| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/15/2011 | US7888852 LED heat dissipation structure |
| 02/15/2011 | US7888809 Semiconductor device and method of manufacturing the same |
| 02/15/2011 | US7888808 System in package integrating a plurality of semiconductor chips |
| 02/15/2011 | US7888806 Electrical connections for multichip modules |
| 02/15/2011 | US7888805 Semiconductor device package of stacked semiconductor chips with spacers provided therein |
| 02/15/2011 | US7888804 Method for forming self-aligned contacts and local interconnects simultaneously |
| 02/15/2011 | US7888803 Printed circuit board |
| 02/15/2011 | US7888802 Bonding pad structure and manufacturing method thereof |
| 02/15/2011 | US7888801 Semiconductor device |
| 02/15/2011 | US7888800 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics |
| 02/15/2011 | US7888799 Semiconductor device, circuit substrate, electro-optic device and electronic appliance |
| 02/15/2011 | US7888798 Semiconductor devices including interlayer conductive contacts and methods of forming the same |
| 02/15/2011 | US7888797 High frequency package device with internal space having a resonant frequency offset from frequency used |
| 02/15/2011 | US7888796 Controller chip mounted on a memory chip with re-wiring lines |
| 02/15/2011 | US7888795 Semiconductor device |
| 02/15/2011 | US7888794 Semiconductor device and method |
| 02/15/2011 | US7888793 Device package and methods for the fabrication and testing thereof |
| 02/15/2011 | US7888792 Method for direct heat sink attachment |
| 02/15/2011 | US7888791 Device for electrical connection of an integrated circuit chip |
| 02/15/2011 | US7888790 Bare die package with displacement constraint |
| 02/15/2011 | US7888789 Transfer material used for producing a wiring substrate |
| 02/15/2011 | US7888788 Semiconductor device with reduced cross talk |
| 02/15/2011 | US7888786 Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device |
| 02/15/2011 | US7888785 Semiconductor package embedded in substrate, system including the same and associated methods |
| 02/15/2011 | US7888784 Substrate package with through holes for high speed I/O flex cable |
| 02/15/2011 | US7888782 Apparatus and method configured to lower thermal stresses |
| 02/15/2011 | US7888781 Micro-layered lead frame semiconductor packages |
| 02/15/2011 | US7888778 Semiconductor device and producing method of the same |
| 02/15/2011 | US7888777 Semiconductor device and method for manufacturing the same |
| 02/15/2011 | US7888776 Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss |
| 02/15/2011 | US7888771 E-fuse with scalable filament link |
| 02/15/2011 | US7888743 Substrate backgate for trigate FET |
| 02/15/2011 | US7888740 Semiconductor device and method of manufacturing the same |
| 02/15/2011 | US7888739 Electrostatic discharge circuit and method of dissipating an electrostatic current |
| 02/15/2011 | US7888708 Examination apparatus for biological sample and chemical sample |
| 02/15/2011 | US7888707 Gated diode nonvolatile memory process |
| 02/15/2011 | US7888697 Lead frame, method of making the same and light receiving/emitting device |
| 02/15/2011 | US7888673 Monitoring semiconductor device and method of manufacturing the same |
| 02/15/2011 | US7888672 Device for detecting stress migration properties |
| 02/15/2011 | US7888606 Multilayer printed circuit board |
| 02/15/2011 | US7888605 Multilayer printed circuit board |
| 02/15/2011 | US7888260 Method of making electronic device |
| 02/15/2011 | US7888254 Semiconductor device having a refractory metal containing film and method for manufacturing the same |
| 02/15/2011 | US7888253 Method of fabricating semiconductor device |
| 02/15/2011 | US7888227 Integrated circuit inductor with integrated vias |
| 02/15/2011 | US7888213 Conductive channel pseudo block process and circuit to inhibit reverse engineering |
| 02/15/2011 | US7888188 Method of fabicating a microelectronic die having a curved surface |
| 02/15/2011 | US7888187 Element mounting substrate and method for manufacturing same |
| 02/15/2011 | US7888184 Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof |
| 02/15/2011 | US7888183 Thinned die integrated circuit package |
| 02/15/2011 | US7888181 Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die |
| 02/15/2011 | US7888177 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 02/15/2011 | US7887716 Barrier sealant of phenylene oxetane and cationic initiator |
| 02/15/2011 | US7886813 Thermal interface material with carbon nanotubes and particles |
| 02/15/2011 | US7886809 Apparatus and method for passive phase change thermal management |
| 02/15/2011 | US7886438 Process for producing multilayer printed wiring board |
| 02/15/2011 | US7886435 High performance chip carrier substrate |
| 02/15/2011 | CA2666081C High temperature, high voltage sic void-less electronic package |
| 02/15/2011 | CA2370878C Chip carrier for a chip module and method of manufacturing the chip module |
| 02/10/2011 | WO2011017676A1 Distributed computing |
| 02/10/2011 | WO2011017202A2 Packaged semiconductor device for high performance memory and logic |
| 02/10/2011 | WO2011017136A1 Nano-tube thermal interface structure |
| 02/10/2011 | WO2011016555A1 Semiconductor device and method for manufacturing same |
| 02/10/2011 | WO2011016356A1 Acrylate composition |
| 02/10/2011 | WO2011016300A1 Member having semiconductor element mounted thereon, and semiconductor device using the member |
| 02/10/2011 | WO2011016242A1 Semiconductor device and method for manufacturing same |
| 02/10/2011 | WO2011016221A1 Heat sink |
| 02/10/2011 | WO2011016217A1 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT |
| 02/10/2011 | WO2011016175A1 Power module |
| 02/10/2011 | WO2011016157A1 Semiconductor device and electronic device |
| 02/10/2011 | WO2011016083A1 Heat sink and method for manufracturing the heat sink |
| 02/10/2011 | WO2011016082A1 Heat sink material and method for manufacturing the heat sink material |
| 02/10/2011 | WO2011015732A1 Ohmic connection using widened connection zones in a portable electronic object |
| 02/10/2011 | WO2011015642A1 Sensor arrangement and chip comprising additional fixing pins |
| 02/10/2011 | WO2010081517A3 Method for verifying an identification circuit |
| 02/10/2011 | WO2010005592A8 Microelectronic interconnect element with decreased conductor spacing |
| 02/10/2011 | US20110033724 Tie-Bar Configuration For Leadframe Type Carrier Strips |
| 02/10/2011 | US20110032029 Configurable embedded processor |
| 02/10/2011 | US20110032025 Programmable semiconductor device |
| 02/10/2011 | US20110031635 Stacked Integrated Circuit Device |
| 02/10/2011 | US20110031634 Semiconductor Device and Method of Forming Cavity in Build-Up Interconnect Structure for Short Signal Path Between Die |
| 02/10/2011 | US20110031633 Air channel interconnects for 3-d integration |
| 02/10/2011 | US20110031632 Die stacking with an annular via having a recessed socket |
| 02/10/2011 | US20110031631 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device |
| 02/10/2011 | US20110031630 Semiconductor device manufacturing method and semiconductor device |
| 02/10/2011 | US20110031629 Edge connect wafer level stacking |
| 02/10/2011 | US20110031628 Semiconductor device module and method of manufacturing semiconductor device module |
| 02/10/2011 | US20110031627 Reducing Crosstalk In The Design Of Module Nets |
| 02/10/2011 | US20110031626 Metal wiring of semiconductor device and forming method thereof |
| 02/10/2011 | US20110031625 Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element |
| 02/10/2011 | US20110031624 MEMS and a Protection Structure Thereof |
| 02/10/2011 | US20110031623 INTERCONNECT STRUCTURE AND METHOD FOR Cu/ULTRA LOW k INTEGRATION |
| 02/10/2011 | US20110031622 Method for fabricating semiconductor device and semiconductor device |
| 02/10/2011 | US20110031621 Wafer level package having a stress relief spacer and manufacturing method thereof |
| 02/10/2011 | US20110031620 Method of thinning a semiconductor substrate |
| 02/10/2011 | US20110031619 System-in-package with fan-out wlcsp |
| 02/10/2011 | US20110031618 Bond Pad Design for Reducing the Effect of Package Stress |
| 02/10/2011 | US20110031617 Semiconductor package substrate structure and manufacturing method thereof |
| 02/10/2011 | US20110031616 Structures and methods for improving solder bump connections in semiconductor devices |
| 02/10/2011 | US20110031615 Semiconductor device |