| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/01/2011 | US7880279 Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same |
| 02/01/2011 | US7880278 Integrated circuit having stress tuning layer |
| 02/01/2011 | US7880277 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly |
| 02/01/2011 | US7880276 Wiring board and semiconductor device |
| 02/01/2011 | US7880275 Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device |
| 02/01/2011 | US7880266 Four-terminal antifuse structure having integrated heating elements for a programmable circuit |
| 02/01/2011 | US7880265 Packaged integrated circuit |
| 02/01/2011 | US7880260 Semiconductor device with a semiconductor body and method for its production |
| 02/01/2011 | US7880247 Semiconductor input control device |
| 02/01/2011 | US7880243 Simple low power circuit structure with metal gate and high-k dielectric |
| 02/01/2011 | US7880234 NPN Darlington ESD protection circuit |
| 02/01/2011 | US7880179 Process for making contact with and housing integrated circuits |
| 02/01/2011 | US7880115 Method for laser annealing to form an epitaxial growth layer |
| 02/01/2011 | US7880097 Fire resistant and/or water resistant enclosure for operable computer digital data storage device |
| 02/01/2011 | US7879956 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 02/01/2011 | US7879722 Semiconductor device and method of manufacturing the same |
| 02/01/2011 | US7879720 Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation |
| 02/01/2011 | US7879716 Metal seed layer deposition |
| 02/01/2011 | US7879715 Methods of forming electronic structures including conductive shunt layers and related structures |
| 02/01/2011 | US7879682 Marker structure and method for controlling alignment of layers of a multi-layered substrate |
| 02/01/2011 | US7879655 Semiconductor device and a manufacturing method of the same |
| 02/01/2011 | US7879654 Paper including semiconductor device and manufacturing method thereof |
| 02/01/2011 | US7879649 Programmable capacitor associated with an input/output pad |
| 02/01/2011 | US7879647 Semiconductor device and a method of manufacturing the same |
| 02/01/2011 | US7879633 Miniature optical element for wireless bonding in an electronic instrument |
| 02/01/2011 | US7879455 comprises Sn, Sb, Ag, and Cu as the main elements and optionally at least one element selected from Ni, Ge, Ga and P; lead-free; heat resistant, bondability, excellent in the suppliabilty and wettability; storage stability and the temperature cycle reliability |
| 02/01/2011 | US7879445 Adhesive for bonding circuit members, circuit board and process for its production |
| 02/01/2011 | US7879405 Resin composition for sealing light emitting device |
| 02/01/2011 | US7878888 Rack enclosure |
| 02/01/2011 | CA2600894C A radio frequency circuit board topology |
| 02/01/2011 | CA2416431C Method for processing fluid flows in a micro component reformer system |
| 01/27/2011 | WO2011011298A2 Method of operating a clamping system of a wire bonding machine |
| 01/27/2011 | WO2011011212A1 A high-bandwidth ramp-stack chip package |
| 01/27/2011 | WO2011011187A2 Optoelectronic device with heat spreader unit |
| 01/27/2011 | WO2011010936A1 Local thermal management |
| 01/27/2011 | WO2011010650A1 Film forming method |
| 01/27/2011 | WO2011010597A1 Silicon nitride insulating sheet and semiconductor module structure using same |
| 01/27/2011 | WO2011010527A1 Composition for film formation, insulating film, and semiconductor device |
| 01/27/2011 | WO2011010521A1 Surface mount crystal oscillator |
| 01/27/2011 | WO2011010118A1 Packaging or mounting a component |
| 01/27/2011 | WO2011009658A1 Device having a semiconductor element and a housing and method for producing the device |
| 01/27/2011 | WO2011009444A1 Method for producing a structured coating on a substrate, coated substrate, and semi-finished product having a coated substrate |
| 01/27/2011 | WO2010099080A3 Systems and methods for improved photovoltaic module structure and encapsulation |
| 01/27/2011 | WO2010039453A3 Inertial sensor with dual cavity package and method of fabrication |
| 01/27/2011 | US20110021005 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 01/27/2011 | US20110021002 Process for Making Contact with and Housing Integrated Circuits |
| 01/27/2011 | US20110020984 Method of Manufacturing A Semiconductor Device |
| 01/27/2011 | US20110020983 Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus |
| 01/27/2011 | US20110020962 Test circuit under pad |
| 01/27/2011 | US20110019494 Method of manufacturing semiconductor device and semiconductor device |
| 01/27/2011 | US20110018147 Alignment key, method for fabricating the alignment key, and method for fabricating thin film transistor substrate using the alignment key |
| 01/27/2011 | US20110018146 Spacer double patterning for lithography operations |
| 01/27/2011 | US20110018145 Microelectronic substrate including embedded components and spacer layer and method of forming same |
| 01/27/2011 | US20110018144 Wiring board and semiconductor device |
| 01/27/2011 | US20110018143 Wafer level packaging |
| 01/27/2011 | US20110018142 Active matrix substrate, display device, method for inspecting active matrix substrate, and method for inspecting display device |
| 01/27/2011 | US20110018141 Wiring structure in a semiconductor device |
| 01/27/2011 | US20110018140 Electric via comprising lateral outgrowths |
| 01/27/2011 | US20110018139 Scalloped tubular electric via |
| 01/27/2011 | US20110018138 Nano-interconnects for atomic and molecular scale circuits |
| 01/27/2011 | US20110018137 Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus |
| 01/27/2011 | US20110018135 Method of electrically connecting a wire to a pad of an integrated circuit chip and electronic device |
| 01/27/2011 | US20110018134 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride |
| 01/27/2011 | US20110018133 Electric via with a rough lateral surface |
| 01/27/2011 | US20110018131 Bonding pad for preventing pad peeling |
| 01/27/2011 | US20110018130 Semiconductor package and semiconductor package module |
| 01/27/2011 | US20110018129 Semiconductor Device |
| 01/27/2011 | US20110018128 Package structure and method for reducing dielectric layer delamination |
| 01/27/2011 | US20110018127 Multilayer UV-Curable Adhesive Film |
| 01/27/2011 | US20110018126 Low noise high thermal conductivity mixed signal package |
| 01/27/2011 | US20110018125 Semiconductor package with a stiffening member supporting a thermal heat spreader |
| 01/27/2011 | US20110018124 Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof |
| 01/27/2011 | US20110018123 Semiconductor package and method of manufacturing the same |
| 01/27/2011 | US20110018122 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device |
| 01/27/2011 | US20110018121 Semiconductor packages and methods of fabricating the same |
| 01/27/2011 | US20110018120 High-bandwidth ramp-stack chip package |
| 01/27/2011 | US20110018119 Semiconductor packages including heat slugs |
| 01/27/2011 | US20110018118 Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof |
| 01/27/2011 | US20110018117 Sealed joint structure of device and process using the same |
| 01/27/2011 | US20110018116 Chip scale surface mounted semiconductor device package and process of manufacture |
| 01/27/2011 | US20110018114 Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation |
| 01/27/2011 | US20110018113 Method for packaging micromachined devices |
| 01/27/2011 | US20110018112 Semiconductor package and method for manufacturing the same |
| 01/27/2011 | US20110018111 Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow |
| 01/27/2011 | US20110018110 Electronic device, method of producing the same, and semiconductor device |
| 01/27/2011 | US20110018109 Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation |
| 01/27/2011 | US20110018107 TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices |
| 01/27/2011 | US20110018093 Programmable anti-fuse structure with dlc dielectric layer |
| 01/27/2011 | US20110018092 Semiconductor device |
| 01/27/2011 | US20110018091 Fuse link structures using film stress for programming and methods of manufacture |
| 01/27/2011 | US20110018075 Structure and fabrication method of a sensing device |
| 01/27/2011 | US20110018066 Semiconductor device and method of manufacturing the same |
| 01/27/2011 | US20110018019 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same |
| 01/27/2011 | US20110018018 Semiconductor chip package structure for achieving electrical connection without using wire-bonding process and method for making the same |
| 01/27/2011 | US20110018007 Electronic device, display apparatus, and electronic device manufacturing method |
| 01/27/2011 | US20110017704 Method of electrically connecting a microelectronic component |
| 01/27/2011 | US20110017507 Z-Directed Variable Value Components for Printed Circuit Boards |
| 01/27/2011 | US20110017506 Modular over-mold harness |
| 01/27/2011 | DE4431847C5 Substrat mit bondfähiger Beschichtung Substrate with bondable coating |
| 01/27/2011 | DE112009000555T5 Isolationsträger und Verfahren zu dessen Herstellung Isolation carrier and process for its preparation |