| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/12/2011 | EP2272103A1 Device comprising a multilayer board and light-emitting diodes |
| 01/12/2011 | EP2272094A2 An integrated circuit |
| 01/12/2011 | EP2272093A2 Reliability improvement in a compound semiconductor mmic |
| 01/12/2011 | EP2272092A2 Inductor with patterned ground plane |
| 01/12/2011 | EP2272091A1 Method for making microstructures by converting porous silicon into porous metal or ceramics |
| 01/12/2011 | EP2272090A2 Substrate-mounted circuit module comprising components in a plurality of contact planes |
| 01/12/2011 | EP2271971A2 A case and rack system for liquid submersion cooling of electronic devices connected in an array |
| 01/12/2011 | EP1924947B1 Protection against manipulation and through-drilling for an apparatus to be connected to an electrical circuit |
| 01/12/2011 | EP1825730B1 Heat sink with microchannel cooling for power devices |
| 01/12/2011 | EP1234314B1 Inductor on integrated circuit and methods for manufacture |
| 01/12/2011 | EP1072057B1 Method of manufacturing a vertical metal connection in an integrated circuit |
| 01/12/2011 | CN201709071U Thin type radiating device |
| 01/12/2011 | CN201708705U Voltage resistant low reverse current bridge rectifier |
| 01/12/2011 | CN201708159U Diode chip |
| 01/12/2011 | CN201708156U One-way silicon controlled rectifier structure with strong anti-interference performance |
| 01/12/2011 | CN201708155U Improved trench power MOS device of terminal structure |
| 01/12/2011 | CN201708153U Laminated encapsulation structure of LED module |
| 01/12/2011 | CN201708152U Embedded S i P computer module |
| 01/12/2011 | CN201708151U Chip-type light-emitting diode (LED) encapsulation structure |
| 01/12/2011 | CN201708150U Frame of bridge rectifier |
| 01/12/2011 | CN201708149U Integrated circuit chip card |
| 01/12/2011 | CN201708148U Chip lead bonding region and semiconductor device applying the same |
| 01/12/2011 | CN201708147U Composite graphite radiator |
| 01/12/2011 | CN201708146U Radiator and semiconductor module with the same |
| 01/12/2011 | CN201708145U Passivation protected diode chip |
| 01/12/2011 | CN201708144U Novel chip diode |
| 01/12/2011 | CN201707636U Pressing fastener structure of heat sink |
| 01/12/2011 | CN201706932U Vapor chamber |
| 01/12/2011 | CN1852646B Evapouration cooling-radiating structure of power device |
| 01/12/2011 | CN1813348B Device comprising heat-conductive intermediate layer and heat conductive material as intermediate layer |
| 01/12/2011 | CN101946407A Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio clock |
| 01/12/2011 | CN101946406A Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled watch |
| 01/12/2011 | CN101946405A Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled watch |
| 01/12/2011 | CN101946404A Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio clock |
| 01/12/2011 | CN101946403A Piezoelectric transducer, piezoelectric transducer manufacturing method, oscillator, electronic device, and radio clock |
| 01/12/2011 | CN101946319A Thermally conductive periodically structured gap fillers and method for utilizing same |
| 01/12/2011 | CN101946318A Semiconductor element module and method for manufacturing the same |
| 01/12/2011 | CN101946317A Electronic component, electronic apparatus, and base member manufacturing method |
| 01/12/2011 | CN101946304A Ultra high density capacity comprising pillar-shaped capacitors formed on both sides of a substrate |
| 01/12/2011 | CN101945561A Dissipation device and preparation method thereof |
| 01/12/2011 | CN101945560A Heat abstractor |
| 01/12/2011 | CN101945530A Printed circuit board with pad provided with exhaust through holes |
| 01/12/2011 | CN101944697A Modification of connections between a die package and a system board |
| 01/12/2011 | CN101944544A Junction box for connecting a solar cell, electrical diode, guiding element and fixing means |
| 01/12/2011 | CN101944526A Die-to-die electrical isolation in a semiconductor package |
| 01/12/2011 | CN101944525A Integrated circuit structure |
| 01/12/2011 | CN101944524A Semiconductor device |
| 01/12/2011 | CN101944523A Board having connection terminal |
| 01/12/2011 | CN101944522A Lead frame, and electronic part using the same |
| 01/12/2011 | CN101944521A Grain bearing part structure of lead frame for semiconductor capsulation |
| 01/12/2011 | CN101944520A Semiconductor packaging structure and semiconductor packaging process |
| 01/12/2011 | CN101944519A Semiconductor device including sealing film and manufacturing method of semiconductor device |
| 01/12/2011 | CN101944518A Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof |
| 01/12/2011 | CN101944517A Semiconductor device |
| 01/12/2011 | CN101944516A Quad flat non-leaded package and manufacturing method thereof |
| 01/12/2011 | CN101944515A Gravity circulation evaporative cooling semiconductor power device packaging structure |
| 01/12/2011 | CN101944514A Semiconductor packaging structure and package manufacturing technology |
| 01/12/2011 | CN101944513A Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus |
| 01/12/2011 | CN101944512A Switching base plate packaged by integrated circuit |
| 01/12/2011 | CN101944496A Method and structure for adhesion of intermetallic compound (imc) on cu pillar bump |
| 01/12/2011 | CN101944492A Shrink package on board |
| 01/12/2011 | CN101944490A Forming structure of fluorescent powder colloid of light-emitting module and manufacture method thereof |
| 01/12/2011 | CN101943391A LED tube light and manufacturing method thereof |
| 01/12/2011 | CN101943335A Light-emitting diode lamp |
| 01/12/2011 | CN101943328A Single super-power LED light source lamp |
| 01/12/2011 | CN101942197A Heat-conducting silicon rubber composite material and preparing method thereof |
| 01/12/2011 | CN101640237B Metal block bearing wafer in LED packaging frame |
| 01/12/2011 | CN101621030B Self-aligned MOS structure with polysilicon contact |
| 01/12/2011 | CN101609824B Universal type basal plate packaged by semiconductor and semiconductor packaging structure |
| 01/12/2011 | CN101572252B Etching stopping layer, semiconductor device with through hole and method for forming same two |
| 01/12/2011 | CN101548379B Electronic component module and method for production thereof |
| 01/12/2011 | CN101533840B Capacitor device, resistor device and attitude measurement system using same |
| 01/12/2011 | CN101493300B Fabrication technology of air cooler for cooling DC converter valve |
| 01/12/2011 | CN101482936B Production method and structure for RFID system label with face bonding element |
| 01/12/2011 | CN101460041B Heat radiating module and latching structure thereof |
| 01/12/2011 | CN101454897B Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof |
| 01/12/2011 | CN101447468B Nitride semiconductor device and method of manufacturing the same |
| 01/12/2011 | CN101414594B Lead pin for mounting semiconductor and printed wiring board |
| 01/12/2011 | CN101399245B Semiconductor package having dimpled plate interconnections |
| 01/12/2011 | CN101398589B Liquid crystal display device |
| 01/12/2011 | CN101369617B LED device with high cooling property |
| 01/12/2011 | CN101365321B Locking device |
| 01/12/2011 | CN101355063B Electronic device and method for manufacturing electronic device |
| 01/12/2011 | CN101349417B High heat conducting shimming material of LED light fitting heat radiation technique |
| 01/12/2011 | CN101346039B Novel via structure for improving signal integrity |
| 01/12/2011 | CN101330044B Method of manufacturing thin film |
| 01/12/2011 | CN101299428B Integrated circuit capacitor structure |
| 01/12/2011 | CN101252291B Integrated circuit device and electronic instrument |
| 01/12/2011 | CN101232032B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/12/2011 | CN101203123B Radiating module and heat radiator |
| 01/12/2011 | CN101197380B Semiconductor device and electro-optical device |
| 01/12/2011 | CN101165887B Integrated circuit chip package substrate and device and electronic device including the substrate |
| 01/12/2011 | CN101123250B Layout architecture with high-performance and high-density design |
| 01/12/2011 | CN101107285B Epoxy resin composition, method for forming latent of the same and semiconductor device |
| 01/12/2011 | CN101068020B Memory unit array and fabrication process |
| 01/12/2011 | CN101058709B Epoxy resin molding material for sealing use and semiconductor device |
| 01/11/2011 | US7869974 Connector or other circuit element having an indirectly coupled integrated circuit |
| 01/11/2011 | US7869853 Analyte monitoring device and methods of use |
| 01/11/2011 | US7869240 Semiconductor device and semiconductor memory tester |
| 01/11/2011 | US7869221 Apparatus for non-conductively interconnecting integrated circuits |