| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/11/2011 | US7869217 Toolless locking device |
| 01/11/2011 | US7869215 Portable electronic device incorporating extendable heat dissipation device |
| 01/11/2011 | US7868986 Liquid crystal display having a driver contact structure for preventing corrosion of conductive films |
| 01/11/2011 | US7868629 Proportional variable resistor structures to electrically measure mask misalignment |
| 01/11/2011 | US7868612 Magnetic sensor module |
| 01/11/2011 | US7868474 Method and structures for indexing dice |
| 01/11/2011 | US7868473 Wafer target design and method for determining centroid of wafer target |
| 01/11/2011 | US7868472 Thermal dissipation in integrated circuit systems |
| 01/11/2011 | US7868471 Integrated circuit package-in-package system with leads |
| 01/11/2011 | US7868470 Semiconductor chip package and multichip package |
| 01/11/2011 | US7868469 Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device |
| 01/11/2011 | US7868468 Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates |
| 01/11/2011 | US7868466 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 01/11/2011 | US7868465 Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier |
| 01/11/2011 | US7868464 Multilayer substrate and manufacturing method thereof |
| 01/11/2011 | US7868463 High performance sub-system design and assembly |
| 01/11/2011 | US7868462 Semiconductor package including transformer or antenna |
| 01/11/2011 | US7868460 Semiconductor package and method of manufacturing the same |
| 01/11/2011 | US7868459 Semiconductor package having non-aligned active vias |
| 01/11/2011 | US7868458 Semiconductor device with epitaxial C49-titanium silicide (TiSi2) layer and method for fabricating the same |
| 01/11/2011 | US7868457 Thermo-compression bonded electrical interconnect structure and method |
| 01/11/2011 | US7868456 Semiconductor device and method for fabricating the same |
| 01/11/2011 | US7868455 Solving via-misalignment issues in interconnect structures having air-gaps |
| 01/11/2011 | US7868453 Solder interconnect pads with current spreading layers |
| 01/11/2011 | US7868452 Ultrathin semiconductor circuit having contact bumps |
| 01/11/2011 | US7868451 Resin sealing semiconductor device and electronic device using resin sealing semiconductor device |
| 01/11/2011 | US7868450 Semiconductor package |
| 01/11/2011 | US7868449 Semiconductor substrate and method of connecting semiconductor die to substrate |
| 01/11/2011 | US7868448 Electrical component and production thereof |
| 01/11/2011 | US7868447 Solid-state image sensing apparatus and package of same |
| 01/11/2011 | US7868446 Semiconductor device and methods of manufacturing semiconductor devices |
| 01/11/2011 | US7868445 Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer |
| 01/11/2011 | US7868443 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability |
| 01/11/2011 | US7868442 Layered chip package and method of manufacturing same |
| 01/11/2011 | US7868441 Package on-package secure module having BGA mesh cap |
| 01/11/2011 | US7868440 Packaged microdevices and methods for manufacturing packaged microdevices |
| 01/11/2011 | US7868439 Chip package and substrate thereof |
| 01/11/2011 | US7868438 Multi-chip package for reducing parasitic load of pin |
| 01/11/2011 | US7868437 Mounting structure for IC tag and IC chip for mounting |
| 01/11/2011 | US7868436 Semiconductor device |
| 01/11/2011 | US7868435 semiconductor chip comprising a chip portion bonded to a reinforcing plate by a cured epoxy resin adhesive and hardening agent |
| 01/11/2011 | US7868434 Integrated circuit package-on-package stacking system |
| 01/11/2011 | US7868433 Low stress cavity package |
| 01/11/2011 | US7868432 Multi-chip module for battery power control |
| 01/11/2011 | US7868431 Compact power semiconductor package and method with stacked inductor and integrated circuit die |
| 01/11/2011 | US7868429 Micro-sensor and manufacturing method thereof |
| 01/11/2011 | US7868427 Structure and method for placement, sizing and shaping of dummy structures |
| 01/11/2011 | US7868417 Semiconductor device including a plurality of fuse elements and attenuation members between or around the plurality of fuse elements |
| 01/11/2011 | US7868415 Integrated circuit with an active area line having at least one form-supporting element and corresponding method of making an integrated circuit |
| 01/11/2011 | US7868409 Semiconductor integrated circuit with solder bump |
| 01/11/2011 | US7868399 Semiconductor sensing device |
| 01/11/2011 | US7868391 3-D single gate inverter |
| 01/11/2011 | US7868387 Low leakage protection device |
| 01/11/2011 | US7868386 Method and apparatus for semiconductor device with improved source/drain junctions |
| 01/11/2011 | US7868336 Semiconductor device and method of manufacturing the same |
| 01/11/2011 | US7868079 Field grading material |
| 01/11/2011 | US7867888 Flip-chip package substrate and a method for fabricating the same |
| 01/11/2011 | US7867886 Method of enclosing a micro-electromechanical element |
| 01/11/2011 | US7867832 Electrical fuse and method of making |
| 01/11/2011 | US7867830 Manufacturing method for electronic component with sealing film |
| 01/11/2011 | US7867828 Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein |
| 01/11/2011 | US7867609 Thermal interface materials |
| 01/11/2011 | US7866376 Heat dissipation device with U-shaped and S-shaped heat pipes |
| 01/11/2011 | US7866375 Heat dissipation device with heat pipes |
| 01/11/2011 | CA2538100C Circuit board assembly and method of attaching a chip to a circuit board |
| 01/06/2011 | WO2011002794A2 Systems and methods of improved heat dissipation with variable pitch grid array packaging |
| 01/06/2011 | WO2011002778A2 Methods and structures for a vertical pillar interconnect |
| 01/06/2011 | WO2011002031A1 Substrate for mounting components, and semiconductor module |
| 01/06/2011 | WO2011001992A1 Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate |
| 01/06/2011 | WO2011001847A1 Electrolytic copper plating solution for filling for forming microwiring of copper for ulsi |
| 01/06/2011 | WO2011001795A1 Metal laminate structure and process for production of metal laminate structure |
| 01/06/2011 | WO2011001760A1 Thermally conductcive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component |
| 01/06/2011 | WO2011001698A1 Resin composition, multilayer body containing same, semiconductor device, and film |
| 01/06/2011 | WO2011001520A1 Semiconductor device and method for manufacturing same |
| 01/06/2011 | WO2011001494A1 Semiconductor device and manufacturing method thereof |
| 01/06/2011 | WO2011000597A1 Method for producing an electronic component |
| 01/06/2011 | WO2011000360A2 Electronic device |
| 01/06/2011 | WO2011000056A1 Cooling for led illumination device |
| 01/06/2011 | WO2010107851A3 Rapid fabrication of a microelectronic temporary support for inorganic substrates |
| 01/06/2011 | WO2010104758A3 Methods for forming three-dimensional memory devices, and related structures |
| 01/06/2011 | WO2010014958A3 Enhanced thermally isolated thermoelectrics |
| 01/06/2011 | US20110003026 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
| 01/06/2011 | US20110002494 Housing for an Electrically Operated Device |
| 01/06/2011 | US20110001587 Die-to-die electrical isolation in a semiconductor package |
| 01/06/2011 | US20110001507 Semiconductor device and method of performing electrical test on same |
| 01/06/2011 | US20110001251 Adhesive composition, bonding member using the adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
| 01/06/2011 | US20110001250 Method and structure for adhesion of intermetallic compound (imc) on cu pillar bump |
| 01/06/2011 | US20110001249 Supplying Power to Integrated Circuits Using a Grid Matrix Formed of Through-Silicon Vias |
| 01/06/2011 | US20110001248 Semiconductor device having groove-shaped via-hole |
| 01/06/2011 | US20110001247 Semiconductor device manufacturing method |
| 01/06/2011 | US20110001246 Semiconductor device and manufacturing method of the same |
| 01/06/2011 | US20110001245 Semiconductor device including sealing film for encapsulating semiconductor chip and projection electrodes and manufacturing method thereof |
| 01/06/2011 | US20110001244 Method for Producing a Power Semiconductor Module, and Power Semiconductor Module Comprising a Connection Device |
| 01/06/2011 | US20110001243 Semiconductor device including dummy |
| 01/06/2011 | US20110001242 Semiconductor device |
| 01/06/2011 | US20110001241 Compound semiconductor device and connectors |
| 01/06/2011 | US20110001240 Chip Scale Module Package in BGA Semiconductor Package |
| 01/06/2011 | US20110001239 Semiconductor Chip Package and Method for Designing the Same |
| 01/06/2011 | US20110001238 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof |
| 01/06/2011 | US20110001237 Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element |