatile semiconductor memory
12/08/2010CN1979380B Embedded heat pipe in a hybrid cooling system
12/08/2010CN1958664B 液状环氧树脂组合物 A liquid epoxy resin composition
12/08/2010CN1945816B Semiconductor apparatus and method thereof
12/08/2010CN1938799B Embedded capacitors using conductor filled vias
12/08/2010CN1937884B Embedded capacitor device having a common coupling area
12/08/2010CN1908065B Epoxy resin composition and semiconductor device
12/08/2010CN1901185B Transient voltage protection apparatus, material and manufacturing methods
12/08/2010CN1897265B Interconnection device including one or more embedded vias and method of producing the same
12/08/2010CN1893765B Multi-layer printed circuit board, solder resist composition, and method for manufacturing multi-layer printed circuit board and semiconductor device
12/08/2010CN1870884B Mounting method of flexible circuit board
12/08/2010CN1716597B Semiconductor device
12/08/2010CN1685578B Light emitting device
12/08/2010CN101911485A Piezoelectric device
12/08/2010CN101911294A Semiconductor device
12/08/2010CN101911293A Methods of forming high density metal wiring for fine line and space packaging applications and structures formed thereby
12/08/2010CN101911292A Micropad formation for a semiconductor
12/08/2010CN101911291A Bga package with traces for plating pads under the chip
12/08/2010CN101911290A Semiconductor device and display apparatus
12/08/2010CN101911289A 3-d semiconductor die structure with containing feature and method
12/08/2010CN101911288A All optical fast distributed arbitration in a computer system device
12/08/2010CN101911271A Electronic component
12/08/2010CN101911270A A heat sink and method of forming a heatsink using a wedge-lock system
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