| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/06/2011 | US20110001236 Semiconductor device and a method of manufacturing the same |
| 01/06/2011 | US20110001235 Stacked semiconductor device and fabrication method for same |
| 01/06/2011 | US20110001234 Semiconductor device and fabrication method thereof |
| 01/06/2011 | US20110001233 Semiconductor device mounted structure and semiconductor device mounting method |
| 01/06/2011 | US20110001232 Flip-Chip Module and Method for the Production Thereof |
| 01/06/2011 | US20110001231 Semiconductor package having non-uniform contact arrangement |
| 01/06/2011 | US20110001230 Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging |
| 01/06/2011 | US20110001229 Package structure and package process |
| 01/06/2011 | US20110001228 Semiconductor device and manufacturing method of the same |
| 01/06/2011 | US20110001227 Semiconductor Chip Secured to Leadframe by Friction |
| 01/06/2011 | US20110001226 Lead frame, and electronic part using the same |
| 01/06/2011 | US20110001225 Semiconductor device and method for manufacturing the same |
| 01/06/2011 | US20110001224 Lead frame routed chip pads for semiconductor packages |
| 01/06/2011 | US20110001223 Leadframe, leadframe type package and lead lane |
| 01/06/2011 | US20110001222 Electronic device, layered substrate, and methods of manufacturing same |
| 01/06/2011 | US20110001221 Dielectric layer |
| 01/06/2011 | US20110001215 Multi-component electronic package |
| 01/06/2011 | US20110001213 Fuse part for semiconductor device |
| 01/06/2011 | US20110001212 Fuse of semiconductor device and method for fabricating the same |
| 01/06/2011 | US20110001211 Fuse for in use of a semiconductor device and method for forming the same |
| 01/06/2011 | US20110001189 Power Semiconductor Devices Having Termination Structures |
| 01/06/2011 | US20110001172 Three-dimensional integrated circuit structure |
| 01/06/2011 | US20110001171 Power converter integrated circuit floor plan and package |
| 01/06/2011 | US20110001168 Power and ground routing of integrated circuit devices with improved ir drop and chip performance |
| 01/05/2011 | EP2271196A1 Method for producing a frequency converter with cooling device and frequency converter |
| 01/05/2011 | EP2270983A1 Integrated smart power switch |
| 01/05/2011 | EP2270862A2 A manufacturing method of a photoelectric conversion apparatus with dual-damascene interconnections |
| 01/05/2011 | EP2270855A1 An electrical module |
| 01/05/2011 | EP2270854A2 Wiresless chip and manufacturing method of the same |
| 01/05/2011 | EP2270853A2 Wireless chip and manufacturing method of the same |
| 01/05/2011 | EP2270852A2 Thermal interface element and article including the same |
| 01/05/2011 | EP2270851A1 Method of balancing multilayer substrate stress and multilayer substrate |
| 01/05/2011 | EP2270846A2 Integrated circuits and methods for their fabrication |
| 01/05/2011 | EP2270845A2 Integrated circuits and methods for their fabrication |
| 01/05/2011 | EP2270842A2 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig |
| 01/05/2011 | EP2270486A2 Method and apparatus for shielding an integrated circuit from radiation |
| 01/05/2011 | EP2270413A1 Anti-gravity thermosyphon heat exchanger and a power module |
| 01/05/2011 | EP2270260A1 Electronic component and method for manufacturing the same |
| 01/05/2011 | EP2270242A1 Copper alloy material for electric and electronic apparatuses, and electric and electronic components |
| 01/05/2011 | EP2270100A1 Curable polysiloxane composition, and polysiloxane cured product, optical member, member for aerospace industry, semiconductor light emitting device, lighting system, and image display device using the curable polysiloxane composition |
| 01/05/2011 | EP2270077A1 Sealing resin sheet |
| 01/05/2011 | EP2269948A1 Sheet structure, semiconductor device and method of growing carbon structure |
| 01/05/2011 | EP2269234A1 Passive cooling system for photo voltaic modules |
| 01/05/2011 | EP2269220A1 Esd networks for solder bump integrated circuits |
| 01/05/2011 | EP2269219A1 High frequency field-effect transistor |
| 01/05/2011 | EP2269218A1 Cooling arrangement comprising two semiconductor components disposed next to one another |
| 01/05/2011 | EP2269217A1 Getter precursors for hermetically sealed packaging |
| 01/05/2011 | EP2269216A1 Die substrate with reinforcement structure |
| 01/05/2011 | EP2269213A1 Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm |
| 01/05/2011 | EP2269159A1 Wireless information carrier |
| 01/05/2011 | EP2036417B1 Electronic module configured for air flow therethrough and system including same |
| 01/05/2011 | EP1863084B1 Method for manufacture of hermetic seal cover |
| 01/05/2011 | EP1812973B1 Method of making light emitting device with silicon-containing encapsulant |
| 01/05/2011 | EP1741138B1 An integrated circuit, a method for manufacturing the integrated circuit, and a mobile phone having the integrated circuit |
| 01/05/2011 | EP1362364B1 Semiconductor package and method of preparing same |
| 01/05/2011 | EP1335831B1 Methods of manufacturing a fabric article including electronic circuitry and fabric articles |
| 01/05/2011 | DE112008003659T5 Nanostrukturen und Verfahren zum Herstellen derselben Nanostructures and methods for manufacturing the same |
| 01/05/2011 | DE112006001179B4 Vorrichtung mit eingebetteten Dünnschichtwiderständen in Substraten in Leistungsversorgungsnetzwerken A device with embedded thin film resistors in substrates in power supply networks |
| 01/05/2011 | DE102010030704A1 Spulen-Transducer Isolator-Baugruppe Coil transducer insulator assembly |
| 01/05/2011 | DE102010025258A1 Eingebetteter Sandwich-Hybridschaltkreis Embedded sandwich hybrid circuit |
| 01/05/2011 | DE102010017516A1 Verbundene Halbleiter-Moduleinheit und Motorvorrichtung mit integriertem elektronischen Schaltkreis mit derselben Related semiconductor module unit and motor apparatus with integrated electronic circuit with the same |
| 01/05/2011 | DE102010017056A1 Kondensatorstruktur Capacitor structure |
| 01/05/2011 | DE102009042191A1 Wafer-Level-gekapselte integrierte MEMS-Schaltung Wafer-level MEMS encapsulated integrated circuit |
| 01/05/2011 | DE102009033029A1 Elektronische Vorrichtung Electronic device |
| 01/05/2011 | DE102009031408A1 Elektronisches Bauelement und entsprechendes Herstellungsverfahren The electronic component and corresponding production method |
| 01/05/2011 | DE102009031370A1 Cooling device for power converter, has element with material and another element with another material, where latter material has higher heat storage capacity than former material |
| 01/05/2011 | DE102009031111A1 Kontaktoptimierung zur Verbesserung der Verspannungsübertragung in dicht liegenden Transistoren Contact optimization to improve the stress transfer in closely spaced transistors |
| 01/05/2011 | DE102009027382A1 Electronic component for use with electromagnetic vulnerability protection, has guide element and micro-component which is electrically connected to guide element |
| 01/05/2011 | DE102009027321A1 Method for producing electrical interlayer connection in substrate of micro-component or sensor, involves opening mask layer over substrate area provided for electrical interlayer connection, where mask layer is applied on substrate |
| 01/05/2011 | DE102009025581A1 Method for protecting e.g. semiconductor chip of fluoroscopy device from radiation, involves coating electric component with silicide layer, where layer thickness is selected such that radiation is dampened or completely absorbed |
| 01/05/2011 | DE102009022659A1 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module |
| 01/05/2011 | DE102009012042B4 Vorrichtung zur Kühlung von elektrischen oder elektronischen Bauteilen Apparatus for cooling electrical or electronic components |
| 01/05/2011 | DE102004042154B4 Kühler Cooler |
| 01/05/2011 | CN201700122U Radiating device with air guide hood |
| 01/05/2011 | CN201700114U Colloid heat transfer structure |
| 01/05/2011 | CN201699011U Lower thermal resistance ceramic copper-clad plate for IGBT modules |
| 01/05/2011 | CN201699010U Lead frame structure |
| 01/05/2011 | CN201699009U Semiconductor packaging structure |
| 01/05/2011 | CN201699008U Circuit packaging and assembling structure |
| 01/05/2011 | CN201699007U Water-cooling heat dissipating device of large-current diode |
| 01/05/2011 | CN201699006U Air-cooled converter for thyristors |
| 01/05/2011 | CN201699005U Radiating element for chips |
| 01/05/2011 | CN201699004U Planar terminal passivating structure of controlled silicon device |
| 01/05/2011 | CN201699003U Diode used for welding type plastic packaging car |
| 01/05/2011 | CN201698316U Two-use deformation radiating device |
| 01/05/2011 | CN201696896U Cross-ventilation radiator type high-power LED lamp |
| 01/05/2011 | CN101940075A Wiring board and semiconductor device using the wiring board |
| 01/05/2011 | CN101939981A Solid-state imaging device and method for manufacturing the same |
| 01/05/2011 | CN101939910A Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock |
| 01/05/2011 | CN101939832A Thermal mechanical flip chip die bonding |
| 01/05/2011 | CN101939465A Material for chemical vapor deposition, silicon-containing insulating film and process for production thereof |
| 01/05/2011 | CN101939453A Copper alloy material for electric and electronic components |
| 01/05/2011 | CN101938118A Electrostatic discharge protection circuit with multi-power area integrated circuit |
| 01/05/2011 | CN101937923A Camera module |
| 01/05/2011 | CN101937920A Miniature-sized storage device |
| 01/05/2011 | CN101937919A Three-dimensional nonvolatile memory device and method for fabricating the same |
| 01/05/2011 | CN101937916A 半导体器件 Semiconductor devices |
| 01/05/2011 | CN101937914A Electronic device including an integrated circuit with transistors coupled to each other |
| 01/05/2011 | CN101937913A Electronic device including a well region |
| 01/05/2011 | CN101937912A Arrangement of power supply cells within cell-base integrated circuit |