Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/15/2010CN101200014B Fabricating process for heat dissipating device
12/15/2010CN101188223B Interconnection structure and its forming method
12/15/2010CN101174572B Semiconductor device and its production method
12/15/2010CN101136393B Semiconductor package and method therefor
12/15/2010CN101127343B Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device
12/15/2010CN101106111B IC device package and its mounting method
12/15/2010CN101091003B Method for forming tantalum nitride film
12/15/2010CN101083247B Board strip and method of manufacturing semiconductor package using the same
12/15/2010CN101064329B Optical apparatus and optical module using the same
12/15/2010CN101000903B Printed circuit board and method of manufacturing semiconductor package using the same
12/14/2010US7852900 Semiconductor device, method of manufacturing the same, and production equipment of the same
12/14/2010US7852651 Semiconductor device
12/14/2010US7852634 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
12/14/2010US7852630 Heat dissipating device
12/14/2010US7852169 High speed interconnection system having a dielectric system with polygonal arrays of holes therein
12/14/2010US7852103 Implementing at-speed Wafer Final Test (WFT) with complete chip coverage
12/14/2010US7851930 improved thermal conductivity and dispensability properties; alloy of copper and silver as filler; semiconductor chips; printed circuits; microelectronics
12/14/2010US7851928 Semiconductor device having substrate with differentially plated copper and selective solder
12/14/2010US7851926 Semiconductor device
12/14/2010US7851925 Wafer level packaged MEMS integrated circuit
12/14/2010US7851924 Method of manufacturing semiconductor device, and semiconductor device
12/14/2010US7851923 Low resistance and inductance backside through vias and methods of fabricating same
12/14/2010US7851921 Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board
12/14/2010US7851920 Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate
12/14/2010US7851917 Wiring structure and method of manufacturing the same
12/14/2010US7851914 Semiconductor integrated circuit device
12/14/2010US7851913 Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
12/14/2010US7851911 Semiconductor chip used in flip chip process
12/14/2010US7851910 Diffusion soldered semiconductor device
12/14/2010US7851909 Group III nitride based flip-chip integrated circuit and method for fabricating
12/14/2010US7851908 Semiconductor device
12/14/2010US7851907 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
12/14/2010US7851906 Flexible circuit electronic package with standoffs
12/14/2010US7851905 Microelectronic package and method of cooling an interconnect feature in same
12/14/2010US7851904 Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
12/14/2010US7851903 Infrared detector with plurality of metallization between first and second container members
12/14/2010US7851902 Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device
12/14/2010US7851900 Stacked semiconductor package
12/14/2010US7851899 Multi-chip ball grid array package and method of manufacture
12/14/2010US7851898 Multichip package or system-in package
12/14/2010US7851896 Quad flat non-leaded chip package
12/14/2010US7851895 Semiconductor structure and semiconductor manufacturing method
12/14/2010US7851894 System and method for shielding of package on package (PoP) assemblies
12/14/2010US7851893 Semiconductor device and method of connecting a shielding layer to ground through conductive vias
12/14/2010US7851892 Semiconductor memory device and method for fabricating the same
12/14/2010US7851887 Phase change memory device with heater electrodes having fine contact area and method for manufacturing the same
12/14/2010US7851884 Field-effect transistor, semiconductor chip and semiconductor device
12/14/2010US7851883 Semiconductor device and method of manufacture thereof
12/14/2010US7851880 Solid-state imaging device
12/14/2010US7851866 Electric power conversion device
12/14/2010US7851864 Test structure of a semiconductor device and semiconductor device
12/14/2010US7851863 Static electricity countermeasure component
12/14/2010US7851859 Single transistor memory device having source and drain insulating regions and method of fabricating the same
12/14/2010US7851858 MOSFET having SOI and method
12/14/2010US7851849 Nonvolatile semiconductor storage device and method for manufacturing same
12/14/2010US7851818 Fabrication of compact opto-electronic component packages
12/14/2010US7851816 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
12/14/2010US7851811 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
12/14/2010US7851797 Display device including a color filter or color filters over a pixel portion and a driving circuit for driving the pixel portion
12/14/2010US7851793 Test structure with TDDB test pattern
12/14/2010US7851534 Thermally conductive sheet
12/14/2010US7851345 Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding
12/14/2010US7851303 Semiconductor device and manufacturing method thereof
12/14/2010US7851278 Semiconductor device and method for manufacturing the same
12/14/2010US7851265 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
12/14/2010US7851257 Integrated circuit stacking system with integrated passive components
12/14/2010US7851256 Method of manufacturing chip-on-chip semiconductor device
12/14/2010US7851252 Materials and methods for creating imaging layers
12/14/2010US7851020 allows making the unevenness of the functional liquids less conspicuous over the entire substrate
12/14/2010US7850060 Heat cycle-able connection
12/09/2010WO2010141624A2 Modified pillar design for improved flip chip packaging
12/09/2010WO2010141482A2 Nanofiber covered micro components and method for micro component cooling
12/09/2010WO2010141432A1 Thermally conductive circuit subassemblies, method of manufacture thereof, and articles formed therefrom
12/09/2010WO2010141311A1 Compliant printed circuit area array semiconductor device package
12/09/2010WO2010141297A1 Compliant printed circuit wafer level semiconductor package
12/09/2010WO2010141296A1 Compliant printed circuit semiconductor package
12/09/2010WO2010141295A1 Compliant printed flexible circuit
12/09/2010WO2010140980A1 Multilayer barrier film
12/09/2010WO2010140804A2 Norbornene resins for encapsulating optical device
12/09/2010WO2010140674A1 Epoxy resin composition, prepreg and cured products thereof
12/09/2010WO2010140640A1 Metal substrate and light source device
12/09/2010WO2010140635A1 Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor
12/09/2010WO2010140541A1 Aluminum-graphite composite, and heat dissipating component and led luminescent member that use same
12/09/2010WO2010140472A1 Signal transmission module
12/09/2010WO2010140331A1 Resin composition for semiconductor encapsulation, and semiconductor device
12/09/2010WO2010140297A1 Semiconductor device and signal transmission method
12/09/2010WO2010140279A1 Semiconductor device and manufacturing method thereof
12/09/2010WO2010139366A1 A package resonator cavity
12/09/2010WO2010139116A1 Light emitting diode lamp heat dissipation method
12/09/2010US20100312954 Multi-Chip Semiconductor Devices Having Non-Volatile Memory Devices Therein
12/09/2010US20100312078 Analyte Monitoring Device and Methods of Use
12/09/2010US20100311352 Radio frequency unit analog level detector and feedback control system
12/09/2010US20100311235 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
12/09/2010US20100310781 Manufacturing method thereof and a semiconductor device
12/09/2010US20100309641 Interposer substrate, lsi chip and information terminal device using the interposer substrate, manufacturing method of interposer substrate, and manufacturing method of lsi chip
12/09/2010US20100309635 Structure for mounting semiconductor package
12/09/2010US20100309470 Alignment mark arrangement and alignment mark structure
12/09/2010US20100308863 Architecture of Function Blocks and Wirings in a Structured ASIC and Configurable Driver Cell of a Logic Cell Zone
12/09/2010US20100308477 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
12/09/2010US20100308476 Method for manufacturing semiconductor device
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