| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/09/2011 | CN101673725B Flexible circuit board |
| 02/09/2011 | CN101663748B Functional element package and fabrication method therefor |
| 02/09/2011 | CN101635280B Window-type ball grid array packaging structure and manufacturing method thereof |
| 02/09/2011 | CN101622709B Semiconductor module and inverter apparatus |
| 02/09/2011 | CN101606234B Etching method and recording medium |
| 02/09/2011 | CN101582441B Display apparatus |
| 02/09/2011 | CN101582424B Top-grate structure thin film transistor and manufacturing method thereof |
| 02/09/2011 | CN101582399B Contact structure and joining structure |
| 02/09/2011 | CN101572265B Thin film transistor structure and manufacture method thereof |
| 02/09/2011 | CN101566767B Liquid crystal display panel |
| 02/09/2011 | CN101561608B Liquid crystal display device |
| 02/09/2011 | CN101556958B Thin film transistor substrate and liquid crystal display device |
| 02/09/2011 | CN101552263B Wafer-level packaging of chip and packaging method thereof |
| 02/09/2011 | CN101533816B A conductive projection structure and a chip welded structure of display panel |
| 02/09/2011 | CN101510531B Sealing cover plate of organic light-emitting display |
| 02/09/2011 | CN101500394B Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching method and apparatus |
| 02/09/2011 | CN101442050B Integrated circuit suitable for various encapsulation modes |
| 02/09/2011 | CN101436593B Semiconductor capacitance structure and layout thereof |
| 02/09/2011 | CN101412838B Epoxy resin composition for packaging and electronic components employing same |
| 02/09/2011 | CN101408299B LED light fitting with heat radiating device |
| 02/09/2011 | CN101379107B Resin composition for semiconductor encapsulation and semiconductor device |
| 02/09/2011 | CN101345228B Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment |
| 02/09/2011 | CN101339735B Organic el device and organic el display apparatus |
| 02/09/2011 | CN101315910B GaAs semiconductor substrate and fabrication method thereof |
| 02/09/2011 | CN101310380B Semiconductor package, electronic parts, and electronic device |
| 02/09/2011 | CN101231997B Circuit component |
| 02/09/2011 | CN101231996B Circuit component |
| 02/09/2011 | CN101231995B Circuit component |
| 02/09/2011 | CN101231993B Circuit component |
| 02/09/2011 | CN101211911B Semiconductor integrated circuit |
| 02/09/2011 | CN101176203B Materials and method to seal vias in silicon substrates |
| 02/09/2011 | CN101141862B Buckling device and heat radiator for applying the same |
| 02/09/2011 | CN101124345B Copper alloy and method for production thereof |
| 02/09/2011 | CN101123225B Protection method and device for semiconductor part table |
| 02/09/2011 | CN101093852B Organic electroluminescence display device |
| 02/09/2011 | CN101047224B Thermoelectric module |
| 02/09/2011 | CN101045852B Sealing material tablet, method of manufacturing the tablet and electronic component device |
| 02/09/2011 | CN101034663B Method and structure for improved alignment in mram integration |
| 02/09/2011 | CN101032024B Gate stacks |
| 02/08/2011 | US7885782 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture |
| 02/08/2011 | US7885699 Analyte monitoring device and methods of use |
| 02/08/2011 | US7885299 Semiconductor laser equipment |
| 02/08/2011 | US7884914 Structure for encapsulating a liquid crystal display device |
| 02/08/2011 | US7884489 Press-fit integrated circuit package involving compressed spring contact beams |
| 02/08/2011 | US7884488 Semiconductor component with improved contact pad and method for forming the same |
| 02/08/2011 | US7884487 Rotation joint and semiconductor device having the same |
| 02/08/2011 | US7884486 Chip-stacked package structure and method for manufacturing the same |
| 02/08/2011 | US7884485 Semiconductor device interconnect systems and methods |
| 02/08/2011 | US7884484 Wiring board and method of manufacturing the same |
| 02/08/2011 | US7884483 Chip connector |
| 02/08/2011 | US7884482 Flip-chip mounting substrate |
| 02/08/2011 | US7884481 Semiconductor chip package and method for designing the same |
| 02/08/2011 | US7884480 Semiconductor device and method of manufacturing same |
| 02/08/2011 | US7884479 Top layers of metal for high performance IC's |
| 02/08/2011 | US7884478 Semiconductor apparatus |
| 02/08/2011 | US7884477 Air gap structure having protective metal silicide pads on a metal feature |
| 02/08/2011 | US7884476 Semiconductor device |
| 02/08/2011 | US7884475 Conductor structure including manganese oxide capping layer |
| 02/08/2011 | US7884474 Method for fabricating semiconductor device and semiconductor device |
| 02/08/2011 | US7884473 Method and structure for increased wire bond density in packages for semiconductor chips |
| 02/08/2011 | US7884472 Semiconductor package having substrate ID code and its fabricating method |
| 02/08/2011 | US7884471 Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same |
| 02/08/2011 | US7884470 Semiconductor packages with stiffening support for power delivery |
| 02/08/2011 | US7884469 Semiconductor package having a bridged plate interconnection |
| 02/08/2011 | US7884468 Cooling systems for power semiconductor devices |
| 02/08/2011 | US7884467 Package structure of a microphone |
| 02/08/2011 | US7884466 Semiconductor device with double-sided electrode structure and its manufacturing method |
| 02/08/2011 | US7884465 Semiconductor package with passive elements embedded within a semiconductor chip |
| 02/08/2011 | US7884464 3D electronic packaging structure having a conductive support substrate |
| 02/08/2011 | US7884463 Wiring board, semiconductor device and semiconductor element |
| 02/08/2011 | US7884462 Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof |
| 02/08/2011 | US7884461 System-in-package and manufacturing method of the same |
| 02/08/2011 | US7884460 Integrated circuit packaging system with carrier and method of manufacture thereof |
| 02/08/2011 | US7884459 Semiconductor device suitable for a stacked structure |
| 02/08/2011 | US7884458 Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package |
| 02/08/2011 | US7884457 Integrated circuit package system with dual side connection |
| 02/08/2011 | US7884456 Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant |
| 02/08/2011 | US7884455 Semiconductor device |
| 02/08/2011 | US7884454 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package |
| 02/08/2011 | US7884453 Semiconductor device and manufacturing method thereof |
| 02/08/2011 | US7884452 Semiconductor power device package having a lead frame-based integrated inductor |
| 02/08/2011 | US7884451 Packaging for high speed integrated circuits |
| 02/08/2011 | US7884449 Process for precision placement of integrated circuit overcoat material |
| 02/08/2011 | US7884409 Semiconductor device and method of fabricating the same |
| 02/08/2011 | US7884396 Method and structure for self-aligned device contacts |
| 02/08/2011 | US7884369 Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same |
| 02/08/2011 | US7884359 Integrally gated carbon nanotube ionizer device |
| 02/08/2011 | US7884286 Multilayer printed circuit board |
| 02/08/2011 | US7884030 Gap-filling with uniform properties |
| 02/08/2011 | US7884008 Semiconductor device fabrication method |
| 02/08/2011 | US7884007 Super high density module with integrated wafer level packages |
| 02/08/2011 | US7883993 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
| 02/08/2011 | US7883985 Chip and multi-chip semiconductor device using the chip, and method for manufacturing same |
| 02/08/2011 | US7883982 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
| 02/08/2011 | US7883964 Nonvolatile semiconductor memory and a fabrication method thereof |
| 02/08/2011 | US7883947 Method of fabricating a device with ESD and I/O protection |
| 02/08/2011 | US7883942 Contact structure of semiconductor device, manufacturing method thereof, thin film transistor array panel including contact structure, and manufacturing method thereof |
| 02/08/2011 | US7883823 Photomask and method for manufacturing a semiconductor device using the photomask |
| 02/08/2011 | US7882624 Method of forming electronic package having fluid-conducting channel |
| 02/08/2011 | CA2535717C Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |