Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/23/2010WO2010147140A1 Barrier layer, film deposition method, and treating system
12/23/2010WO2010147120A1 Inductor element with core and method for producing the same
12/23/2010WO2010147000A1 Laminated wiring board
12/23/2010WO2010146979A1 Resin composition for encapsulation of photosemiconductors
12/23/2010WO2010146863A1 Ic package
12/23/2010WO2010145712A1 Crack reduction at metal/organic dielectric interface
12/23/2010WO2010145434A1 Heat exchanger, heat dissipation method of same and communication apparatus
12/23/2010WO2010126448A3 Novel bonding process and bonded structures
12/23/2010WO2010110572A3 Light-emitting diode package
12/23/2010US20100324402 Analyte Monitoring Device and Methods of Use
12/23/2010US20100324400 Analyte monitoring device and methods of use
12/23/2010US20100324399 Analyte monitoring device and methods of use
12/23/2010US20100324396 Analyte Monitoring Device and Methods of Use
12/23/2010US20100324394 Analyte Monitoring Device and Methods of Use
12/23/2010US20100323656 Methods of operating electronic devices, and methods of providing electronic devices
12/23/2010US20100323475 Integrated circuit device
12/23/2010US20100321914 Multilayer printed wiring board
12/23/2010US20100321705 Semiconductor device and method of manufacturing the same
12/23/2010US20100321555 Solid state imaging device and manufacturing method thereof
12/23/2010US20100321544 Semiconductor device, camera module and method of manufacturing semiconductor device
12/23/2010US20100321093 Reference voltage output circuit
12/23/2010US20100321037 Configurable voltage regulator
12/23/2010US20100320624 Die package including encapsulated die and method of manufacturing the same
12/23/2010US20100320623 Semiconductor device and method for manufacturing the same
12/23/2010US20100320622 Electronic component built-in wiring substrate and method of manufacturing the same
12/23/2010US20100320621 Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof
12/23/2010US20100320620 Adhesive film for semiconductor and semiconductor device using the adhesive film
12/23/2010US20100320619 Integrated circuit packaging system with interposer and method of manufacture thereof
12/23/2010US20100320618 Interconnection substrate, semiconductor device, and production method of semiconductor device
12/23/2010US20100320617 Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer
12/23/2010US20100320616 Semiconductor device and method of manufacturing the same
12/23/2010US20100320615 Semiconductor device and method for manufacturing the same
12/23/2010US20100320614 Semiconductor package and production method thereof, and semiconductor device
12/23/2010US20100320613 Integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks
12/23/2010US20100320612 Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer
12/23/2010US20100320611 Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer
12/23/2010US20100320610 Semiconductor package with substrate having single metal layer and manufacturing methods thereof
12/23/2010US20100320609 Wetting pretreatment for enhanced damascene metal filling
12/23/2010US20100320608 Semiconductor Substrate Contact VIA
12/23/2010US20100320607 Interconnect structures with a metal nitride diffusion barrier containing ruthenium
12/23/2010US20100320606 Method for Forming MEMS Devices Having Low Contact Resistance and Devices Obtained Thereof
12/23/2010US20100320605 Semiconductor device and method of fabricating the same
12/23/2010US20100320604 Application of mn for damage restoration after etchback
12/23/2010US20100320603 Integrated circuit package system with redistribution layer and method for manufacturing thereof
12/23/2010US20100320602 High-Speed Memory Package
12/23/2010US20100320601 Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof
12/23/2010US20100320600 Surface depressions for die-to-die interconnects and associated systems and methods
12/23/2010US20100320599 Die stacking apparatus and method
12/23/2010US20100320598 Semiconductor device and fabrication method thereof
12/23/2010US20100320597 Wafer level stack structure for system-in-package and method thereof
12/23/2010US20100320596 Method for fabricating semiconductor package and semiconductor package using the same
12/23/2010US20100320595 Hybrid hermetic interface chip
12/23/2010US20100320594 Semiconductor device with reinforcement plate and method of forming same
12/23/2010US20100320593 Chip Package Structure and Manufacturing Methods Thereof
12/23/2010US20100320592 Semiconductor device and method for manufacturing the same
12/23/2010US20100320591 Integrated circuit packaging system with contact pads and method of manufacture thereof
12/23/2010US20100320590 Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof
12/23/2010US20100320589 Integrated circuit packaging system with bumps and method of manufacture thereof
12/23/2010US20100320588 Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die
12/23/2010US20100320587 Integrated circuit packaging system with underfill and method of manufacture thereof
12/23/2010US20100320586 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
12/23/2010US20100320585 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
12/23/2010US20100320584 Semiconductor chip laminated body
12/23/2010US20100320583 Integrated circuit packaging system with a dual substrate package and method of manufacture thereof
12/23/2010US20100320582 Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof
12/23/2010US20100320581 Semiconductor device
12/23/2010US20100320580 Equipotential pad connection
12/23/2010US20100320579 Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhesion to Polymeric Compounds
12/23/2010US20100320578 Packaged ic device comprising an embedded flex circuit, and methods of making the same
12/23/2010US20100320577 Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-Up Interconnect Structure
12/23/2010US20100320576 Die-warpage compensation structures for thinned-die devices, and methods of assembling same
12/23/2010US20100320575 Thru silicon enabled die stacking scheme
12/23/2010US20100320565 Wafer and method for improving yield rate of wafer
12/23/2010US20100320563 Electronic fuses in semiconductor integrated circuits
12/23/2010US20100320561 Method for forming a one-time programmable metal fuse and related structure
12/23/2010US20100320560 Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof
12/23/2010US20100320559 Semiconductor device including independent active layers and method for fabricating the same
12/23/2010US20100320540 Semiconductor device structure and fabricating method thereof
12/23/2010US20100320531 Standing chip scale package
12/23/2010US20100320500 Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating and related device
12/23/2010US20100320468 Thin film transistor substrate and method of manufacturing the same
12/23/2010US20100320460 System for separation of an electrically conductive connection
12/23/2010US20100319987 Lead frame design to improve reliability
12/23/2010DE102010022316A1 Monolithischer Dual-Gate-Stromerfassungs-MOSFET mit niedriger Impedanz Monolithic dual-gate current detecting MOSFET with low impedance
12/23/2010DE102009029929A1 Electrostatic discharge protection circuit for integrated circuit, has multi-finger metal-oxide-semiconductor field-effect transistor as clamping element between operating voltage sources
12/23/2010DE102009029336A1 Verfahren und Struktur zum Schutz vor elektrostatischer Entladung für elektronische Produkte Method and structure for protecting against electrostatic discharge Electronic Products
12/23/2010DE102009013114B4 Oberflächenmontierbarer Magnetfeldsensor mit einem Halbleiterchip, Magnetfeldmessvorrichtung und Verfahren zur Herstellung einer Schaltungsplatine mit einem Magnetfeldsensor Surface mount magnetic field sensor comprising a semiconductor chip, magnetic field measuring device and method of manufacturing a circuit board having a magnetic field sensor
12/23/2010DE102006027481B4 Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen Power semiconductor module with mutually electrically insulated connecting elements
12/22/2010EP2265101A1 Printed circuit board and method of manufacturing printed circuit board
12/22/2010EP2265099A1 Semiconductor device and method of manufacturing the same
12/22/2010EP2264761A2 Method for producing a high power semiconductor module and high power semiconductor module with a connection device
12/22/2010EP2264760A2 Control connection contact device for a high power semiconductor device
12/22/2010EP2264759A2 Element for identifying an integrated circuit chip
12/22/2010EP2264758A2 Interconnection structure in semiconductor device
12/22/2010EP2264757A2 Active area bonding compatible high current structures
12/22/2010EP2264754A1 Method for formation of siliceous film and siliceous film formed by the method
12/22/2010EP2264219A1 Material for chemical vapor deposition, silicon-containing insulating film and process for production thereof
12/22/2010EP2263431A1 Housing with a cooling unit for power electronics
12/22/2010EP1905076B1 Arrangement of an electric component and a two-phase cooling device and method for manufacturing the arrangement
12/22/2010EP1742895B1 Preparation of cement films by strip casting
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