Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2010
12/30/2010DE19964427B4 Halbleiterteile Semiconductor parts
12/30/2010DE112009000425T5 Mikromodule mit integrierten Dünnfilminduktoren und Verfahren zum Herstellen dieser Micro-modules with integrated Dünnfilminduktoren and methods for preparing these
12/30/2010DE102010017278A1 Transistorebenen-Routing Transistor-level routing
12/30/2010DE102010016729A1 Verfahren und Vorrichtung zum Markieren von Objekten Method and apparatus for marking objects
12/30/2010DE102009031009A1 Radiation-emitting device is provided with carrier, radiation-emitting semiconductor chip, which is mounted on upper side of carrier at carrier, and protective cap
12/30/2010DE102009031008A1 Optoelektronisches Bauteil The optoelectronic device
12/30/2010DE102009029769A1 Electronic component has housing part made of plastic and another housing part made of plastic and electronic part media-tight enclosed by housing parts
12/30/2010DE102009020540A1 Method of producing electronic module, involves moving carrier to downstream processing point while aligning position of electronic component with respect to structure on liquid meniscus
12/30/2010DE102007050241B4 Speichermodul und Testsystem Memory module test system, and
12/29/2010WO2010151814A1 High density mim capacitor embedded in a substrate
12/29/2010WO2010151578A2 Electrical interconnect for die stacked in zig-zag configuration
12/29/2010WO2010151506A1 Integrated circuit assembly
12/29/2010WO2010151375A1 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
12/29/2010WO2010151350A1 Multi-chip package and method of providing die-to-die interconnects in same
12/29/2010WO2010151148A1 Connecting solar cell tabs to a solar cell busbar and a solar cell so produced
12/29/2010WO2010150912A1 Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
12/29/2010WO2010150820A1 Multi-pattern wiring substrate, wiring-substrate, and electronic device
12/29/2010WO2010150747A1 Heat sink
12/29/2010WO2010150729A1 Element storage package and mounting structure
12/29/2010WO2010150487A1 Resin composition for sealing semiconductors, and semiconductor device
12/29/2010WO2010150430A1 Semiconductor device and process for manufacture thereof
12/29/2010WO2010150365A1 Semiconductor device and method for manufacturing semiconductor device
12/29/2010WO2010150330A1 Optical semiconductor device, optical pickup device using same, and electronic apparatus
12/29/2010WO2010150297A1 Semiconductor package and semiconductor package mounting structure
12/29/2010WO2010149533A1 Direct jet impingement-assisted thermosyphon cooling apparatus and method
12/29/2010WO2010148557A1 Method for manufacturing sun-flower shaped radiating fin and heat sink
12/29/2010WO2010126302A3 Semiconductor package with nsmd type solder mask and method for manufacturing the same
12/29/2010WO2010093449A3 Thermoelectric feedback circuit
12/29/2010EP2267799A1 Light-emitting diode package
12/29/2010EP2267772A1 Device for detecting thinning of the substrate of an integrated circuit chip
12/29/2010EP2267771A2 Method and apparatus for cooling electronic components
12/29/2010EP2267770A1 Semiconductor package and method for manufacturing the same
12/29/2010EP2267521A1 Liquid crystal display device
12/29/2010EP2267173A1 Copper alloy material for electric and electronic apparatuses, and electric and electronic components
12/29/2010EP2267080A1 Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film
12/29/2010EP2266139A1 Optoelectronic component and method for producing an optoelectronic component
12/29/2010EP2266138A1 Microwave assembly
12/29/2010EP2116115B1 Method for the production of a pluggable connection contact on a semiconductor module and semiconductor module produced by this method
12/29/2010EP1915776B1 Technique for efficiently patterning an underbump metallization layer using a two-step cleaning process
12/29/2010EP1540728B1 Forming a multi segment integrated circuit with isolated substrates
12/29/2010EP1269540B1 Modular printhead alignment system
12/29/2010CN201690724U Radiating module structure
12/29/2010CN201689890U Tandem type light emitting diode having feedback function
12/29/2010CN201689889U Cascade circuit for physical layer of Ethernet
12/29/2010CN201689885U Ultrathin chip rectifier bridge
12/29/2010CN201689883U Led device
12/29/2010CN201689882U Wafer and wafer grinding tool
12/29/2010CN201689881U Chip gold-gold packaging structure
12/29/2010CN201689880U Safe chip
12/29/2010CN201689879U Radiating device
12/29/2010CN201689878U Radiating fin
12/29/2010CN201689877U Radiator for thyristors
12/29/2010CN201689876U Stitching structure of semiconductor chip
12/29/2010CN1971910B LCD apparatus, pixel array base plate and method for preventing flicker of display panel
12/29/2010CN1917221B Display substrate, method of manufacturing the same and display device having the same
12/29/2010CN1670978B Method for manufacturing electronic device
12/29/2010CN1643444B Electrochromic rearview mirror assembly incorporating a display/signal light
12/29/2010CN101933411A Pre-heating system and method for silicon dies
12/29/2010CN101933140A Nanostructures and methods of making the same
12/29/2010CN101933139A Semiconductor device and method for fabricating the same
12/29/2010CN101933138A Metal housing part and method for producing the housing part
12/29/2010CN101933034A Manufacture of a smart card
12/29/2010CN101932684A Thermally conductive silicone grease composition
12/29/2010CN101932663A Conductive inks
12/29/2010CN101932221A Radiating device and radiating method thereof
12/29/2010CN101932219A Water-cooling device and manufacturing method thereof
12/29/2010CN101932166A Illumination device and control method thereof
12/29/2010CN101931035A Separation method of nitride semiconductor layer, semiconductor device, semiconductor wafer, and manufacturing method thereof
12/29/2010CN101930986A Semiconductor device, camera module and method of manufacturing semiconductor device
12/29/2010CN101930980A Semiconductor device having saddle fin-shaped channel and method for manufacturing the same
12/29/2010CN101930977A Power metal oxide semiconductor field effect transistor (MOSFET) device with tungsten spacing layer in contact hole and preparation method thereof
12/29/2010CN101930973A Electrostatic discharge structures and methods of manufacture
12/29/2010CN101930971A Multi-chip package and method for forming same
12/29/2010CN101930969A Semiconductor package with electromagnetic interference protection cover
12/29/2010CN101930968A Element for identifying an integrated circuit chip
12/29/2010CN101930967A Semiconductor device and method of fabricating the same
12/29/2010CN101930966A Circuit layout structure and method for narrowing integrated circuit layout
12/29/2010CN101930965A Structure of power grid for semiconductor devices and method of making the same
12/29/2010CN101930964A Mounting substrate, and method for manufacturing thin light-emitting device using same
12/29/2010CN101930963A Segment difference type ceramic copper-clad plate unit and manufacturing method thereof
12/29/2010CN101930962A Capsulation module for electronic components
12/29/2010CN101930961A Packaging structure
12/29/2010CN101930960A Ic chip package and forming method
12/29/2010CN101930959A Copper conductive paste, method of manufacturing substrate with copper conductor filled in through-hole, circuit substrate, electronic component, semiconductor package
12/29/2010CN101930958A Semiconductor packaging element and production method thereof
12/29/2010CN101930957A Power semiconductor device package and fabrication method
12/29/2010CN101930956A Chip packaging structure and manufacturing method thereof
12/29/2010CN101930955A Packaging structure and making method thereof
12/29/2010CN101930954A Radiating structure for SOI field effect transistor
12/29/2010CN101930953A Semiconductor device assembly and radiator assembly
12/29/2010CN101930952A Compliant multilayered thermally-conductive interface assemblies and memory modules including the same
12/29/2010CN101930951A Radiator combination
12/29/2010CN101930950A 半导体装置 Semiconductor device
12/29/2010CN101930947A CMOS (Complementary Metal-Oxide-Semiconductor) transistor and making method thereof
12/29/2010CN101930936A Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package
12/29/2010CN101930935A Lead frame design to improve reliability
12/29/2010CN101930933A Method for manufacturing semiconductor device
12/29/2010CN101930931A Packaging circuit substrate structure and manufacturing method thereof
12/29/2010CN101930929A Manufacturing method of packaging base plate provided with side surface lines
12/29/2010CN101930928A Manufacturing method of thin base plate for packaging semiconductor
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