Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/29/2010CN101930918A Semiconductor structure and lateral wall partitioning method
12/29/2010CN101930905A Detection structure and on-line wafer monitoring method
12/29/2010CN101930716A Display panel driver
12/29/2010CN101929818A Uniform-temperature panel and manufacturing method thereof
12/29/2010CN101929667A Heat dissipating device of LED edge type backlight module
12/29/2010CN101929627A Illumination device
12/29/2010CN101929626A 照明装置 Lighting device
12/29/2010CN101927426A Uniform-temperature panel and manufacturing method thereof
12/29/2010CN101927304A Method for manufacturing heat sink and heat sink
12/29/2010CN101651135B 66kV optically-controlled water-cooling thyristor valve box
12/29/2010CN101604674B Wafer level fan-out chip packaging structure
12/29/2010CN101582397B Semiconductor device and manufacturing method thereof
12/29/2010CN101494226B Thin-film transistor substrate and method of manufacturing the same, wiring structure and method of manufacturing the same
12/29/2010CN101488518B Organic light emitting display device
12/29/2010CN101483159B Chip construction and process thereof, chip stacking construction and process thereof
12/29/2010CN101441331B Semiconductor device including semiconductor thin film, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film
12/29/2010CN101420007B Encapsulation construction and method for LED wafer
12/29/2010CN101373720B Method of manufacturing semiconductor device
12/29/2010CN101355117B Led
12/29/2010CN101351882B Electronic module, and method for producing one
12/29/2010CN101271916B Electrostatic-resistant gallium nitride illumination device and production method thereof
12/29/2010CN101271891B Electrostatic discharge protecting equipment and manufacturing method thereof
12/29/2010CN101261963B Miniature electronic part and making method
12/29/2010CN101247715B Thermal diffusion sheet and manufacturing method of the same
12/29/2010CN101236917B Contact forming method on adjacent underlay and related semiconductor device
12/29/2010CN101221629B Smart card chip and method for input/output pads placement for a smart card chip
12/29/2010CN101207995B Heat radiation model set and electronic device adopting the same
12/29/2010CN101141865B Heat radiating device
12/29/2010CN101141864B Fastener and heat radiating device using the same
12/29/2010CN101128102B Heat radiator and its radiator
12/29/2010CN101123232B Semiconductor apparatus
12/29/2010CN101090114B 半导体装置 Semiconductor device
12/29/2010CN101076236B Radiator
12/29/2010CN101068005B Semiconductor device package leadframe formed from multiple metal layers
12/29/2010CN101060102B Nitride semiconductor substrate, method of making the same and epitaxial substrate for nitride semiconductor light emitting device
12/29/2010CN101056525B Heat radiator
12/29/2010CN101047034B Memory
12/29/2010CN101023528B Electric assembly processor, contact assembly and double side contacts element
12/29/2010CN101005081B Non-volatile memory device, and manufacturing method and programming method thereof
12/28/2010US7860544 Analyte monitoring device and methods of use
12/28/2010US7859855 Module and mounted structure using the same
12/28/2010US7859847 Spring adapted to hold electronic device in a frame
12/28/2010US7859586 Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip
12/28/2010US7859123 Wire bonding structure and manufacturing method thereof
12/28/2010US7859122 Final via structures for bond pad-solder ball interconnections
12/28/2010US7859121 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same
12/28/2010US7859120 Package system incorporating a flip-chip assembly
12/28/2010US7859119 Stacked flip chip die assembly
12/28/2010US7859118 Multi-substrate region-based package and method for fabricating the same
12/28/2010US7859117 Clocking architecture in stacked and bonded dice
12/28/2010US7859116 Exposed metal bezel for use in sensor devices and method therefor
12/28/2010US7859115 Semiconductor package for improving characteristics for transmitting signals and power
12/28/2010US7859114 IC chip and design structure with through wafer vias dishing correction
12/28/2010US7859113 Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method
12/28/2010US7859112 Additional metal routing in semiconductor devices
12/28/2010US7859111 Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device
12/28/2010US7859109 Gallium nitride-based III-V group compound semiconductor device and method of manufacturing the same
12/28/2010US7859108 Flip chip package and method for manufacturing the same
12/28/2010US7859107 Solder attach film and assembly
12/28/2010US7859106 Multilayer printed circuit board using paste bumps
12/28/2010US7859105 Power converter, power system provided with same, and mobile body
12/28/2010US7859104 Thermal interface material having carbon nanotubes and component package having the same
12/28/2010US7859103 Semiconductor module and inverter device
12/28/2010US7859102 Multi-layer stacked wafer level semiconductor package module
12/28/2010US7859101 Die-up ball grid array package with die-attached heat spreader
12/28/2010US7859100 Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the same
12/28/2010US7859099 Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
12/28/2010US7859098 Embedded integrated circuit package system
12/28/2010US7859097 Semiconductor device and method of fabricating semiconductor device
12/28/2010US7859095 Method of manufacturing semiconductor device
12/28/2010US7859094 Integrated circuit package system for stackable devices
12/28/2010US7859093 Method for protecting encapsulated sensor structures using stack packaging
12/28/2010US7859092 Package structures
12/28/2010US7859091 Manufacturing methods for semiconductor device with sealed cap
12/28/2010US7859090 Die attach method and leadframe structure
12/28/2010US7859089 Copper straps
12/28/2010US7859088 Semiconductor device manufacturing method, wafer, and wafer manufacturing method
12/28/2010US7859087 Semiconductor device
12/28/2010US7859084 Semiconductor substrate
12/28/2010US7859079 Power semiconductor device
12/28/2010US7859067 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same
12/28/2010US7859056 Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection
12/28/2010US7859016 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
12/28/2010US7858532 Dielectric layer structure and manufacturing method thereof
12/28/2010US7858444 Electronic device and method of manufacturing thereof
12/28/2010US7858442 Leaded stacked packages having elevated die paddle
12/28/2010US7858440 Stacked semiconductor chips
12/28/2010US7858181 Growth of single crystal nanowires
12/28/2010US7857229 Securities, chip mounting product, and manufacturing method thereof
12/28/2010US7856711 Method of forming a substrate with interposer channels for cooling the substrate
12/23/2010WO2010147934A1 Semiconductor die terminal
12/23/2010WO2010147759A2 Use of ionomeric silicone thermoplastic elastomers in electronic devices
12/23/2010WO2010147728A2 Non-snapback scr for electrostatic discharge protection
12/23/2010WO2010147694A1 Integrated circuit package having security feature and method of manufacturing same
12/23/2010WO2010147336A2 Chip on board module
12/23/2010WO2010147202A1 Power converter
12/23/2010WO2010147201A1 Power conversion device
12/23/2010WO2010147199A1 Wiring board and power conversion device
12/23/2010WO2010147187A1 Semiconductor device
12/23/2010WO2010147141A1 Film deposition method, pretreatment device, and treating system
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