Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/16/2010DE102009024369A1 Leistungselektronisches System Power Electronic System
12/16/2010DE102009023377A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit selbstjustierten Luftspalte, die auf der Grundlage eines Opfermaterials hergestellt sind Microstructure component with a self-aligned metallization structure with air gaps, which are formed on the basis of a sacrificial material
12/16/2010DE102009021488A1 Verbessertes Elektromigrationsverhalten von Kupferleitungen in Metallisierungssystemen von Halbleiterbauelementen durch Legierung von Oberflächen Improved electromigration behavior of copper lines in metallization of semiconductor devices by alloy surfaces
12/16/2010DE102005004160B4 CSP-Halbleiterbaustein, Halbleiterschaltungsanordnung und Verfahren zum Herstellen des CSP-Halbleiterbausteins CSP semiconductor device, the semiconductor circuit arrangement and method of manufacturing the CSP semiconductor device
12/15/2010EP2261993A2 Semiconductor device and method for making the same
12/15/2010EP2261974A1 Electronic component used for wiring and method for manufacturing the same
12/15/2010EP2261973A2 High power electronics system
12/15/2010EP2261972A2 Integrated circuit with an antenna assembly
12/15/2010EP2261971A1 Power module fabrication process
12/15/2010EP2261970A2 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
12/15/2010EP2261968A2 Semiconductor device and method of manufacturing the same
12/15/2010EP2261965A1 Crimp bump interconnection
12/15/2010EP2261964A1 Lead-free solder joint structure and solder ball
12/15/2010EP2261963A1 Semiconductor device and method for manufacturing the same
12/15/2010EP2261293A1 Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device
12/15/2010EP2260685A1 Device and method for cooling an electric component for a vehicle
12/15/2010EP2260683A1 Method for the production of an electronic assembly
12/15/2010EP2260521A2 High current control circuit including metal-insulator transition device, and system including the high current control circuit
12/15/2010EP2260512A2 Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process
12/15/2010EP2260511A1 Component arrangement and method for producing a component arrangement
12/15/2010EP2259995A1 Microelectromechanical systems component and method of making same
12/15/2010EP1668697B1 Electrical circuit apparatus and methods for assembling same
12/15/2010EP1597760B1 Integrated electronic component having specifically produced nanotubes in vertical structures
12/15/2010EP1262996B1 Semiconductor integrated circuit device
12/15/2010EP1253685B1 Cooling device, semiconductor laser light source device, and semiconductor laser light source unit
12/15/2010EP0964442B1 Ball arranging substrate for forming bump, ball arranging head, ball arranging apparatus, and ball arranging method
12/15/2010CN201674751U Fastener of radiator
12/15/2010CN201674745U Efficient heat radiator
12/15/2010CN201673906U COB encapsulated bi-face storage module and storage device of a bi-face interface
12/15/2010CN201673904U Solar photovoltaic assembly, and junction box and diode structure adopted by the same
12/15/2010CN201673903U 整流器 Rectifier
12/15/2010CN201673902U Ball grid array integrated circuit packaging block for resisting transient electric over stress
12/15/2010CN201673901U Ceramic composite substrate
12/15/2010CN201673900U Flip-chip bonded high-radiation spherical array packaging structure
12/15/2010CN201673899U High-heat-radiation spherical array packaging structure
12/15/2010CN201673898U Waterproof casing of module type surface mounting device
12/15/2010CN1983605B 半导体集成电路装置 The semiconductor integrated circuit device
12/15/2010CN1929127B 静电放电保护电路 Electrostatic discharge protection circuit
12/15/2010CN1893073B Method for regulating temperature and circuit therefor
12/15/2010CN1885532B Circuitry component structure manufacture method and structure
12/15/2010CN101919320A Method for producing wiring board and wiring board
12/15/2010CN101919057A Semiconductor device and method of manufacturing semiconductor device
12/15/2010CN101919053A Integrated circuit package having integrated faraday shield
12/15/2010CN101919052A Methods and devices for wireless chip-to-chip communications
12/15/2010CN101919051A Component arrangement and method for producing a component arrangement
12/15/2010CN101919050A Semiconductor device
12/15/2010CN101919049A Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods
12/15/2010CN101919036A A semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding
12/15/2010CN101919002A Data storage and stackable configurations
12/15/2010CN101918888A Display device, process for producing the display device, and sputtering target
12/15/2010CN101918170A Solder wire construction
12/15/2010CN101917835A Large-power module cooling structure of electric vehicle controller
12/15/2010CN101916760A Silicon-controlled electrostatic discharge (ESD) protection structure for effectively avoiding latch-up effect
12/15/2010CN101916759A Semiconductor device and method of manufacturing the same
12/15/2010CN101916758A Storage device, electronic device and preparing method thereof
12/15/2010CN101916755A Plane rectifier
12/15/2010CN101916754A Through-hole, through-hole forming method and through-hole filling method
12/15/2010CN101916753A Printed circuit board used for multi-column quadrature flat pin-free package chip
12/15/2010CN101916752A 多层印刷线路板 Multilayer printed circuit boards
12/15/2010CN101916751A Packaging structure and manufacture method thereof
12/15/2010CN101916750A Substrate for mounting device, method for manufacturing the same, semiconductor module, and portable apparatus
12/15/2010CN101916749A Method and apparatus for fabricating a plurality of semiconductor devices
12/15/2010CN101916748A Manufacture method of semiconductor device
12/15/2010CN101916747A IGBT (Insulated Gate Bipolar Translator) heat radiating structure for electric automobile controller and relevant components
12/15/2010CN101916746A Submount and method for manufacturing same
12/15/2010CN101916745A Novel plate crimped dual-chip encapsulated ceramic package
12/15/2010CN101916740A In-situ dry clean chamber for front end of line fabrication
12/15/2010CN101916732A Circuit substrate and making process thereof
12/15/2010CN101916731A Ceramic insulating film heat-conducting substrate and manufacturing method thereof
12/15/2010CN101916717A Method for preparing reinforced heat transfer surface of direct liquid cooling chip
12/15/2010CN101916715A In-situ dry clean chamber for front end of line fabrication
12/15/2010CN101916591A 半导体集成电路器件 The semiconductor integrated circuit device
12/15/2010CN101916021A Pixel array structure
12/15/2010CN101915408A High-power LED streetlamp cap capable of radiating heat by adopting water-cooling way
12/15/2010CN101914701A Lead frame material and method for processing strip made of same
12/15/2010CN101913591A Single-layer carbon nanotube and alinged single-layer carbon nanotube bulk structure, and their production process, production apparatus and use
12/15/2010CN101546739B Chip packaging structure reaching electrical connection without routing and method for manufacturing same
12/15/2010CN101533805B Pixel structure and manufacturing method thereof
12/15/2010CN101514808B Connection device for LED lamp and radiating fins
12/15/2010CN101513662B Method for manufacturing radiator with radiating fins and structure of radiator
12/15/2010CN101457920B Concentrated high brightness LED lighting lamp with self-convection radiator
12/15/2010CN101452901B Micro link lug structure with stress buffer and its producing method
12/15/2010CN101447481B Calibration technique for measuring gate resistance of power MOS gate device at wafer level
12/15/2010CN101427382B Method for manufacturing light receiving apparatus
12/15/2010CN101419967B Electrostatic discharge protection circuit, manufacturing method thereof and liquid crystal display device having the same
12/15/2010CN101378191B Electrostatic discharge protecting circuit and electronic product using the same
12/15/2010CN101373784B Photodiode array, method for manufacturing same, and radiation detector
12/15/2010CN101369542B Wiring board and manufacturing method therefor, and semiconductor device and manufacturing method therefor
12/15/2010CN101359638B Electronic device, method of producing the same, and semiconductor device
12/15/2010CN101345405B Protection circuit of power switch device
12/15/2010CN101345238B Packaging of semiconductor devices for increased reliability
12/15/2010CN101335291B Light emitting display and method of manufacturing the same
12/15/2010CN101330094B Organic light emitting diode display device and method of fabricating the same
12/15/2010CN101320738B Pixel structure
12/15/2010CN101317255B Nanostructure-based package interconnect
12/15/2010CN101299423B Amorphous tungsten-doped tin dioxide transparent conductive oxide thin film and preparation method thereof
12/15/2010CN101257784B Cooling device for information equipment
12/15/2010CN101221946B Manufacture method of semiconductor package, system package module
12/15/2010CN101212864B Inter-connecting structure between multi-layer base board and producing method
12/15/2010CN101207108B Semiconductor device having a multilayer interconnection structure
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