| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/2011 | WO2011006015A2 Techniques providing fiducial markers for failure analysis |
| 01/13/2011 | WO2011005922A1 Interconnecting ribbon welded to electrical components |
| 01/13/2011 | WO2011005445A1 Applying chiplets to substrates |
| 01/13/2011 | WO2011005342A1 Passive cooling enclosure system and method for electronics devices |
| 01/13/2011 | WO2011004815A1 Heat exchanger, x-ray examination method for power module provided with said heat exchanger and jig used in said method |
| 01/13/2011 | WO2011004803A1 Coil component |
| 01/13/2011 | WO2011004746A1 Method for manufacturing semiconductor device |
| 01/13/2011 | WO2011004706A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 01/13/2011 | WO2011004681A1 Electronic circuit device |
| 01/13/2011 | WO2011004559A1 Through-wiring board and method of manufacturing same |
| 01/13/2011 | WO2011004556A1 Through-wiring board and method of manufacturing same |
| 01/13/2011 | WO2011004542A1 Electronic component unit and reinforcement adhesive |
| 01/13/2011 | WO2011004224A1 Semiconductor package having non-uniform contact arrangement |
| 01/13/2011 | WO2011003948A2 Electrically conductive adhesives |
| 01/13/2011 | WO2011003910A1 Method for producing an integrated circuit and resulting foil chip |
| 01/13/2011 | WO2011003871A1 A temperature control device for optoelectronic devices |
| 01/13/2011 | WO2011003636A1 Multilayer securing structure and method thereof for the protection of cryptographic keys and code |
| 01/13/2011 | WO2010129091A3 Low thermal resistance and robust chip-scale-package (csp), structure and method |
| 01/13/2011 | WO2010120428A3 Robust esd protection circuit, method and design structure for tolerant and failsafe designs |
| 01/13/2011 | WO2010118183A3 Low stress-inducing heat sink |
| 01/13/2011 | WO2010114944A3 Material for packaging electronic components |
| 01/13/2011 | WO2010114739A3 Electrically alterable circuit for use in an integrated circuit device |
| 01/13/2011 | WO2010105178A3 Gated diode having at least one lightly-doped drain (ldd) implant blocked and circuits and methods employing same |
| 01/13/2011 | WO2010104610A3 Stacked microelectronic assembly with microelectronic elements having vias extending through bond pads |
| 01/13/2011 | WO2010102151A3 Chip-scale packaging with protective heat spreader |
| 01/13/2011 | WO2010072221A3 Cooling device with bended flat tube and related manufacturing method |
| 01/13/2011 | US20110008959 Method of etching a semiconductor wafer |
| 01/13/2011 | US20110008935 Semiconductor die package including leadframe with die attach pad with folded edge |
| 01/13/2011 | US20110007554 Semiconductor device |
| 01/13/2011 | US20110006704 Lead frame by wire binding method and led power lamp using same |
| 01/13/2011 | US20110006444 Micromechanical component and method for producing a micromechancal component having a thin-lawyer cap |
| 01/13/2011 | US20110006443 Semiconductor device |
| 01/13/2011 | US20110006442 Semiconductor chip, film substrate, and related semiconductor chip package |
| 01/13/2011 | US20110006441 Resin varnish used for adhesive film for semiconductor element, adhesive film for semiconductor element, and semiconductor device |
| 01/13/2011 | US20110006440 System and method to reduce the bondwire/trace inductance |
| 01/13/2011 | US20110006439 Semiconductor device, basic cell, and semiconductor integrated circuit device |
| 01/13/2011 | US20110006438 Semiconductor wafer, and semiconductor device formed therefrom |
| 01/13/2011 | US20110006437 Opening structure |
| 01/13/2011 | US20110006436 Conductive Via Plug Formation |
| 01/13/2011 | US20110006435 Semiconductor device and method of manufacturing the same |
| 01/13/2011 | US20110006434 Under land routing |
| 01/13/2011 | US20110006433 Electronic device and manufacturing method therefor |
| 01/13/2011 | US20110006432 Reconstituted wafer stack packaging with after-applied pad extensions |
| 01/13/2011 | US20110006431 Method for aligning and bonding elements and a device comprising aligned and bonded elements |
| 01/13/2011 | US20110006430 Copper diffusion barrier |
| 01/13/2011 | US20110006429 Barrier layers for copper interconnect |
| 01/13/2011 | US20110006428 Liner Formation in 3DIC Structures |
| 01/13/2011 | US20110006427 Electronic component formed with barrier-seed layer on base material |
| 01/13/2011 | US20110006426 Electronic component formed with barrier-seed layer on base material |
| 01/13/2011 | US20110006425 Semiconductor device |
| 01/13/2011 | US20110006424 Method of manufacturing semiconductor device |
| 01/13/2011 | US20110006423 Surface-mounted silicon chip |
| 01/13/2011 | US20110006422 Structures and methods to improve lead-free C4 interconnect reliability |
| 01/13/2011 | US20110006421 Solder interconnect pads with current spreading layers |
| 01/13/2011 | US20110006420 Semiconductor device |
| 01/13/2011 | US20110006419 Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device |
| 01/13/2011 | US20110006418 Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other |
| 01/13/2011 | US20110006417 Semiconductor device and method of manufacturing semiconductor device |
| 01/13/2011 | US20110006416 Structure and method for forming pillar bump structure having sidewall protection |
| 01/13/2011 | US20110006415 Solder interconnect by addition of copper |
| 01/13/2011 | US20110006414 Electronic device and method for manufacturing electronic device |
| 01/13/2011 | US20110006413 Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package |
| 01/13/2011 | US20110006412 Semiconductor chip package and method for manufacturing thereof and stack package using the same |
| 01/13/2011 | US20110006411 Simplified multichip packaging and package design |
| 01/13/2011 | US20110006410 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device |
| 01/13/2011 | US20110006409 Nickel-titanum contact layers in semiconductor devices |
| 01/13/2011 | US20110006408 Chip package and manufacturing method thereof |
| 01/13/2011 | US20110006405 Semiconductor device, manufacture method of semiconductor device, and electronic apparatus |
| 01/13/2011 | US20110006404 Structure and method of wafer level chip molded packaging |
| 01/13/2011 | US20110006392 Semiconductor device |
| 01/13/2011 | US20110006391 Semiconductor device |
| 01/13/2011 | US20110006303 Semiconductor apparatus manufacturing method and semiconductor apparatus |
| 01/13/2011 | DE202010015589U1 Kühlkörper Heat Sink |
| 01/13/2011 | DE202010008793U1 Nicht-thermoelektrisches gesondertes Metallsubstrat und Leuchtelement umfassend ein solches Non-thermoelectric separate metal substrate, and light-emitting element comprising such |
| 01/13/2011 | DE202010008396U1 Konstruktion eines Verbindungselements mit direkter Siliziumbohrung Construction of a connecting member with direct silicon hole |
| 01/13/2011 | DE112009000605T5 Halbleiterchip-Baugruppe mit IC-Treiber und Brücke A semiconductor chip assembly with IC driver and bridge |
| 01/13/2011 | DE112006003049B4 Integriertes Schaltungspackage und Package-Substrat unter Verwendung eines Array-Kondensatorkerns und Verfahren zur Herstellung An integrated circuit package and the package substrate using an array capacitor core and process for preparing |
| 01/13/2011 | DE102010024119A1 Halbleitervorrichtung, Herstellungsverfahren einer Halbleitervorrichtung und elektronisches Gerät A semiconductor device manufacturing method of a semiconductor device and electronic device |
| 01/13/2011 | DE102010000199A1 Halbleiterbauelement, Systemträger und Einkapselungsverfahren Semiconductor device, system unit and encapsulation |
| 01/13/2011 | DE102009032606A1 Optoelektronisches Bauteil und Flachlichtquelle The optoelectronic device and flat light source |
| 01/13/2011 | DE102009032486A1 Optoelektronisches Bauelement Optoelectronic component |
| 01/13/2011 | DE102009032253A1 Elektronisches Bauteil Electronic component |
| 01/13/2011 | DE102009017692A1 Method for production of low-temperature contacting for microelectronic superstructures, involves applying photo-structured material on connection contacts having surface of microelectronic element |
| 01/13/2011 | DE102007049035B4 Chipkühlvorrichtung mit Keilelement Chip Cooler with wedge element |
| 01/13/2011 | DE102006023123B4 Abstandserfassungsradar für Fahrzeuge mit einem Halbleitermodul mit Komponenten für Höchstfrequenztechnik in Kunststoffgehäuse und Verfahren zur Herstellung eines Halbleitermoduls mit Komponenten für ein Abstandserfassungsradar für Fahrzeuge in einem Kunststoffgehäuse Distance detection radar for vehicles with a semiconductor module with components for high frequency technology in plastic housing and method of manufacturing a semiconductor module with components for a distance detection radar for vehicles in a plastic housing |
| 01/13/2011 | CA2766859A1 Electrically conductive adhesives |
| 01/13/2011 | CA2766115A1 Passive cooling enclosure system and method for electronics devices |
| 01/12/2011 | EP2273862A1 Unit with power circuit mounted therein, and motor drive apparatus |
| 01/12/2011 | EP2273553A2 A method for fabricating AlGaN/GaN HEMT devices |
| 01/12/2011 | EP2273552A2 Methods of fabricating nanstructures and nanowires and devices fabricated therefrom |
| 01/12/2011 | EP2273550A2 Enhanced substrate using metamaterials |
| 01/12/2011 | EP2273549A1 Suppressing fractures in diced integrated circuits |
| 01/12/2011 | EP2273548A2 Handle wafer with viewing windows |
| 01/12/2011 | EP2273545A1 Method for insertion bonding and device thus obtained |
| 01/12/2011 | EP2273544A2 Semiconductor electronic device and method of manufacturing thereof |
| 01/12/2011 | EP2273543A2 Semiconductor electronic device and method of manufacturing thereof |
| 01/12/2011 | EP2273542A2 Semiconductor electronic device and method of manufacturing thereof |
| 01/12/2011 | EP2273541A1 Silicon chip for flip-chip mounting with front and back faces covered with a filled resin |
| 01/12/2011 | EP2272794A1 Semiconductor package substrate, in particular for MEMS devices |
| 01/12/2011 | EP2272311A1 Cooling device for a plurality of power modules |