| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/19/2011 | CN101951130A Semiconductor refrigeration-based inverter double-cavity heat dissipation device |
| 01/19/2011 | CN101950754A Image display system |
| 01/19/2011 | CN101950751A Image sensor and encapsulating method thereof |
| 01/19/2011 | CN101950750A Semiconductor device |
| 01/19/2011 | CN101950746A Pixel structure |
| 01/19/2011 | CN101950745A Semiconductor packaging structure and producing method thereof |
| 01/19/2011 | CN101950744A Semiconductor device |
| 01/19/2011 | CN101950743A Suppressing fractures in diced integrated circuits |
| 01/19/2011 | CN101950742A 半导体装置 Semiconductor device |
| 01/19/2011 | CN101950741A Method for producing chip electrode multilevel interconnection structure |
| 01/19/2011 | CN101950740A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 01/19/2011 | CN101950739A Circuit substrate |
| 01/19/2011 | CN101950738A 集成电路结构 Integrated circuit structure |
| 01/19/2011 | CN101950737A Production method of P-type silicon substrate back metallization |
| 01/19/2011 | CN101950736A Surface-mounted silicon chip |
| 01/19/2011 | CN101950731A Common line structure, display panel and manufacturing method thereof |
| 01/19/2011 | CN101950729A Wafer level packaging of electronic component and manufacturing method thereof |
| 01/19/2011 | CN101950728A Metal pillar bump structure and method of forming same |
| 01/19/2011 | CN101950727A System and method for reducing inductance on integrated circuit |
| 01/19/2011 | CN101950109A Flat panel display device with test architecture |
| 01/19/2011 | CN101948609A Black rubber and preparation method thereof |
| 01/19/2011 | CN101667568B Preparation method of refrigeration structure for three-dimensional encapsulation of micro-electronics |
| 01/19/2011 | CN101666433B High power LED source for heat conduction by using room temperature liquid metal |
| 01/19/2011 | CN101661938B Novel CMOS integrated circuit resisting total dose radiation |
| 01/19/2011 | CN101626011B Base plate having pad-free type conductive traces and using for encapsulation |
| 01/19/2011 | CN101577260B 线路基板及光源模组 Circuit board and the light module |
| 01/19/2011 | CN101527281B Active element array substrate and method for manufacturing same |
| 01/19/2011 | CN101510411B Display device and renovation method thereof |
| 01/19/2011 | CN101496165B Electronic component storing package and electronic device |
| 01/19/2011 | CN101490841B Cooling device and vehicle with the same |
| 01/19/2011 | CN101488494B Conductive wire type semiconductor device and conductive wire rack thereof |
| 01/19/2011 | CN101477977B Wafer stage encapsulation structure and lead pad electric signal leading process |
| 01/19/2011 | CN101471366B Image sensor and method for manufacturing the sensor |
| 01/19/2011 | CN101459161B Integrate circuit |
| 01/19/2011 | CN101442000B Crystallizing method for the semiconductor thin film |
| 01/19/2011 | CN101403490B Cooling structure, backlight module and LCD device and its assembling method |
| 01/19/2011 | CN101384739B Cr-Cu alloy, process for producing the same, heat sink for semiconductor, and heat dissipating component for semiconductor |
| 01/19/2011 | CN101383299B Wafer level package of electronic element and manufacturing method thereof |
| 01/19/2011 | CN101360412B Micro liquid cooling device and micro-liquid-drop generator adopted thereby |
| 01/19/2011 | CN101359608B Integrate circuit packaging, forming method thereof and structure of wafer-level ball integrate circuit packaging |
| 01/19/2011 | CN101346051B Fastener and heat radiating device with the same |
| 01/19/2011 | CN101252145B Carbon nanometer tube nano electronic device and manufacturing method thereof |
| 01/19/2011 | CN101252118B Semiconductor device and method for producing the same |
| 01/19/2011 | CN101230197B Organosilicon composition for manufacturing packaging gluewater of light-emitting diode |
| 01/19/2011 | CN101211963B Organic light emitting display and fabricating method thereof |
| 01/19/2011 | CN101192587B Semiconductor device manufacturing method |
| 01/19/2011 | CN101154647B Semiconductor apparatus |
| 01/19/2011 | CN101140933B Semiconductor device and method of manufacture thereof |
| 01/19/2011 | CN101118913B Display device and method of manufacturing the display device |
| 01/19/2011 | CN101115366B Heat radiating device |
| 01/19/2011 | CN101097917B Electrostatic discharge protection circuit and terminating resistor circuit |
| 01/19/2011 | CN101076883B Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
| 01/19/2011 | CN101071813B Structure and method for determining gradient field of process environment |
| 01/19/2011 | CN101031602B Epoxy resin composition for sealing optical semiconductor |
| 01/18/2011 | USRE42035 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 01/18/2011 | US7872897 Programmable semiconductor device |
| 01/18/2011 | US7872699 Thin film transistor array panel and liquid crystal display including the panel |
| 01/18/2011 | US7872686 Integrated lens and chip assembly for a digital camera |
| 01/18/2011 | US7872360 Semiconductor device and method of manufacturing the same |
| 01/18/2011 | US7872359 Electronic component contained substrate |
| 01/18/2011 | US7872358 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
| 01/18/2011 | US7872357 Protection for bonding pads and methods of formation |
| 01/18/2011 | US7872356 Die stacking system and method |
| 01/18/2011 | US7872355 Semiconductor integrated circuit and method of designing semiconductor integrated circuit |
| 01/18/2011 | US7872354 High voltage-resistant semiconductor device and method of manufacturing high voltage-resistant semiconductor device |
| 01/18/2011 | US7872353 Semiconductor device |
| 01/18/2011 | US7872352 Carbon nanotube bond pad structure and method therefor |
| 01/18/2011 | US7872351 Multi-layered metal line of semiconductor device for preventing diffusion between metal lines and method for forming the same |
| 01/18/2011 | US7872350 Multi-chip module |
| 01/18/2011 | US7872349 Integrated coolant circuit arrangement, operating method and production method |
| 01/18/2011 | US7872348 Semiconductor device |
| 01/18/2011 | US7872347 Larger than die size wafer-level redistribution packaging process |
| 01/18/2011 | US7872346 Power plane and land pad feature to prevent human metal electrostatic discharge damage |
| 01/18/2011 | US7872345 Integrated circuit package system with rigid locking lead |
| 01/18/2011 | US7872344 Microelectronic assemblies having compliant layers |
| 01/18/2011 | US7872343 Dual laminate package structure with embedded elements |
| 01/18/2011 | US7872341 Semiconductor device |
| 01/18/2011 | US7872340 Integrated circuit package system employing an offset stacked configuration |
| 01/18/2011 | US7872339 Vertically stacked pre-packaged integrated circuit chips |
| 01/18/2011 | US7872338 Microelectromechanical device packages with integral heaters |
| 01/18/2011 | US7872337 Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate |
| 01/18/2011 | US7872336 Low cost lead-free preplated leadframe having improved adhesion and solderability |
| 01/18/2011 | US7872335 Lead frame-BGA package with enhanced thermal performance and I/O counts |
| 01/18/2011 | US7872333 Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method |
| 01/18/2011 | US7872332 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| 01/18/2011 | US7872331 Nitride semiconductor wafer |
| 01/18/2011 | US7872327 Semiconductor integrated circuit device and method of producing the same |
| 01/18/2011 | US7872314 Method of manufacturing semiconductor device carrying out ion implantation before silicide process |
| 01/18/2011 | US7872283 Semiconductor integrated circuit and multi-chip module |
| 01/18/2011 | US7871864 Locking feature and method for manufacturing transfer molded IC packages |
| 01/18/2011 | US7871863 Integrated circuit package system with multiple molding |
| 01/18/2011 | US7871862 Ball grid array package stacking system |
| 01/18/2011 | US7871858 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/18/2011 | US7871857 Methods of forming multi-chip semiconductor substrates |
| 01/18/2011 | US7871687 Method of making microstructure device, and microstructure device made by the same |
| 01/18/2011 | US7871008 Wireless IC device and manufacturing method thereof |
| 01/18/2011 | US7870893 Multichannel cooling system with magnetohydrodynamic pump |
| 01/18/2011 | US7870890 Heat dissipation device with heat pipe |
| 01/17/2011 | CA2710331A1 Non-uniform height and density fin design for heat sink |
| 01/13/2011 | WO2011006101A2 Devices and methods providing for intra-die cooling structure reservoirs |