| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/02/2011 | CN201732787U Static discharge protector |
| 02/02/2011 | CN201732784U Led点阵模块 Led dot matrix module |
| 02/02/2011 | CN201732783U Modularized universal power panel |
| 02/02/2011 | CN201732782U Semiconductor chip lead frame packaging structure |
| 02/02/2011 | CN201732781U Lead frame |
| 02/02/2011 | CN201732780U Packaging radiation modified structure of semiconductor flip chip welding |
| 02/02/2011 | CN201732779U High-reliability diode |
| 02/02/2011 | CN201732326U Heat dissipation device capable of supplying cold air |
| 02/02/2011 | CN1980559B Radiating system |
| 02/02/2011 | CN1757119B Group III nitride based flip-chip integrated circuit and method for fabricating |
| 02/02/2011 | CN101965637A Integrated circuit with mosfet fuse element |
| 02/02/2011 | CN101965636A Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer |
| 02/02/2011 | CN101965635A Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device |
| 02/02/2011 | CN101965634A Self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, and method of use |
| 02/02/2011 | CN101965617A Conductive material, conductive paste, circuit board, and semiconductor device |
| 02/02/2011 | CN101965313A Doped tin tellurides for thermoelectric applications |
| 02/02/2011 | CN101965244A Method of manufacturing a heat exchanger |
| 02/02/2011 | CN101965121A Method for preparing heat conduction structure of heating element, and heat conduction structure |
| 02/02/2011 | CN101965117A Radiator |
| 02/02/2011 | CN101965097A Printed circuit board and its manufacture method |
| 02/02/2011 | CN101964357A Semiconductor device and manufacturing method thereof |
| 02/02/2011 | CN101964342A 半导体器件 Semiconductor devices |
| 02/02/2011 | CN101964341A Light-emitting structure with a plurality of backup welding pads for improving lead welding success rate and manufacture method thereof |
| 02/02/2011 | CN101964340A Power amplifier packaging device and base station equipment |
| 02/02/2011 | CN101964339A Semiconductor packaging piece, manufacturing method thereof and manufacturing method of rerouted chip package |
| 02/02/2011 | CN101964338A Semiconductor packaging part and manufacturing method thereof as well as chip-redistribution encapsulant |
| 02/02/2011 | CN101964337A Semiconductor encapsulation structure and manufacturing method thereof |
| 02/02/2011 | CN101964336A Multi-layer substrate with low-leakage current and high heat conductivity and its correlation method |
| 02/02/2011 | CN101964335A Packaging member and production method thereof |
| 02/02/2011 | CN101964334A Semiconductor package and semiconductor package module |
| 02/02/2011 | CN101964333A Wirebond structures |
| 02/02/2011 | CN101964332A Chip scale surface mounted semiconductor device package and process of manufacture |
| 02/02/2011 | CN101964331A Power semiconductor module with a sandwich with a power semiconductor component |
| 02/02/2011 | CN101964313A Packaging structure and packaging method |
| 02/02/2011 | CN101964312A Manufacturing method of a resin seal type electronic component and aggregation body of the resin seal type electronic component |
| 02/02/2011 | CN101964311A Method of forming integrated circuit and integrated circuit structure |
| 02/02/2011 | CN101964308A Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus |
| 02/02/2011 | CN101963725A Gate lead and manufacturing method thereof |
| 02/02/2011 | CN101963340A Lighting device |
| 02/02/2011 | CN101963337A 照明装置 Lighting device |
| 02/02/2011 | CN101962466A Intrinsic flame-retardant epoxy resin composition for semiconductor package |
| 02/02/2011 | CN101640197B Semiconductor structure and method for manufacturing same |
| 02/02/2011 | CN101582434B Image sensor packaging structure, manufacturing method thereof and camera module |
| 02/02/2011 | CN101567361B Wafer alignment mark |
| 02/02/2011 | CN101494216B Structure for testing reliability analysis of integrated circuit inner layer dielectric |
| 02/02/2011 | CN101494205B Integrated circuit package body and method of manufacturing the same |
| 02/02/2011 | CN101465344B Encapsulation structure of image die set |
| 02/02/2011 | CN101276804B Semiconductor device test line structure integrated circuit test structure and test method |
| 02/02/2011 | CN101266962B Semiconductor device and method of manufacturing the same |
| 02/02/2011 | CN101240892B High heat dispersion LED road lamp |
| 02/02/2011 | CN101150094B Semiconductor crystal circle structure |
| 02/02/2011 | CN101111935B Semiconductor apparatus |
| 02/01/2011 | US7881256 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 02/01/2011 | US7881072 System and method for processor power delivery and thermal management |
| 02/01/2011 | US7881071 Multilayer printed wiring board |
| 02/01/2011 | US7881069 Printed circuit board |
| 02/01/2011 | US7881061 Mounting device for mounting heat sink onto electronic component |
| 02/01/2011 | US7881026 Semiconductor integrated circuit |
| 02/01/2011 | US7880880 Alignment systems and methods for lithographic systems |
| 02/01/2011 | US7880556 Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system |
| 02/01/2011 | US7880555 Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system |
| 02/01/2011 | US7880318 Sensing system and method of making the same |
| 02/01/2011 | US7880317 Semiconductor device and method of manufacturing semiconductor device |
| 02/01/2011 | US7880316 Dicing die-bonding film and process for producing semiconductor device |
| 02/01/2011 | US7880315 Methods for bonding and micro-electronic devices produced according to such methods |
| 02/01/2011 | US7880314 Wiring substrate and electronic component mounting structure |
| 02/01/2011 | US7880313 Semiconductor flip chip package having substantially non-collapsible spacer |
| 02/01/2011 | US7880312 Semiconductor memory device |
| 02/01/2011 | US7880311 Stacked semiconductor package and method for manufacturing the same |
| 02/01/2011 | US7880310 Direct device attachment on dual-mode wirebond die |
| 02/01/2011 | US7880309 Arrangement of stacked integrated circuit dice having a direct electrical connection |
| 02/01/2011 | US7880308 Semiconductor device |
| 02/01/2011 | US7880307 Semiconductor device including through-wafer interconnect structure |
| 02/01/2011 | US7880306 Semiconductor device and method of producing the same |
| 02/01/2011 | US7880305 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
| 02/01/2011 | US7880304 Post passivation interconnection schemes on top of the IC chips |
| 02/01/2011 | US7880303 Stacked contact with low aspect ratio |
| 02/01/2011 | US7880302 Semiconductor device having metal wirings of laminated structure |
| 02/01/2011 | US7880301 Semiconductor device and method for manufacturing the same |
| 02/01/2011 | US7880300 Semiconductor chip comprising a metal coating structure and associated production method |
| 02/01/2011 | US7880299 Semiconductor device |
| 02/01/2011 | US7880298 Semiconductor device thermal connection |
| 02/01/2011 | US7880297 Semiconductor chip having conductive member for reducing localized voltage drop |
| 02/01/2011 | US7880296 Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon |
| 02/01/2011 | US7880295 Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 02/01/2011 | US7880294 Potential-free housing leadthrough |
| 02/01/2011 | US7880293 Wafer integrated with permanent carrier and method therefor |
| 02/01/2011 | US7880292 Semiconductor device and fabricating method thereof |
| 02/01/2011 | US7880291 Integrated circuit package and integrated circuit module |
| 02/01/2011 | US7880290 Flip-chip packages allowing reduced size without electrical shorts and methods of manufacturing the same |
| 02/01/2011 | US7880289 Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same |
| 02/01/2011 | US7880288 Semiconductor module with semiconductor chips and method for producing it |
| 02/01/2011 | US7880287 Stud bumps for die alignment |
| 02/01/2011 | US7880286 Tape wiring substrate and chip-on-film package using the same |
| 02/01/2011 | US7880285 Semiconductor device comprising a semiconductor chip stack and method for producing the same |
| 02/01/2011 | US7880284 Embedded power gating |
| 02/01/2011 | US7880283 High reliability power module |
| 02/01/2011 | US7880282 Semiconductor package with integrated heatsink and electromagnetic shield |
| 02/01/2011 | US7880281 Switching assembly for an aircraft ignition system |
| 02/01/2011 | US7880280 Electronic component and method for manufacturing an electronic component |