Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/22/2010CN101922615A LED lamp
12/22/2010CN101921980A Method for forming a thermal injection coating on a coating forming surface
12/22/2010CN101546763B Embedded memory device and procedure method thereof
12/22/2010CN101542722B Interposer
12/22/2010CN101496160B Electronic assembly having graded wire bonding
12/22/2010CN101490818B Semiconductor device manufacturing method, semiconductor device manufacturing apparatus
12/22/2010CN101469814B LED lamp strip
12/22/2010CN101467246B Multilayer ceramic electronic device and method for manufacturing the same
12/22/2010CN101465382B Mesa semiconductor device and method of manufacturing the same
12/22/2010CN101461059B 冷却器 Coolers
12/22/2010CN101431061B Mounted structural body and method of manufacturing the same
12/22/2010CN101423907B Sn-Ge-As alloy as well as preparation method and use thereof
12/22/2010CN101383331B Semiconductor device, semiconductor mounting structure, and electro-optical device
12/22/2010CN101379591B Semiconductor device and method of manufacturing thereof
12/22/2010CN101349411B LED lamp
12/22/2010CN101317265B IC coolant microchannel assembly with integrated attachment hardware
12/22/2010CN101266997B Light emitting device
12/22/2010CN101266736B Display device and method of manufacturing the same
12/22/2010CN101256966B Semiconductor component and method of manufacture
12/22/2010CN101252144B 存储器件和存储器 Memory devices and memory
12/22/2010CN101238762B Surface mounting component having magnetic layer thereon and method of forming same
12/22/2010CN101212883B Heat radiator combination
12/22/2010CN101207136B Non-volatile memory device and method of operating the same
12/22/2010CN101193545B Folded heatsink and memory module
12/22/2010CN101109502B High power led lamp with heat dissipation enhancement
12/22/2010CN101090113B Semiconductor device
12/22/2010CN101079420B Semiconductor device
12/22/2010CN101071810B 半导体器件 Semiconductor devices
12/22/2010CN101065001B Heat radiating device
12/22/2010CN101064299B Power semiconductor module in pressure contact layout
12/22/2010CN101040375B Long-term heat-treated integrated circuit arrangements and methods for producing the same
12/22/2010CN101038912B Semiconductor device having function of improved electrostatic discharge protection
12/21/2010US7856219 Transformer coils for providing voltage isolation
12/21/2010US7855894 Printed circuit board
12/21/2010US7855891 Modular heat sinks for housings for electronic equipment
12/21/2010US7855889 Resilient fastener and thermal module incorporating the same
12/21/2010US7855579 Semiconductor integrated circuit and design method thereof
12/21/2010US7855464 Semiconductor device having a semiconductor chip and resin sealing portion
12/21/2010US7855463 Method for producing a circuit module comprising at least one integrated circuit
12/21/2010US7855462 Packaged semiconductor assemblies and methods for manufacturing such assemblies
12/21/2010US7855461 Chip structure with bumps and testing pads
12/21/2010US7855460 Electronic component to protect an interface between a conductor and an insulator and method for manufacturing the same
12/21/2010US7855459 Modified gold-tin system with increased melting temperature for wafer bonding
12/21/2010US7855458 Electronic component
12/21/2010US7855457 Stacked multilayer structure and manufacturing method thereof
12/21/2010US7855456 Metal line of semiconductor device without production of high resistance compound due to metal diffusion and method for forming the same
12/21/2010US7855455 Lock and key through-via method for wafer level 3 D integration and structures produced
12/21/2010US7855454 Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
12/21/2010US7855453 Semiconductor device
12/21/2010US7855452 Semiconductor module, method of manufacturing semiconductor module, and mobile device
12/21/2010US7855451 Device having a contacting structure
12/21/2010US7855450 Circuit module
12/21/2010US7855449 Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
12/21/2010US7855448 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
12/21/2010US7855447 Semiconductor integrated circuit device, PDP driver, and plasma display panel
12/21/2010US7855446 Semiconductor memory device and semiconductor memory card
12/21/2010US7855445 Circuit device including rotated stacked die
12/21/2010US7855444 Mountable integrated circuit package system with substrate
12/21/2010US7855443 Stack structure of semiconductor packages and method for fabricating the stack structure
12/21/2010US7855442 Silicon based package
12/21/2010US7855441 Semiconductor card package and method of forming the same
12/21/2010US7855439 Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
12/21/2010US7855436 Semiconductor wafer
12/21/2010US7855435 Integrated circuit, method of manufacturing an integrated circuit, and memory module
12/21/2010US7855430 Electronic components on trenched substrates and method of forming same
12/21/2010US7855429 Electronic circuit device having silicon substrate
12/21/2010US7855426 Optical sensor assemblage and corresponding manufacturing method
12/21/2010US7855420 Structure for a latchup robust array I/O using through wafer via
12/21/2010US7855419 ESD device layout for effectively reducing internal circuit area and avoiding ESD and breakdown damage and effectively protecting high voltage IC
12/21/2010US7855415 Power semiconductor devices having termination structures and methods of manufacture
12/21/2010US7855397 Electronic assemblies providing active side heat pumping
12/21/2010US7855395 Light emitting diode package having multiple molding resins on a light emitting diode die
12/21/2010US7855342 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
12/21/2010US7855141 Semiconductor device having multiple wiring layers and method of producing the same
12/21/2010US7855112 Fabrication method of pixel structure
12/21/2010US7855103 Wirebond structure and method to connect to a microelectronic die
12/21/2010US7855100 Integrated circuit package system with an encapsulant cavity and method of fabrication thereof
12/21/2010US7855099 Manufacturing method for a secure-digital (SD) flash card with slanted asymmetric circuit board
12/21/2010US7855035 in the second exposure, an exposure light is incident on a region where the inspection mark is projected in the first exposure
12/21/2010US7854991 Single-walled carbon nanotube and aligned single-walled carbon nanotube bulk structure, and their production process, production apparatus and application use
12/21/2010US7854368 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
12/21/2010US7854062 Method for manufacturing circuit device
12/21/2010CA2406054C Method of forming vias in silicon carbide and resulting devices and circuits
12/17/2010CA2669375A1 Semiconductor application installation adapted with a temperature equalization system
12/16/2010WO2010144848A2 Stress balance layer on semiconductor wafer backside
12/16/2010WO2010144843A2 Intra-die routing using back side redistribution layer and associated method
12/16/2010WO2010144823A2 Method for manufacturing tight pitch, flip chip integrated circuit packages
12/16/2010WO2010144467A1 Through silicon via with embedded decoupling capacitor
12/16/2010WO2010144097A1 Hierarchical on-chip memory
12/16/2010WO2010143896A2 Heat-dissipating device and electronic apparatus having the same
12/16/2010WO2010143609A1 Method for producing electronic device, electronic device, semiconductor device, and transistor
12/16/2010WO2010143599A1 Method of producing electronic module, and electronic module
12/16/2010WO2010143597A1 Method for manufacturing circuit board, circuit board manufactured by the method, and base substrate used for the circuit board
12/16/2010WO2010143471A1 High-frequency switch module
12/16/2010WO2010143389A1 Semiconductor device
12/16/2010WO2010143376A1 Semiconductor device and process for manufacture thereof
12/16/2010WO2010143369A1 Semiconductor device and fabricating method therefor
12/16/2010WO2010143355A1 Wiring layer structure and process for manufacture thereof
12/16/2010WO2010143326A1 Semiconductor integrated circuit device and method for designing same
12/16/2010WO2010143283A1 Method for contact hole formation, method for manufacturing semiconductor device, and semiconductor device
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