| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/26/2011 | CN101577259B Chip encapsulating structure |
| 01/26/2011 | CN101567364B Multichip package structure capable of arranging chips on pins |
| 01/26/2011 | CN101542696B Al alloy film for display device, display device, and sputtering target |
| 01/26/2011 | CN101541987B Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy |
| 01/26/2011 | CN101527301B Battery protection ic chip module |
| 01/26/2011 | CN101521216B Solid-state imaging device and camera |
| 01/26/2011 | CN101517718B Plastic packaged device with die interface layer |
| 01/26/2011 | CN101504949B Resistor converting memory and manufacturing method thereof |
| 01/26/2011 | CN101504935B Bond pad structure |
| 01/26/2011 | CN101499470B Power layout of integrated circuit and its design method |
| 01/26/2011 | CN101452861B Multi-chip stacking structure and preparation thereof |
| 01/26/2011 | CN101447469B Wafer level semiconductor package and method for manufacturing the same |
| 01/26/2011 | CN101447461B Semiconductor device package having a back side protective scheme and method thereof |
| 01/26/2011 | CN101388378B Electromagnetic noise suppressor and method thereof |
| 01/26/2011 | CN101373752B Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof |
| 01/26/2011 | CN101308839B Multi-port cam cell and making method thereof |
| 01/26/2011 | CN101271861B Multi-layer wiring structure forming method |
| 01/26/2011 | CN101253821B Hardware protected sensor for preventing sensitive electronic data component from being operated by external |
| 01/26/2011 | CN101231998B Circuit component |
| 01/26/2011 | CN101221973B Organic light emitting display device and method for fabricating the same |
| 01/26/2011 | CN101207118B 半导体芯片 Semiconductor chip |
| 01/26/2011 | CN101174644B Image sensor and preparation thereof |
| 01/26/2011 | CN101165894B Chip package for image sensor and method of manufacturing the same |
| 01/26/2011 | CN101136430B Semiconductor device |
| 01/26/2011 | CN101098588B 多层印刷电路板 Multilayer printed circuit board |
| 01/26/2011 | CN101094582B Integrated heat sink and light pipe mounting assembly |
| 01/26/2011 | CN101038930B Electroluminescence device, manufacturing method thereof, and electronic apparatus |
| 01/26/2011 | CN101022049B Varistor |
| 01/25/2011 | US7877120 Battery-operated wireless-communication apparatus and method |
| 01/25/2011 | US7876565 Method of obtaining enhanced localized thermal interface regions by particle stacking |
| 01/25/2011 | US7876564 Method and apparatus for cooling computer memory |
| 01/25/2011 | US7876563 Cooling structure of power semiconductor device and inverter |
| 01/25/2011 | US7876562 Electronic module having thermal cooling insert |
| 01/25/2011 | US7876439 Multi layer alignment and overlay target and measurement method |
| 01/25/2011 | US7876414 Liquid crystal display device, method for fabricating the same, and portable telephone using the same |
| 01/25/2011 | US7876040 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same |
| 01/25/2011 | US7875988 Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same |
| 01/25/2011 | US7875987 Method and apparatus for measurement and control of photomask to substrate alignment |
| 01/25/2011 | US7875985 Memory device |
| 01/25/2011 | US7875984 Complaint bonding structures for semiconductor devices |
| 01/25/2011 | US7875983 Semiconductor package |
| 01/25/2011 | US7875982 Semiconductor device for preventing voids in the contact region and method of forming the same |
| 01/25/2011 | US7875981 Polysilsesquioxanes; wear resistance; etching resistance; dielectrics; reduced parasitic capacitance |
| 01/25/2011 | US7875980 Semiconductor device having laminated structure |
| 01/25/2011 | US7875978 Metal line having a multi-layered diffusion layer in a semiconductor device and method for forming the same |
| 01/25/2011 | US7875977 Barrier layers for conductive features |
| 01/25/2011 | US7875976 Semiconductor device including a silicide layer and a dielectric layer |
| 01/25/2011 | US7875975 Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag |
| 01/25/2011 | US7875974 Laminated mounting structure and memory card |
| 01/25/2011 | US7875973 Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same |
| 01/25/2011 | US7875972 Semiconductor device assembly having a stress-relieving buffer layer |
| 01/25/2011 | US7875971 Semiconductor device having improved heat sink |
| 01/25/2011 | US7875970 Integrated circuit package having a castellated heatspreader |
| 01/25/2011 | US7875969 Rigid-flex printed circuit board with weakening structure |
| 01/25/2011 | US7875968 Leadframe, semiconductor package and support lead for bonding with groundwires |
| 01/25/2011 | US7875967 Integrated circuit with step molded inner stacking module package in package system |
| 01/25/2011 | US7875966 Stacked integrated circuit and package system |
| 01/25/2011 | US7875965 Semiconductor chip package |
| 01/25/2011 | US7875964 Multi-chip semiconductor connector and method |
| 01/25/2011 | US7875963 Semiconductor device including leadframe having power bars and increased I/O |
| 01/25/2011 | US7875962 Package for a power semiconductor device |
| 01/25/2011 | US7875956 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
| 01/25/2011 | US7875954 Semiconductor chip |
| 01/25/2011 | US7875939 Semiconductor device including an ohmic layer |
| 01/25/2011 | US7875933 Lateral bipolar transistor with additional ESD implant |
| 01/25/2011 | US7875928 Component arrangement having an evaluation circuit for detecting wear on connections |
| 01/25/2011 | US7875911 Semiconductor device and oscillator |
| 01/25/2011 | US7875901 Optical device package and optical semiconductor device using the same |
| 01/25/2011 | US7875894 Semiconductor device and fabrication method thereof |
| 01/25/2011 | US7875821 Method for sorting integrated circuit devices |
| 01/25/2011 | US7875812 Method and apparatus for electrical component physical protection |
| 01/25/2011 | US7875807 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin |
| 01/25/2011 | US7875552 Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby |
| 01/25/2011 | US7875551 Methods of forming integrated circuit devices using contact hole spacers to improve contact isolation |
| 01/25/2011 | US7875549 Fluorine doped carbon films produced by modification by radicals |
| 01/25/2011 | US7875548 Method for making semiconductor structures implementing sacrificial material |
| 01/25/2011 | US7875544 Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation |
| 01/25/2011 | US7875499 Method of manufacturing a stacked semiconductor apparatus |
| 01/25/2011 | US7875479 Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same |
| 01/25/2011 | US7875230 Method of manipulating a sheet of thermoplastic material |
| 01/25/2011 | US7874347 Heat pipe with hydrophilic layer and/or protective layer |
| 01/25/2011 | US7874066 Method of manufacturing a device-incorporated substrate |
| 01/20/2011 | WO2011009063A1 Barrier layer on polymer passivation for integrated circuit packaging |
| 01/20/2011 | WO2011008562A2 Integrated power amplifier with load inductor located under ic die |
| 01/20/2011 | WO2011008459A2 Structured material substrates for flexible, stretchable electronics |
| 01/20/2011 | WO2011008442A1 Electronic device having a molding compound including a composite material |
| 01/20/2011 | WO2011008295A1 Oxygen barrier compositions and related methods |
| 01/20/2011 | WO2011007874A1 Led chip assembly, led package, and manufacturing method of led package |
| 01/20/2011 | WO2011007709A1 Film-forming method |
| 01/20/2011 | WO2011007621A1 Light emitting device |
| 01/20/2011 | WO2011007604A1 Loop heat pump and startup method therefor |
| 01/20/2011 | WO2011007570A1 Electronic module and method for manufacturing same |
| 01/20/2011 | WO2011007510A1 Graphite sheet and heat transfer structure using same |
| 01/20/2011 | WO2011007507A1 Substrate for semiconductor package and method for manufacturing substrate for semiconductor package |
| 01/20/2011 | WO2011007469A1 Semiconductor device and method for producing the same |
| 01/20/2011 | WO2011006819A1 Heat sink for an electronic or electrical component |
| 01/20/2011 | WO2011006370A1 Hollow, liquid cooling and strip-shaped led lamp |
| 01/20/2011 | WO2010138480A3 Stacked semiconductor device assembly |
| 01/20/2011 | WO2010135168A3 Method for providing electrical connections to spaced conductive lines |
| 01/20/2011 | WO2010126255A3 Heat sink for a protrusion-type ic package |