| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/10/2011 | US20110031614 Methods for fabricating semiconductor components and packaged semiconductor components |
| 02/10/2011 | US20110031613 Semiconductor package having a heat dissipation member |
| 02/10/2011 | US20110031612 Power semiconductor circuit device and method for manufacturing the same |
| 02/10/2011 | US20110031611 Embedded laminated device |
| 02/10/2011 | US20110031610 Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device |
| 02/10/2011 | US20110031609 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same |
| 02/10/2011 | US20110031608 Power device package and method of fabricating the same |
| 02/10/2011 | US20110031607 Conductor package structure and method of the same |
| 02/10/2011 | US20110031606 Packaging substrate having embedded semiconductor chip |
| 02/10/2011 | US20110031605 Package structure and package process |
| 02/10/2011 | US20110031604 Semiconductor package requiring reduced manufacturing processes |
| 02/10/2011 | US20110031603 Semiconductor devices having stress relief layers and methods for fabricating the same |
| 02/10/2011 | US20110031602 Method of manufacturing a semiconductor device |
| 02/10/2011 | US20110031601 Stacked semiconductor device and method of forming serial path thereof |
| 02/10/2011 | US20110031600 Semiconductor package |
| 02/10/2011 | US20110031598 Semiconductor device and fabricating method thereof |
| 02/10/2011 | US20110031597 Semiconductor device and method including first and second carriers |
| 02/10/2011 | US20110031596 Nickel-titanum soldering layers in semiconductor devices |
| 02/10/2011 | US20110031595 Microwave module |
| 02/10/2011 | US20110031594 Conductor package structure and method of the same |
| 02/10/2011 | US20110031593 Method of manufacturing semiconductor device, substrate processing apparatus, and semiconductor device |
| 02/10/2011 | US20110031591 Semiconductor package and stacked semiconductor package having the same |
| 02/10/2011 | US20110031590 Liquid film assisted laser die marking and structures formed thereby |
| 02/10/2011 | US20110031584 Semiconductor device and manufacturing method thereof |
| 02/10/2011 | US20110031582 Fin anti-fuse with reduced programming voltage |
| 02/10/2011 | US20110031581 Integrated circuit (ic) having tsvs with dielectric crack suppression structures |
| 02/10/2011 | US20110030938 Heat dissipation structure and heat dissipation system adopting the same |
| 02/10/2011 | US20110030924 Heat sink with heat pipes and method for manufacturing the same |
| 02/10/2011 | US20110030894 Vacuum heat insulator and its manufacturing method |
| 02/10/2011 | DE202010016198U1 Integriertes Wärmeleitpolster Integrated Wärmeleitpolster |
| 02/10/2011 | DE202006020926U1 Leuchte Light |
| 02/10/2011 | DE10323903B4 Verfahren zur Herstellung einer Mehrschicht-Schaltkreiskarte A process for producing a multilayer circuit board |
| 02/10/2011 | DE10260663B4 Kühleinheit und Halbleitervorrichtung Cooling unit and semiconductor device |
| 02/10/2011 | DE102010038988A1 Sensoranordnung und Chip mit zusätzlichen Befestigungsbeinen Sensor array and chip with additional mounting legs |
| 02/10/2011 | DE102009036622A1 Opto-electronic semiconductor component, has main housing body surrounding opto-electronic semiconductor chip and made of radiation permeable matrix material, and radiation reflected filling material introduced into body |
| 02/10/2011 | DE102009035437A1 Halbleiterbauelement mit einem Verspannungspuffermaterial, das über einem Metallisierungssystem mit kleinem ε gebildet ist A semiconductor device having a stress buffer material that is formed over a metallization system with small ε |
| 02/10/2011 | DE102009012516B4 Mehrlagensubstrat für hochintegriertes Modul Multi-layer substrate for highly integrated module |
| 02/10/2011 | DE102009002992A1 Leistungshalbleitermodulanordnung mit verdrehsicher auf einem Kühlkörper montierbarem Leistungshalbleitermodul Power semiconductor module assembly with torsion mountable on a heat sink power semiconductor module |
| 02/10/2011 | DE102006046851B4 Verfahren zum Schützen der Kontaktelemente eines Halbleiterwafers A method of protecting the contact elements of a semiconductor wafer |
| 02/10/2011 | DE102006015750B4 Bildsensormodul und Verfahren zu seiner Herstellung Image sensor module and process for its preparation |
| 02/10/2011 | CA2786406A1 Ohmic connection using widened connection zones in a portable electronic object |
| 02/09/2011 | EP2282338A2 Method and structures for indexing dice |
| 02/09/2011 | EP2282337A2 Matrix type display apparatus, method of production thereof, and thermo-compression bonding head |
| 02/09/2011 | EP2282336A2 Base plate with tailored interface |
| 02/09/2011 | EP2282335A1 Cooling device and method |
| 02/09/2011 | EP2282334A1 Substrate for power module, power module, and method for producing substrate for power module |
| 02/09/2011 | EP2282333A1 Integrated circuit and manufacturing method therefor |
| 02/09/2011 | EP2282329A1 Method of electrically connecting a bond wire to a bond pad of an integrated circuit chip and the corresponding electronic device. |
| 02/09/2011 | EP2281305A1 Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 02/09/2011 | EP2280906A1 Mems device with independent rotation in two axes of rotation |
| 02/09/2011 | CN201742675U Radiating fin, radiating fin array and electronic device provided radiating fin array |
| 02/09/2011 | CN201742672U Combined radiator |
| 02/09/2011 | CN201741696U P raceway groove JFET and dipole mixing integrated circuit |
| 02/09/2011 | CN201741692U Lead type bridging rectifying device |
| 02/09/2011 | CN201741690U Light-weight power semi-conductor module |
| 02/09/2011 | CN201741689U Lead frame |
| 02/09/2011 | CN201741688U Lead frame |
| 02/09/2011 | CN201741687U Improved lead frame |
| 02/09/2011 | CN201741686U Improved lead frame |
| 02/09/2011 | CN201741685U Polycell power semiconductor module |
| 02/09/2011 | CN201741684U Triode chip fixing structure |
| 02/09/2011 | CN201741683U Power semiconductor device |
| 02/09/2011 | CN201741682U Heat radiation air-deflecting device |
| 02/09/2011 | CN201741681U Buckle type radiator module |
| 02/09/2011 | CN201741680U Novel flat crimp type multi-chip package ceramic shell |
| 02/09/2011 | CN201741679U Triode |
| 02/09/2011 | CN201739922U High-power LED (light-emitting diode) streetlamp |
| 02/09/2011 | CN1839093B Nanograde and atom grade component and manufacture method |
| 02/09/2011 | CN1757107B Split fin heat sink |
| 02/09/2011 | CN101971718A Method for arranging cooling for a component and a cooling element |
| 02/09/2011 | CN101971486A Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device |
| 02/09/2011 | CN101971353A Optoelectronic component and method for producing an optoelectronic component |
| 02/09/2011 | CN101971350A Thin film transistor and method for producing thin film transistor |
| 02/09/2011 | CN101971349A Method for producing thin film transistor and thin film transistor |
| 02/09/2011 | CN101971333A Semiconductor die package including ic driver and bridge |
| 02/09/2011 | CN101971332A Semiconductor die package including embedded flip chip |
| 02/09/2011 | CN101971331A Structure and method for forming power devices with carbon-containing region |
| 02/09/2011 | CN101971330A Cooling device and electric vehicle using the cooling device |
| 02/09/2011 | CN101971329A Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module |
| 02/09/2011 | CN101971328A Method for manufacturing wafer stack |
| 02/09/2011 | CN101971327A Multilayer dielectric substrate, and semiconductor package |
| 02/09/2011 | CN101971326A Electromagnetic shield formation for integrated circuit die package |
| 02/09/2011 | CN101971322A Method of aftertreatment of amorphous hydrocarbon film and method for manufacturing electronic device by using the aftertreatment method |
| 02/09/2011 | CN101971310A Method of forming a thermo pyrolytic graphite-embedded heatsink |
| 02/09/2011 | CN101971234A Active matrix substrate, display device, and method for manufacturing active matrix substrate |
| 02/09/2011 | CN101970549A Highly thermally conductive resin molded article |
| 02/09/2011 | CN101970526A Epoxy resin composition and molded object |
| 02/09/2011 | CN101969070A Active element array substrate and manufacturing method thereof |
| 02/09/2011 | CN101969063A Pixel array substrate, conducting structure and display panel |
| 02/09/2011 | CN101969060A Active element array substrate, display panel and repairing method |
| 02/09/2011 | CN101969057A Circuit substrate |
| 02/09/2011 | CN101969056A Cast grid array (CGA) package and socket |
| 02/09/2011 | CN101969055A KFC copper alloy lead frame material produced by continuous extrusion rolling method |
| 02/09/2011 | CN101969054A Semiconductor chip and preparation method thereof |
| 02/09/2011 | CN101969053A Semiconductor device and manufacturing method thereof |
| 02/09/2011 | CN101969052A Thin efficient heat radiator |
| 02/09/2011 | CN101969051A Semiconductor packaging part and manufacturing method thereof |
| 02/09/2011 | CN101969043A Active element array substrate and manufacturing method thereof |
| 02/09/2011 | CN101969033A Method of electrically connecting a bond wire to a bond pad of an integrated circuit chip and the corresponding electronic device |
| 02/09/2011 | CN101967266A Halogen-free fire-retarding epoxy resin composition |