| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/27/2011 | DE102010023695A1 Wärme abgebendes Halbleitergehäuse Heat-emitting semiconductor packages |
| 01/27/2011 | DE102010000448A1 Halbleiteranordnung mit einem leitfähigen Element A semiconductor device comprising a conductive element |
| 01/27/2011 | DE102009034483A1 Bleifreie Hochtemperaturverbindung für die AVT in der Elektronik Lead-free high-temperature compound for the AVT in electronics |
| 01/27/2011 | DE102009034138A1 Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleitermodul Power semiconductor module having a sandwich with a power semiconductor module |
| 01/27/2011 | DE102009027995A1 Vorrichtung mit einem Halbleiterbauelement und einem Gehäuse und Verfahren zur Herstellung der Vorrichtung An apparatus with a semiconductor device and a housing, and method for manufacturing the device |
| 01/27/2011 | DE102009008772A1 Self-adjusting bonding method for positioning, fixing, contacting of chip on silicon surface, involves nano-structuring surface area of chip or chip carrier, where surface areas of needle are auxiliary nano-porous |
| 01/27/2011 | DE102004009296B4 Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements A method of manufacturing an arrangement of an electrical component |
| 01/26/2011 | EP2278617A2 Electrical via hole with rough lateral surface |
| 01/26/2011 | EP2278616A2 High-power semiconductor module with a sandwich with a high-power semiconductor component |
| 01/26/2011 | EP2278615A2 Semiconductor package with a stiffening member supporting a thermal heat spreader |
| 01/26/2011 | EP2278614A1 Electrical via with lateral extensions |
| 01/26/2011 | EP2278613A1 Ring-shaped electrical via made of a plurality of elementary conductive vias |
| 01/26/2011 | EP2278593A1 Connecting material and semiconductor device |
| 01/26/2011 | EP2278317A1 Field effect transistor device for ultra-fast nucleic acid sequencing |
| 01/26/2011 | EP2278166A2 Bearing for refrigerating compressor |
| 01/26/2011 | EP2277949A1 Resin composition and sheet using the same |
| 01/26/2011 | EP2277799A1 Hydrated humidity control substance and process for its preparation |
| 01/26/2011 | EP2277197A1 Interposers, electronic modules, and methods for forming the same |
| 01/26/2011 | EP2277196A1 Electrical bond connection arrangement |
| 01/26/2011 | EP2277179A1 Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for rf applications |
| 01/26/2011 | EP2277056A1 Method for manufacturing and testing an integrated electronic circuit |
| 01/26/2011 | EP2276606A1 Method of manufacturing a heat exchanger |
| 01/26/2011 | EP2027762B1 Electrical device with screen |
| 01/26/2011 | CN201726632U Cooling plate fixing structure of electronic products |
| 01/26/2011 | CN201726630U Heat conducting pipe bridging structure and radiating module thereof |
| 01/26/2011 | CN201725793U Automobile rectifier bridge |
| 01/26/2011 | CN201725792U Carrier tape for encapsulation of multi-range intelligent card module |
| 01/26/2011 | CN201725791U Lead frame of small outline integrated circuit package structure and package device |
| 01/26/2011 | CN201725790U Chip with double-layer lead pin |
| 01/26/2011 | CN201725789U Fin air guide radiating structure and radiating module thereof |
| 01/26/2011 | CN201725788U Novel radiator |
| 01/26/2011 | CN201725787U Novel plate compression joint double chip ceramic package |
| 01/26/2011 | CN201725786U Panel reverse ceramic outer casing |
| 01/26/2011 | CN1897259B High frequency package device |
| 01/26/2011 | CN1894791B Heat-conducting interface material and solder prefabricated product |
| 01/26/2011 | CN1893096B Thin film transistor array panel and method for manufacturing the same |
| 01/26/2011 | CN1879212B Diode |
| 01/26/2011 | CN1815727B Wire loop, semiconductor device having same and wire bonding method |
| 01/26/2011 | CN1732567B Semiconductor device power interconnect striping |
| 01/26/2011 | CN1566710B 风向出口控制单元 Dir export control unit |
| 01/26/2011 | CN1506768B Alignment system and method for photoetching system |
| 01/26/2011 | CN101960706A Semiconductor device and power converter using the semiconductor device |
| 01/26/2011 | CN101960608A Semiconductor device and semiconductor device manufacturing method |
| 01/26/2011 | CN101960590A Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die |
| 01/26/2011 | CN101960589A Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same |
| 01/26/2011 | CN101960588A Semiconductor device and semiconductor device fabrication method |
| 01/26/2011 | CN101960587A Mounted board, mounted board set, and panel unit |
| 01/26/2011 | CN101960586A Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive |
| 01/26/2011 | CN101960585A Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member |
| 01/26/2011 | CN101960583A Semiconductor device, basic cell and semiconductor integrated circuit device |
| 01/26/2011 | CN101960582A Wiring board, semiconductor device, and process for producing semiconductor device |
| 01/26/2011 | CN101959937A Thermosetting organic-inorganic hybrid transparent material |
| 01/26/2011 | CN101959925A Curable reaction resin system |
| 01/26/2011 | CN101959924A Modified reaction resin |
| 01/26/2011 | CN101959788A Sheet structure, semiconductor device and method of growing carbon structure |
| 01/26/2011 | CN101959393A Main board radiation device and set-top box with same |
| 01/26/2011 | CN101959390A Combined wind scooper |
| 01/26/2011 | CN101959389A Heat radiating device and manufacture method thereof |
| 01/26/2011 | CN101959386A Fastener |
| 01/26/2011 | CN101959377A Shell structure |
| 01/26/2011 | CN101958314A Manufacture method and usage of folded system-in-package |
| 01/26/2011 | CN101958313A 半导体模块 Semiconductor Modules |
| 01/26/2011 | CN101958312A Electronic control unit |
| 01/26/2011 | CN101958311A Semiconductor structure and forming method |
| 01/26/2011 | CN101958310A Semiconductor device and formation method thereof |
| 01/26/2011 | CN101958309A Semiconductor chip interconnection structure and semiconductor package formed using the same |
| 01/26/2011 | CN101958308A Semiconductor device |
| 01/26/2011 | CN101958307A Power semiconductor module and method of manufacturing the same |
| 01/26/2011 | CN101958306A Embedded circuit substrate and manufacturing method thereof |
| 01/26/2011 | CN101958305A Double-side graph chip forward module package structure and package method thereof |
| 01/26/2011 | CN101958304A Double-side graph chip direct-put module package structure and package method thereof |
| 01/26/2011 | CN101958303A Double-side graph chip forward single package structure and package method thereof |
| 01/26/2011 | CN101958302A Double-side graph chip inverse single package structure and package method thereof |
| 01/26/2011 | CN101958301A Double-side graph chip direct-put single package structure and package method thereof |
| 01/26/2011 | CN101958300A Double-sided graphic chip inversion module packaging structure and packaging method thereof |
| 01/26/2011 | CN101958299A Method for packaging single double-sided graphic chip by way of directly arranging and then sequentially plating and etching |
| 01/26/2011 | CN101958298A Semiconductor device and manufacturing method of the same |
| 01/26/2011 | CN101958297A Array flexible welding stud-connected and evaporation-cooled semiconductor device package |
| 01/26/2011 | CN101958296A 半导体器件 Semiconductor devices |
| 01/26/2011 | CN101958295A Semiconductor device |
| 01/26/2011 | CN101958294A Multi-connect lead |
| 01/26/2011 | CN101958293A Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device |
| 01/26/2011 | CN101958292A Printed circuit board, encapsulation piece and manufacture methods thereof |
| 01/26/2011 | CN101958291A Electronic control unit |
| 01/26/2011 | CN101958290A Semiconductor device and method for manufacturing same |
| 01/26/2011 | CN101958289A Semiconductor device |
| 01/26/2011 | CN101958288A Semiconductor assembly |
| 01/26/2011 | CN101958287A Chip closed loop comprising deep groove structure |
| 01/26/2011 | CN101958261A Stackable semiconductor device packages |
| 01/26/2011 | CN101958260A Structures and methods to improve lead-free C4 interconnect reliability |
| 01/26/2011 | CN101958259A Improvement of solder interconnect by addition of copper |
| 01/26/2011 | CN101958254A 芯片封装体及其制作方法 Chip package and manufacturing method thereof |
| 01/26/2011 | CN101958253A Packaging technique and packaging structure |
| 01/26/2011 | CN101958248A PN-junction diode, phase-change random access memory and manufacturing method thereof |
| 01/26/2011 | CN101958237A Method for forming photolithography alignment marks |
| 01/26/2011 | CN101957566A Integrated alignment and overlay mark |
| 01/26/2011 | CN101955736A Adhesive composition and connecting structure |
| 01/26/2011 | CN101955629A Epoxy resin composition capable of being used as semiconductor encapsulating material |
| 01/26/2011 | CN101661944B Pixel unit structure of ultraviolet image sensor and preparation method thereof |
| 01/26/2011 | CN101609812B Method for forming electrostatic discharging element |