Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2011
01/04/2011US7863723 Adhesive on wire stacked semiconductor package
01/04/2011US7863722 Stackable semiconductor assemblies and methods of manufacturing such assemblies
01/04/2011US7863721 Method and apparatus for wafer level integration using tapered vias
01/04/2011US7863720 Method and system for stacking integrated circuits
01/04/2011US7863719 Wafer level chip scale package
01/04/2011US7863718 Electronic tag chip
01/04/2011US7863716 Method and apparatus of power ring positioning to minimize crosstalk
01/04/2011US7863715 Stack package and stack packaging method
01/04/2011US7863714 Monolithic MEMS and integrated circuit device having a barrier and method of fabricating the same
01/04/2011US7863705 Semiconductor device having a bonding pad structure including an annular contact
01/04/2011US7863702 Image sensor package and method of manufacturing the same
01/04/2011US7863666 Capacitor pair structure for increasing the match thereof
01/04/2011US7863654 Top layers of metal for high performance IC's
01/04/2011US7863640 Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same
01/04/2011US7863624 Silicon carbide on diamond substrates and related devices and methods
01/04/2011US7863606 Semiconductor-on-diamond devices and methods of forming
01/04/2011US7863529 Electronic component
01/04/2011US7863527 Lead frame mount for circuit component
01/04/2011US7863526 High performance chip carrier substrate
01/04/2011US7863200 Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules
01/04/2011US7863176 Low-resistance interconnects and methods of making same
01/04/2011US7863110 Semiconductor device and method for fabricating the same
01/04/2011US7863109 Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
01/04/2011US7863108 Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
01/04/2011US7863106 Silicon interposer testing for three dimensional chip stack
01/04/2011US7863100 Integrated circuit packaging system with layered packaging and method of manufacture thereof
01/04/2011US7863090 Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system
01/04/2011US7862857 using solution/suspension of precursors: lead bis(2,2,6,6-tetramethyl-3,5-heptanedionate) N,N',N''-pentamethyl diethylenetriamine, zirconium bis(isopropoxide)bis(2,2,6,6-tetramethyl-3,5-heptanedionate, and titanium bis(isopropoxide)bis(2,2,6,6-tetramethyl-3,5-heptanedionate) in octane, decane, polyamine
01/04/2011US7862796 semiconductors; chemical vapor deposition; organic light emitting device
01/04/2011US7861912 Fabrication method of semiconductor integrated circuit device
01/04/2011CA2561955C Embedded capacitors using conductor filled vias
01/04/2011CA2522239C Anisotropic conductive film and manufacturing method thereof
12/2010
12/30/2010US20100330744 Ultrathin semiconductor circuit having contact bumps and corresponding production method
12/30/2010US20100328917 Multichip module, printed circuit board unit, and electronic apparatus
12/30/2010US20100328915 Printed circuit board and method of manufacturing printed circuit board
12/30/2010US20100328028 Flexible semiconductor device and identification label
12/30/2010US20100327908 Method and apparatus for die testing on wafer
12/30/2010US20100327467 Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device
12/30/2010US20100327466 Technique for fabricating microsprings on non-planar surfaces
12/30/2010US20100327465 Package process and package structure
12/30/2010US20100327464 Layered chip package
12/30/2010US20100327461 Electrical interconnect for die stacked in zig-zag configuration
12/30/2010US20100327460 Capactive connectors with enhanced capacitive coupling
12/30/2010US20100327459 Semiconductor device having plurality of wiring layers and designing method thereof
12/30/2010US20100327458 Semiconductor device
12/30/2010US20100327457 Semiconductor chip and semiconductor device
12/30/2010US20100327456 Process for Improving the Reliability of Interconnect Structures and Resulting Structure
12/30/2010US20100327455 Semiconductor device including two heat sinks and method of manufacturing the same
12/30/2010US20100327454 Semiconductor device, and method of fabricating semiconductor device
12/30/2010US20100327453 Semiconductor Device and Method of Manufacturing the Same
12/30/2010US20100327452 Mounting structure and method of manufacturing the same
12/30/2010US20100327451 Alignment mark
12/30/2010US20100327450 Semiconductor device bonding wire and wire bonding method
12/30/2010US20100327449 Semiconductor device and manufacturing method of semiconductor device
12/30/2010US20100327448 Semiconductor with Bottom-Side Wrap-Around Flange Contact
12/30/2010US20100327447 Method of manufacturing semiconductor device and semiconductor device
12/30/2010US20100327446 Via gouged interconnect structure and method of fabricating same
12/30/2010US20100327445 Structure of power grid for semiconductor devices and method of making the same
12/30/2010US20100327444 Sheet structure, semiconductor device and method of growing carbon structure
12/30/2010US20100327443 Joining structure and a substrate-joining method using the same
12/30/2010US20100327442 Package and the Method for Making the Same, and a Stacked Package
12/30/2010US20100327441 Semiconductor device, semiconductor package and wiring structure
12/30/2010US20100327440 3-d semiconductor die structure with containing feature and method
12/30/2010US20100327439 Semiconductor package and method of forming the same
12/30/2010US20100327438 Near chip scale semiconductor packages
12/30/2010US20100327437 Wiring board and semiconductor device using the wiring board
12/30/2010US20100327436 Apparatus and method for stacking integrated circuits
12/30/2010US20100327435 Electronic component and manufacture method thereof
12/30/2010US20100327434 Semiconductor device and method of manufacturing the same
12/30/2010US20100327433 High Density MIM Capacitor Embedded in a Substrate
12/30/2010US20100327432 Package with heat transfer
12/30/2010US20100327431 Semiconductor Chip Thermal Interface Structures
12/30/2010US20100327430 Semiconductor device assembly having a stress-relieving buffer layer
12/30/2010US20100327429 Semiconductor package structure and package method thereof
12/30/2010US20100327428 Package manufacturing method and semiconductor device
12/30/2010US20100327427 Semiconductor device and method for manufacturing the same
12/30/2010US20100327426 Semiconductor chip package and method of manufacturing the same
12/30/2010US20100327425 Flat chip package and fabrication method thereof
12/30/2010US20100327424 Multi-chip package and method of providing die-to-die interconnects in same
12/30/2010US20100327423 Semiconductor packaging structure and method for manufacturing the same
12/30/2010US20100327422 Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
12/30/2010US20100327421 Ic package design with stress relief feature
12/30/2010US20100327420 Semiconductor device with embedded interconnect pad
12/30/2010US20100327418 Integrated circuit package system using heat slug
12/30/2010US20100327417 Electronic device having a molding compound including a composite material
12/30/2010US20100327416 Laser beam machining method, laser beam machining apparatus, and laser beam machining product
12/30/2010US20100327403 Semiconductor chip, semiconductor wafer, method of manufacturing semiconductor chip
12/30/2010US20100327402 Fuse structure for high integrated semiconductor device
12/30/2010US20100327401 Fuse of semiconductor device
12/30/2010US20100327400 Fuse structure and fabrication method thereof
12/30/2010US20100327399 Electrically programmable fuse using anisometric contacts and fabrication method
12/30/2010US20100327393 Method and structures for etching cavity in silicon under dielectric membrane
12/30/2010US20100327379 Capped integrated device with protective cap, composite wafer incorporating integrated devices and process for bonding integrated devices with respective protective caps
12/30/2010US20100327343 Bond pad with integrated transient over-voltage protection
12/30/2010US20100327338 Semiconductor memory device including multi-layer gate structure
12/30/2010US20100327307 Optoelectronic Component
12/30/2010US20100326722 Mesh sheet and housing for electronic devices
12/30/2010US20100326721 Electronic device and method of manufacturing the same
12/30/2010US20100325882 System And Method For Processor Power Delivery And Thermal Management
12/30/2010DE202010008705U1 Arrayartiges Multi-Chip-Gehäuse für LEDs Array-like multi-chip package for LEDs
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