Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/22/2010EP1472916B1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
12/22/2010EP1018092B1 Method for making an electronic module or label, resulting electronic module or label and medium containing such a module or label
12/22/2010CN201682727U Radiator and forming die thereof
12/22/2010CN201681943U Automobile rectifying bridge diode
12/22/2010CN201681941U N-channel medium-pressure large-current VDMOS device structure
12/22/2010CN201681940U Audion and lead frame thereof
12/22/2010CN201681938U Non-paddle multiturn pin passive device packaging structure
12/22/2010CN201681937U Packaging structure of passive component of electrostatic release ring with no basic island
12/22/2010CN201681936U Passive component packaging structure without substrate
12/22/2010CN201681935U Non-paddle multiturn pin static release ring passive device packaging structure
12/22/2010CN201681934U Encapsulating structure for passive device with base island and multi-ring pins
12/22/2010CN201681933U Pin-type packaging structure with direct placement of chip and reactive device
12/22/2010CN201681932U Encapsulation structure of multi-chip inversion and passive device
12/22/2010CN201681931U Chip reverse arrangement and passive device encapsulation structure
12/22/2010CN201681930U Encapsulation structure for passive device with multiple base-island embedded multi-turn pins
12/22/2010CN201681928U Carrier chip with metal ball bonding pad
12/22/2010CN201681924U Exposing type passive-component packaging structure of base island
12/22/2010CN201681923U System-level package structure for invert arrangement of chip and bonding of passive component on carrier chip
12/22/2010CN201681922U Nitrided aluminium-copper metallized ceramic substrate
12/22/2010CN201681921U Multi-bump single base island exposure type multi-circle pin encapsulation structure
12/22/2010CN201681920U Multi-salient-point base island embedded type base island multi-circle pin and passive device packaging structure
12/22/2010CN201681919U Multi-salient-point base-island exposed and embedded base-island multi-circle pin packaging structure
12/22/2010CN201681918U Packaging structure for passive device with multi-salient point exposed bases and embedded bases
12/22/2010CN201681917U Multi-convex-point base island exposing and embedding type base island single-ring pin encapsulating structure
12/22/2010CN201681916U Package structure of base-sunken and multi-projection base-bared type multi-pin passive elements
12/22/2010CN201681915U Sunk substrate exposure-type and multi-emboss substrate exposure-type multiturn pin packaging structure
12/22/2010CN201681914U Packaging structure of sinkage base and multi-projection base bared passive device
12/22/2010CN201681913U Sinking pad exposed type and multi-bump pad exposed type single ring pin package structure
12/22/2010CN201681912U Sunken pad exposed-type and embedded-type pad multi-turn pin passive device packaging structure
12/22/2010CN201681911U Sunken base island exposing and embedding type base island multi-ring pin encapsulating structure
12/22/2010CN201681910U Sunken base island exposing and embedding type base island passive device encapsulating structure
12/22/2010CN201681909U Sunken pad exposed-type and embedded-type pad single-turn pin packaging structure
12/22/2010CN201681908U Insular base exposure and multi-convex-point insular base exposure type multi-circle lead foot passive device packaging structure
12/22/2010CN201681907U Substrate-exposed and multi-projection-substrate-exposed type packaging structure with multiple circles of pins
12/22/2010CN201681906U Base island exposed and multi-bump base island exposed single-circle pin passive device encapsulation structure
12/22/2010CN201681905U Substrate-exposed and multi-projection-substrate-exposed type packaging structure
12/22/2010CN201681904U Base island exposed type and embedded type base island multi-circle pin passive device encapsulating structure
12/22/2010CN201681903U Encapsulation structure of base-island exposed and sinking base-island exposed passive device
12/22/2010CN201681902U Substrate-exposed and sunken-substrate-exposed type packaging structure with multiple circles of pins
12/22/2010CN201681901U Exposed base and exposed sinking-base multi-circle pin passive device packaging structure
12/22/2010CN201681900U Exposing type and embedded type base-island packaging structure
12/22/2010CN201681899U Island exposing and embedding and base-island passive device encapsulating structure
12/22/2010CN201681898U Base island and sunken base island exposing type encapsulating structure
12/22/2010CN201681897U Non-base island multi-pin static releasing coil packing structure
12/22/2010CN201681896U No-paddle dap packaging structure
12/22/2010CN201681895U Lead frame structure without base island
12/22/2010CN201681894U Substrate-free lead frame structure with multiple circles of pins
12/22/2010CN201681893U Lead frame structure with base islands
12/22/2010CN201681892U Basic island packaging structure
12/22/2010CN201681891U Direct-chip-placing multi-turn pin type encapsulation structure
12/22/2010CN201681890U Lead frame structure for direct placement by chip
12/22/2010CN201681889U Sinking base island exposed and embedded base island multi-circle pin lead frame structure
12/22/2010CN201681888U Base island lead wire frame structure with exposed type or embedded type sinking base island
12/22/2010CN201681887U Sunken substrate exposed type and multi-bump substrate exposed type lead frame structure with multiple circles of pins
12/22/2010CN201681886U Sunken-substrate-exposed and multi-projection-substrate-exposed type lead frame structure
12/22/2010CN201681885U Substrate embedded and multi-bump-substrate exposed type lead frame structure with multiple circles of pins
12/22/2010CN201681884U Embedded type base island and multi-convex-point base island lead wire frame structure
12/22/2010CN201681883U Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures
12/22/2010CN201681882U Substrate-exposed and sunken-substrate-exposed type lead frame structure
12/22/2010CN201681881U Island exposing and embedding and island multi-circle pin lead-frame structure
12/22/2010CN201681880U Base island exposed type and embedded type base island lead frame structure
12/22/2010CN201681879U Base island exposure type and multi-bump base island exposure type multi-circle pin lead frame structure
12/22/2010CN201681878U Base-island exposing type and multi-protruding-point base-island exposing lead frame structures
12/22/2010CN201681877U Sinking base island exposed encapsulation structure
12/22/2010CN201681876U Packaging structure with exposed multiple-salient point bases
12/22/2010CN201681875U Multi-base-island exposed type passive device encapsulation structure with multiple circles of pins
12/22/2010CN201681874U Insular base exposure type packaging structure
12/22/2010CN201681873U Multiple base island exposing type single-ring pin packaging structure
12/22/2010CN201681872U Encapsulation structure for multiple base-island exposure type multi-turn pins
12/22/2010CN201681871U Single-base-island exposed type multiple-circle pin packaging structure
12/22/2010CN201681870U Passive device packaging structure with single base island of projection type and multi loop pins
12/22/2010CN201681869U Multi-chip flipping and packaging structure
12/22/2010CN201681868U Chip inversion encapsulating structure
12/22/2010CN201681867U Multi-base island embedded type multi-turn pin encapsulation structure
12/22/2010CN201681866U Multi-base-island embedded type passive device encapsulation structure with single circle of pins
12/22/2010CN201681865U A plurality of base island embedding type pin encapsulating structure
12/22/2010CN201681864U Passive device packaging structure with embedded single base island and multi loop pins
12/22/2010CN201681863U Embedded type single-island multi-circle pin packaging structure
12/22/2010CN201681862U Embedded type island passive device packaging structure
12/22/2010CN201681861U Embedded base island encapsulation structure
12/22/2010CN201681860U Passive device packaging structure with a plurality of multi-protruding-point base islands of projection types and multi loop pins
12/22/2010CN201681859U Encapsulation structure for multiple multi-salient base-island exposure type multi-turn pins
12/22/2010CN201681858U Passive device packaging structure with a plurality of multi-protruding-point base islands of projection types and single loop pins
12/22/2010CN201681857U Multi-salient-point base-island exposed single-circle pin packaging structure
12/22/2010CN201681856U Multi-salient point single base island exposed type multi-circle pin passive device encapsulating structure
12/22/2010CN201681855U Encapsulation structure of exposed passive device with multiple salient-point base islands
12/22/2010CN201681854U Multi-sunk-base-island exposing type multi-circle pin passive device packaging structure
12/22/2010CN201681853U Exposed multiple sinking-base multi-circle pin packaging structure
12/22/2010CN201681852U Multi-sunk-base-island exposing type single-circle pin passive device packaging structure
12/22/2010CN201681851U Multiple sinking base island exposing type single-ring pin packaging structure
12/22/2010CN201681850U Single sunken substrate exposed type packaging structure with multiple circles of pins and passive components
12/22/2010CN201681849U Sunk single-base-island exposed type multi-ring lead pin encapsulation structure
12/22/2010CN201681848U Sunken-substrate-exposed packaging structure for passive components
12/22/2010CN201681847U Lead frame structure with a plurality of sinking base islands of projection types and single loop pins
12/22/2010CN201681846U Single sinking base island exposing type multi-circle pin lead frame structure
12/22/2010CN201681845U Exposed type lead frame structure of sunken base island
12/22/2010CN201681844U Lead frame structure with multiple exposed bases and multiturn pins
12/22/2010CN201681843U Lead frame structure of exposed single-ring lead feet with multiple base islands
12/22/2010CN201681842U Lead frame structure with single exposed base and multiturn pins
12/22/2010CN201681841U Lead frame structure with exposed base island
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