| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/05/2011 | CN101937907A Chip stacking package structure and manufacture method thereof |
| 01/05/2011 | CN101937906A Circuit for calibrating impedance and semiconductor apparatus using the same |
| 01/05/2011 | CN101937905A Semiconductor encapsulating part and manufacture method thereof |
| 01/05/2011 | CN101937904A Semiconductor device and method of manufacturing the same |
| 01/05/2011 | CN101937903A Semiconductor device and method of manufacturing the same |
| 01/05/2011 | CN101937902A Semiconductor device and method for manufacturing same |
| 01/05/2011 | CN101937901A Wire substrate as well as manufacturing method and packaging structure thereof |
| 01/05/2011 | CN101937900A Micro and millimeter wave circuit |
| 01/05/2011 | CN101937899A Semiconductor packaging structure and packaging technology thereof |
| 01/05/2011 | CN101937898A Rectifier structure for moisture protection |
| 01/05/2011 | CN101937897A Triode lead frame and manufacturing method thereof |
| 01/05/2011 | CN101937896A Lead frame for manufacturing rectifier |
| 01/05/2011 | CN101937895A Semiconductor packaging component |
| 01/05/2011 | CN101937894A Semiconductor device including through-electrode and method of manufacturing the same |
| 01/05/2011 | CN101937893A Semiconductor device |
| 01/05/2011 | CN101937892A Semiconductor chip, method of fabricating the same, and stack module and memory card |
| 01/05/2011 | CN101937891A Chip provided with double layers of pins |
| 01/05/2011 | CN101937890A Circuit board having semiconductor chip |
| 01/05/2011 | CN101937889A Semiconductor element packaging structure and packaging method thereof |
| 01/05/2011 | CN101937888A Circuit, system and method for controlling radiating of multiple units on circuit board |
| 01/05/2011 | CN101937887A Wafer structure and water processing method |
| 01/05/2011 | CN101937886A Thin chip package structure and method |
| 01/05/2011 | CN101937885A Semiconductor packaging piece and manufacture method thereof |
| 01/05/2011 | CN101937884A Semiconductor packaging member |
| 01/05/2011 | CN101937883A Semiconductor device and method for manufacturing the same |
| 01/05/2011 | CN101937882A Electronic element, composite structure with supporting element thereof and supporting element |
| 01/05/2011 | CN101937881A Semiconductor packaging structure and packaging method thereof |
| 01/05/2011 | CN101937880A Thin wafer handling structure, and thin wafer bounding and releasing method |
| 01/05/2011 | CN101937877A Interconnection wiring structure of a semiconductor device and method for manufacturing same |
| 01/05/2011 | CN101937855A Manufacture method for buried capsulation structure of component and capsulation structure thereof |
| 01/05/2011 | CN101937851A Anisotropic conductive film and method for manufacturing conductive particle thereof |
| 01/05/2011 | CN101937850A 封装制造方法和半导体装置 The semiconductor package manufacturing method and apparatus |
| 01/05/2011 | CN101937835A Method for modifying parameters for fuse-class wafer |
| 01/05/2011 | CN101937172A Positive type radiation-sensitive composition, cured film, interlayer insulating film, method for forming method interlayer insulating film, display element and siloxane polymer |
| 01/05/2011 | CN101936495A Device for actively cooling LED (light emitting diode) and recycling waste heat |
| 01/05/2011 | CN101936460A Light-emitting diode lamp |
| 01/05/2011 | CN101684900B LED package module |
| 01/05/2011 | CN101684899B LED package module |
| 01/05/2011 | CN101630644B Method for manufacturing large-scale integrated circuit lead frame |
| 01/05/2011 | CN101621042B Prolate glass sealed surface mounting diode and packaging tape thereof |
| 01/05/2011 | CN101582423B Pixel structure and making method thereof |
| 01/05/2011 | CN101581408B LED bulb |
| 01/05/2011 | CN101576242B Radiating method of high-power LED radiator and radiator for implementing same |
| 01/05/2011 | CN101576241B Radiating method of LED radiator and radiator for implementing same |
| 01/05/2011 | CN101572255B Method for making carbon nanotube composite thermal interface material |
| 01/05/2011 | CN101572237B Encapsulation structure and encapsulation method for modularization crystal grains |
| 01/05/2011 | CN101552252B High performance rare-earth electric blaster fuse frame material and production method thereof |
| 01/05/2011 | CN101540310B Semiconductor chip package and manufacturing methods thereof |
| 01/05/2011 | CN101533825B Semiconductor package structure and technics thereof, and surface mounting type semiconductor package structure |
| 01/05/2011 | CN101528017B Radiating component and radiating method |
| 01/05/2011 | CN101527306B Active component array substrate and LCD panel |
| 01/05/2011 | CN101514809B Illuminating apparatus |
| 01/05/2011 | CN101504503B Pixel array, LCD panel and optoelectronic device |
| 01/05/2011 | CN101488505B Thin-film transistor array substrate |
| 01/05/2011 | CN101463986B LED lamp |
| 01/05/2011 | CN101419954B Contraposition device for chip encapsulation construction |
| 01/05/2011 | CN101388381B Multi-chip stacking construction having metal spacer |
| 01/05/2011 | CN101266987B Method for manufacturing image sensor |
| 01/05/2011 | CN101252111B Chip packaging structure and manufacturing method thereof |
| 01/05/2011 | CN101242732B Heat radiator combination |
| 01/05/2011 | CN101236907B Line layout for cutting signal line on the circuit board |
| 01/04/2011 | US7864543 Printed circuit board |
| 01/04/2011 | US7864542 Printed circuit board |
| 01/04/2011 | US7864536 Circuit board assembly |
| 01/04/2011 | US7864534 Apparatus for mounting a module and enabling heat conduction from the module to the mounting surface |
| 01/04/2011 | US7863763 Binary sinusoidal sub-wavelength gratings as alignment marks |
| 01/04/2011 | US7863762 Method of packaging and interconnection of integrated circuits |
| 01/04/2011 | US7863761 Integrated circuit package system with molding vents |
| 01/04/2011 | US7863760 Roll-to-roll fabricated encapsulated semiconductor circuit devices |
| 01/04/2011 | US7863759 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse |
| 01/04/2011 | US7863758 Polyester-based thermoplastic resin, elastomer resin, epoxy resin, phenol curing agent, latent catalytic curing agent or curing catalyst, silane coupling agent, a filler; solid at room temperature, exhibits flowability at temperatures used during bonding of a die |
| 01/04/2011 | US7863757 Methods and systems for packaging integrated circuits |
| 01/04/2011 | US7863756 Semiconductor device |
| 01/04/2011 | US7863755 Package-on-package system with via Z-interconnections |
| 01/04/2011 | US7863754 Semiconductor device and manufacturing method thereof |
| 01/04/2011 | US7863750 Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof |
| 01/04/2011 | US7863749 Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same |
| 01/04/2011 | US7863747 Semiconductor chip, method of fabricating the same and semiconductor chip stack package |
| 01/04/2011 | US7863745 Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device |
| 01/04/2011 | US7863744 Semiconductor device and method for manufacturing same |
| 01/04/2011 | US7863743 Capactive connectors with enhanced capacitive coupling |
| 01/04/2011 | US7863742 Back end integrated WLCSP structure without aluminum pads |
| 01/04/2011 | US7863741 Semiconductor chip and manufacturing method thereof |
| 01/04/2011 | US7863740 Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof |
| 01/04/2011 | US7863739 Low fabrication cost, fine pitch and high reliability solder bump |
| 01/04/2011 | US7863738 Apparatus for connecting integrated circuit chip to power and ground circuits |
| 01/04/2011 | US7863737 Integrated circuit package system with wire bond pattern |
| 01/04/2011 | US7863736 Semiconductor device and signal terminating method thereof |
| 01/04/2011 | US7863735 Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof |
| 01/04/2011 | US7863734 Dual-sided chip attached modules |
| 01/04/2011 | US7863733 Integrated circuit with multiple layers of circuits |
| 01/04/2011 | US7863732 Ball grid array package system |
| 01/04/2011 | US7863731 Heat-dissipating structure and heat-dissipating semiconductor package having the same |
| 01/04/2011 | US7863730 Array-molded package heat spreader and fabrication method therefor |
| 01/04/2011 | US7863729 Circuit board structure embedded with semiconductor chips |
| 01/04/2011 | US7863728 Semiconductor module including components in plastic casing |
| 01/04/2011 | US7863727 Microelectronic devices and methods for manufacturing microelectronic devices |
| 01/04/2011 | US7863726 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof |
| 01/04/2011 | US7863725 Power device packages and methods of fabricating the same |
| 01/04/2011 | US7863724 Circuit substrate having post-fed die side power supply connections |