| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/20/2011 | WO2010123765A3 Thin bond line semiconductor packages |
| 01/20/2011 | WO2010104693A3 Weld terminal, switch assembly and methods of attachment |
| 01/20/2011 | US20110016266 Semiconductor device |
| 01/20/2011 | US20110015510 Analyte Monitoring Device and Methods of Use |
| 01/20/2011 | US20110014793 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device |
| 01/20/2011 | US20110014453 Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |
| 01/20/2011 | US20110012670 Providing in package power supplies for integrated circuits |
| 01/20/2011 | US20110012271 Integrated alignment and overlay mark |
| 01/20/2011 | US20110012270 Integrated circuit package system employing device stacking and method of manufacture thereof |
| 01/20/2011 | US20110012269 Electronic component used for wiring and method for manufacturing the same |
| 01/20/2011 | US20110012268 Semiconductor device |
| 01/20/2011 | US20110012267 Semiconductor integrated device having a contact structure, and corresponding manufacturing process |
| 01/20/2011 | US20110012266 Semiconductor device and method of manufacturing semiconductor device |
| 01/20/2011 | US20110012265 Semiconductor device |
| 01/20/2011 | US20110012264 Optoelectronic device with heat spreader unit |
| 01/20/2011 | US20110012263 Semiconductor device and manufacturing method of the same |
| 01/20/2011 | US20110012262 Semiconductor device and method of manufacturing the same |
| 01/20/2011 | US20110012261 Post bump and method of forming the same |
| 01/20/2011 | US20110012260 Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit |
| 01/20/2011 | US20110012259 Packaged semiconductor chips |
| 01/20/2011 | US20110012258 Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface |
| 01/20/2011 | US20110012257 Heat spreader for semiconductor package |
| 01/20/2011 | US20110012256 Semiconductor module |
| 01/20/2011 | US20110012255 Semiconductor device |
| 01/20/2011 | US20110012254 Air Cavity Package with Copper Heat Sink and Ceramic Window Frame |
| 01/20/2011 | US20110012253 Semiconductor Package Having Discrete Components And System Containing The Package |
| 01/20/2011 | US20110012252 Power semiconductor module and method of manufacturing the same |
| 01/20/2011 | US20110012251 Semiconductor device and method for manufacturing same |
| 01/20/2011 | US20110012250 Semiconductor device and method of fabrication |
| 01/20/2011 | US20110012249 Ic chip package having ic chip with overhang and/or bga blocking underfill material flow and related methods |
| 01/20/2011 | US20110012248 Method for producing a capping wafer for a sensor |
| 01/20/2011 | US20110012247 Socket type mems bonding |
| 01/20/2011 | US20110012246 Flat Leadless Packages and Stacked Leadless Package Assemblies |
| 01/20/2011 | US20110012245 Semiconductor device |
| 01/20/2011 | US20110012244 Semiconductor Chip Package |
| 01/20/2011 | US20110012243 Leadframe Having Delamination Resistant Die Pad |
| 01/20/2011 | US20110012242 Lead frame based ceramic air cavity package |
| 01/20/2011 | US20110012241 Semiconductor Chip Package |
| 01/20/2011 | US20110012240 Multi-Connect Lead |
| 01/20/2011 | US20110012238 Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same |
| 01/20/2011 | US20110012231 Semiconductor device and method for manufacturing the same |
| 01/20/2011 | US20110012223 Semiconductor-on-insulator with back side support layer |
| 01/20/2011 | US20110012218 Semiconductor device and method of fabricating the same |
| 01/20/2011 | US20110012213 Vertical sensor assembly method |
| 01/20/2011 | US20110012199 Semiconductor-on-insulator with back side heat dissipation |
| 01/20/2011 | US20110012181 Method of manufacturing semiconductor integrated circuit devcie having capacitor element |
| 01/20/2011 | US20110012159 Package for optical semiconductor device, optical semiconductor device using the package, and methods for producing same |
| 01/20/2011 | US20110012108 Semiconductor device having process failure detection circuit and semiconductor device production method |
| 01/20/2011 | US20110011829 Device Mounting Board |
| 01/20/2011 | US20110011640 Insulating medium and its use in high voltage devices |
| 01/20/2011 | US20110011450 Methods and structures for bonding elements |
| 01/20/2011 | US20110011399 Analyte Monitoring Device and Methods of Use |
| 01/20/2011 | DE202010008336U1 Konstruktion eines runden erhöhten Stücks aus Silizium Construction of a round elevated piece of silicon |
| 01/20/2011 | DE202010004350U1 Kühlsystem Cooling System |
| 01/20/2011 | DE202007019179U1 Basissubstrat für Verpackungen in Chipgröße Base substrate for packaging in chip size |
| 01/20/2011 | DE10221876B4 Verfahren zum Herstellen eines Keramik-Kupfer-Verbundsubstrats A method for manufacturing a ceramic-copper composite substrate |
| 01/20/2011 | DE102010030336A1 Leuchtdiodenvorrichtung Light emitting diode device |
| 01/20/2011 | DE102009033949A1 Kühlelement für eine Halbleiterlichtquelle einer Beleuchtungseinrichtung eines Kraftfahrzeugs Cooling element for a semiconductor light source of a lighting device of a motor vehicle |
| 01/20/2011 | DE102009032906A1 Modul mit mehreren thermoelektrischen Elementen Module having a plurality of thermoelectric elements |
| 01/20/2011 | DE102009027530A1 Leiterplatte Circuit board |
| 01/20/2011 | DE102009024384A1 Electronic power semiconductor module for use in power-electronic unit to start electrical engine, has partial bodies stacked on each other such that bodies are fixed to each other and semiconductor elements are supplied with pressure |
| 01/20/2011 | DE102008049193A1 Leistungshalbleiteranordnung Power semiconductor device |
| 01/20/2011 | CA2767555A1 Heat sink for an electronic or electrical component |
| 01/19/2011 | EP2276063A2 Improvement of solder interconnect by addition of copper |
| 01/19/2011 | EP2276035A2 Multi-layer memory chip with interlayer connections |
| 01/19/2011 | EP2275793A1 A pressure sensor having a chamber and a method for fabricating the same |
| 01/19/2011 | EP2275755A2 Compact, high-efficiency thermoelectric systems |
| 01/19/2011 | EP2275224A1 Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| 01/19/2011 | EP2274962A1 Wiring board and method for manufacturing the same |
| 01/19/2011 | EP2274773A2 Die stacking with an annular via having a recessed socket |
| 01/19/2011 | EP2274162A1 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
| 01/19/2011 | EP2070016B1 Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
| 01/19/2011 | EP0969964B2 A thermal control device |
| 01/19/2011 | CN201718158U Field-effect tube circuit cooling device |
| 01/19/2011 | CN201718152U Electric cabinet |
| 01/19/2011 | CN201718151U Radiating module |
| 01/19/2011 | CN201718148U Heat radiating device of telecommunication device |
| 01/19/2011 | CN201717825U Automobile alternating-current generator voltage regulator chip |
| 01/19/2011 | CN201717276U Junction box for heat conduction and heat dissipation treatment of diode |
| 01/19/2011 | CN201717263U Bridge type drive circuit chip |
| 01/19/2011 | CN201717262U Large-capacity thyristor power unit |
| 01/19/2011 | CN201717259U Low-power IGBT parallel radiator structure |
| 01/19/2011 | CN201717258U Lead frame for meatal oxide semiconductor (MOS) device |
| 01/19/2011 | CN201717257U High-current high-voltage diode lead wire |
| 01/19/2011 | CN201717256U Passive device and circuit board embedded with same |
| 01/19/2011 | CN201717255U Passive device and circuit board embedded with same |
| 01/19/2011 | CN201717254U Mounting device for power tube |
| 01/19/2011 | CN201717253U Rectifier diode assembling structure of automobile rectifier |
| 01/19/2011 | CN201717252U Fixed heat radiator of charger power tube |
| 01/19/2011 | CN201715468U Heat radiation mechanism of LED luminous device |
| 01/19/2011 | CN201715278U LED module type lamp |
| 01/19/2011 | CN1871696B Method for forming insulating film, system for forming insulating film, and method for manufacturing semiconductor device |
| 01/19/2011 | CN101953241A Heat exchanger |
| 01/19/2011 | CN101952962A Under bump routing layer method and apparatus |
| 01/19/2011 | CN101952961A Micromodules including integrated thin film inductors and methods of making the same |
| 01/19/2011 | CN101952960A Method for low-temperature pressure sintering |
| 01/19/2011 | CN101952959A Integrated circuit package and method of manufacturing same |
| 01/19/2011 | CN101952953A Method for formation of siliceous film and siliceous film formed by the method |
| 01/19/2011 | CN101952772A Active matrix substrate, liquid crystal panel, television receiver, and liquid crystal panel manufacturing method |
| 01/19/2011 | CN101951725A Printed circuit board unit and electronic device |