Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/22/2010CN201681840U Embedded type single-island multi-circle pin packaging structure
12/22/2010CN201681839U Embedded multi-base single circle pin lead frame structure
12/22/2010CN201681838U Embedded type single-base-island multi-circle-lead-pin lead wire frame structure
12/22/2010CN201681837U Lead frame structure with embedded base island
12/22/2010CN201681836U Multi-salient-point and multi-base-island exposing type multi-circle pin and lead frame structure
12/22/2010CN201681835U Lead frame structure with a plurality of base islands with protruding points and of projection types and single loop pins
12/22/2010CN201681834U Lead frame structure for multi-salient single-base-island exposure type multi-turn pins
12/22/2010CN201681833U Multi-convex-point base island exposing type lead frame structure
12/22/2010CN201681832U Lead frame structure with a plurality of sinking base islands of projection types and multi loop pins
12/22/2010CN201681831U Lead frame for IC packaging
12/22/2010CN201681830U Semiconductor encapsulation element connected through silver plated bonding copper wire
12/22/2010CN201681829U Semiconductor packaging member connected by nickel-plated bonding copper wire
12/22/2010CN201681828U Wafer bump structure
12/22/2010CN201681827U Surface-mounting-type rectifier with pin structure
12/22/2010CN201681826U Surface mounted rectifier applied in circuit board
12/22/2010CN201681825U Heat pipe principle profile-type superconducting radiator
12/22/2010CN201681824U Radiating fin for power-type diode
12/22/2010CN201681823U High-power insulated electronic chip radiator
12/22/2010CN201681822U Convex column external heat dissipation plate encapsulation structure for base island embedded chip installing locking hole heat dissipation block
12/22/2010CN201681821U High heat-conduction interface device
12/22/2010CN201681820U Inner lead exposed flip chip package structure with locking hole of heat slug externally connected with cooling cap
12/22/2010CN201681819U Encapsulation structure with embedded inner pin, reversely arranged chip and heat radiation block externally connected with heat radiator through locking hole
12/22/2010CN201681818U Packaging structure of external heat radiator of upright heat-radiation block of chip of printed circuit board
12/22/2010CN201681817U Inner lead-embedded flip chip packaging structure with inverted T-shaped heat sink externally connected with radiator
12/22/2010CN201681816U Packaging structure with externally connected radiator for resin circuit board flip circuit
12/22/2010CN201681815U External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block
12/22/2010CN201681814U Packaging structure for radiator externally connected with inverted T-shaped radiating block with lock hole uprightly mounted above chip on printed circuit board
12/22/2010CN201681813U Profile-type superconductive radiator
12/22/2010CN201681812U Full-coating packaging structure of printed circuit board chip packaging heat dissipating block
12/22/2010CN201681811U Fully-enwrapped package structure of forward inverted T-shaped heat radiation block on PCB chip
12/22/2010CN201681810U Upright-mounting chip packaging structure of printed circuit board with inverted T-shaped radiating block
12/22/2010CN201681809U Upright-mounting chip packaging structure of printed circuit board provided with inverted T-shaped radiating block with locking holes
12/22/2010CN201681808U Inner lead embedded flip chip package structure with surface of heat slug protruding
12/22/2010CN201681807U Full-colored surface mounted (SMD) LED support
12/22/2010CN1957316B System for cooling heated electronic device
12/22/2010CN1881579B Light emitting apparatus
12/22/2010CN1819259B Package for gallium nitride semiconductor devices
12/22/2010CN1728380B 半导体器件 Semiconductor devices
12/22/2010CN1702863B Circuit device
12/22/2010CN101926004A Electrostatic discharge protection
12/22/2010CN101926001A Semiconductor package having marking layer
12/22/2010CN101926000A Embedded constrainer discs for reliable stacked vias in electronic substrates
12/22/2010CN101925999A Heat sink and method for producing heat sink
12/22/2010CN101925998A Board for mounting component, and package for holding component using same
12/22/2010CN101925997A Driver module structure
12/22/2010CN101925996A Method for reversibly mounting device wafer to carrier substrate
12/22/2010CN101925862A Lithography robustness monitor
12/22/2010CN101925534A Siliceous powder, process for production of the same, and use thereof
12/22/2010CN101925530A MEMS package having formed metal lid
12/22/2010CN101925290A Flat type heat radiating mechanism on heating surface with parallel radiator fins
12/22/2010CN101925288A Radiating device and fastener thereof
12/22/2010CN101925287A Radiating device and fastener thereof
12/22/2010CN101925286A Radiating device
12/22/2010CN101925285A Cooling plate structure and manufacturing method thereof
12/22/2010CN101925284A Improved heating panel structure and manufacturing method thereof
12/22/2010CN101925283A Method for combining fastening type fin set and heat pipes and structure thereof
12/22/2010CN101925277A Fixed element and electronic device using same
12/22/2010CN101924894A Mounting structure of electronic circuit unit
12/22/2010CN101924356A Improved ESD protective device, corresponding method and integrated circuit
12/22/2010CN101924108A Semiconductor memory device and production method therefor
12/22/2010CN101924106A Integrated circuit structure
12/22/2010CN101924102A Semiconductor device
12/22/2010CN101924099A Light-emitting diode device
12/22/2010CN101924098A Light-emitting diode module
12/22/2010CN101924097A Device for detecting thinning of the substrate of an integrated circuit chip
12/22/2010CN101924096A Through-silicon via structure and a process for forming the same
12/22/2010CN101924095A Interconnection structure of semiconductor integrated circuit and method for making the same
12/22/2010CN101924094A Semiconductor device and method of manufacturing semiconductor device
12/22/2010CN101924093A Semiconductor device and method of manufacturing semiconductor device
12/22/2010CN101924092A Semiconductor device
12/22/2010CN101924091A Circuit apparatus
12/22/2010CN101924090A 半导体封装元件及其制造方法 Semiconductor package device and manufacturing method
12/22/2010CN101924089A 半导体器件 Semiconductor devices
12/22/2010CN101924088A Integrated circuit structure
12/22/2010CN101924087A Inversed-chip lug structure and manufacturing process thereof
12/22/2010CN101924086A Control joint contact device for large power semiconductor component
12/22/2010CN101924085A Circuit device and method for manufacturing the circuit device
12/22/2010CN101924084A Packaged semiconductor piece and production method thereof
12/22/2010CN101924083A Packaged semiconductor and production method thereof
12/22/2010CN101924082A Heat releasing semiconductor package
12/22/2010CN101924081A Image sensor package and image sensor module
12/22/2010CN101924080A Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module
12/22/2010CN101924079A Semiconductor chip package structure
12/22/2010CN101924074A CMOS (Complementary Metal Oxide Semiconductor) sensor and manufacturing method thereof
12/22/2010CN101924073A CMOS (Complementary Metal-Oxide-Semiconductor Transistor) sensor and manufacture method thereof
12/22/2010CN101924063A Integrated circuit system employing low-K dielectrics and method of manufacture thereof
12/22/2010CN101924062A Memory device and method for manufacturing an integrated circuit device
12/22/2010CN101924051A Method and structure for detecting silicon nitride residue after direct chemically mechanical polishing of trench isolation process
12/22/2010CN101924048A Method of manufacturing electronic component
12/22/2010CN101924047A Semiconductor device and method of manufacturing the same
12/22/2010CN101924046A Method for forming wire bonding in semiconductor device
12/22/2010CN101924044A Method for producing a high power semiconductor module and high power semiconductor module with a connection device
12/22/2010CN101924043A Method for producing a current converter system with cooling device and a current converter system
12/22/2010CN101924040A Chip repairing method and chip stack structure
12/22/2010CN101924039A Packaged semiconductor piece and production method thereof
12/22/2010CN101924038A An electronic device package and method of manufacture
12/22/2010CN101924037A Method for manufacturing coreless capsulation substrates
12/22/2010CN101924027A Metal gate transistor, integrated circuits, systems, and fabrication methods thereof
12/22/2010CN101922774A Open external heat exchanging type semiconductor air conditioner
12/22/2010CN101922617A High-power light-emitting diode (LED) lamp device
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