| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/17/2011 | US20110037157 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
| 02/17/2011 | US20110037156 Variable Feature Interface That Induces A Balanced Stress To Prevent Thin Die Warpage |
| 02/17/2011 | US20110037155 Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage |
| 02/17/2011 | US20110037154 Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier |
| 02/17/2011 | US20110037153 High bond line thickness for semiconductor devices |
| 02/17/2011 | US20110037152 Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof |
| 02/17/2011 | US20110037151 Multiple Substrate Electrical Circuit Device |
| 02/17/2011 | US20110037149 Method of cutting a wafer-like object and semiconductor chip |
| 02/17/2011 | US20110037148 Package-level integrated circuit connection without top metal pads or bonding wire |
| 02/17/2011 | US20110037147 Semiconductor device and method of manufacturing the same |
| 02/17/2011 | US20110037143 Semiconductor Device Using An Aluminum Interconnect To Form Through-Silicon Vias |
| 02/17/2011 | US20110037132 Mems package structure and method for fabricating the same |
| 02/17/2011 | US20110037072 Multilayer wiring, semiconductor device, substrate for display and display device |
| 02/17/2011 | US20110037069 Method and apparatus for visually determining etch depth |
| 02/17/2011 | US20110036627 Method for Contacting a Rigid Printed Circuit Board to a Contact Partner and Arrangement of a Rigid Printed Circuit Board and Contact Partner |
| 02/17/2011 | US20110036626 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 02/17/2011 | US20110036400 Barrier layer |
| 02/17/2011 | US20110035939 Multilayer wiring board and manufacture method thereof |
| 02/17/2011 | DE202010016257U1 LED-Modul mit Gehäuseverbinder LED module with housing connector |
| 02/17/2011 | DE112009000686T5 Halbleiterpackage mit eingebetteter magnetischer Komponente und Verfahren zur Herstellung Semiconductor package with embedded magnetic component and methods for making |
| 02/17/2011 | DE112008002822T5 Dreidimensionale Chipstapel mit einer optischen Verbindung, die zwischen Vorrichtungen und innerhalb einer Vorrichtung vorliegt Three-dimensional chip stack with an optical link exists between the devices within a device, and |
| 02/17/2011 | DE10350770B4 Druckkontakt-Halbleiterbauelement mit Blindsegment The pressure contact type semiconductor device having dummy segment |
| 02/17/2011 | DE102010021428A1 Solar cell, particularly photovoltaic cell, has marking, which serves particularly for identification, where marking is introduced on electrically active side of solar cell directly on surface of semiconductor substrate carrier |
| 02/17/2011 | DE102010017768A1 Verfahren zum Herstellen eines Halbleiter-Bauelements A method of manufacturing a semiconductor device |
| 02/17/2011 | DE102009037259A1 Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul Arrangement with a cooling device and a power semiconductor module |
| 02/17/2011 | DE102009037257A1 Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu Power semiconductor module with circuit carriers and load connection element and manufacturing method therefor |
| 02/17/2011 | DE102009036970A1 Verfahren zur Kapselung einer elektronischen Anordnung A method for encapsulating an electronic arrangement |
| 02/17/2011 | DE102009036968A1 Verfahren zur Kapselung einer elektronischen Anordnung A method for encapsulating an electronic arrangement |
| 02/17/2011 | DE102009036033A1 Interlayer connection for semiconductor wafers, has base wafer with connection pad and cover wafer arranged on base wafer, where cover wafer has continuous opening over connection pad |
| 02/17/2011 | DE102009007612B4 Kühlkörper zur Abfuhr von Wärme von elektronischen Bauteilen und Verfahren zu seiner Herstellung Heat sink for the dissipation of heat from electronic components and process for its preparation |
| 02/17/2011 | DE102008006536B4 Kühlsystem für auf einer Trägerplatine angeordnete Leistungshalbleiter Cooling system arranged on a carrier board power semiconductor |
| 02/17/2011 | DE102004044149B4 Hochleistungs-Leuchtdiodenvorrichtung High performance light emitting diode device |
| 02/17/2011 | DE10065470B4 Verfahren zur Herstellung eines Kühlelements für elektrische, insbesondere elektronische, Bauelemente A process for producing a cooling element for electric, in particular electronic, components |
| 02/16/2011 | EP2285002A2 Antifuse reroute of dies |
| 02/16/2011 | EP2284889A1 High performance semiconductor module with switch holder and load connection element and corresponding production method |
| 02/16/2011 | EP2284888A2 Interposer, module and electronics device including the same |
| 02/16/2011 | EP2284887A2 Module comprising semiconductor devices and module manufacturing method |
| 02/16/2011 | EP2284886A2 Lead frame design to improve reliability |
| 02/16/2011 | EP2284885A1 Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same |
| 02/16/2011 | EP2284884A2 Assembly with a cooling device and a high-performance semi-conductor |
| 02/16/2011 | EP2284883A1 Heat dissipating base body and electronic device using the same |
| 02/16/2011 | EP2284882A1 Multilayer wiring board |
| 02/16/2011 | EP2284881A1 High frequency storing case and high frequency module |
| 02/16/2011 | EP2284875A2 Film forming method, fabrication method of semiconductor device, semiconductor device, and substrate processing system |
| 02/16/2011 | EP2284874A1 Method of producing silylated porous insulating film, method of producing semiconductor device, and silylated material |
| 02/16/2011 | EP2283922A2 Curable composition, cured film and related electronic device |
| 02/16/2011 | EP2283517A1 Integrated circuit manufacturing method and integrated circuit |
| 02/16/2011 | EP2283515A1 Interconnect structure for integrated circuits having improved electromigration characteristics |
| 02/16/2011 | EP2283513A1 Structure and process for conductive contact integration |
| 02/16/2011 | EP2283070A1 A curable composition and use thereof |
| 02/16/2011 | EP1829105B1 Microwave miniature casing and method for producing this casing |
| 02/16/2011 | EP1639641B1 Method of manufacturing a semiconductor device with a leadframe and apparatus therefor |
| 02/16/2011 | EP1317769B1 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 02/16/2011 | CN201749857U Power management module for solar photovoltaic assembly |
| 02/16/2011 | CN201749848U Lead framework for producing rectifier |
| 02/16/2011 | CN201749847U Improved lead frame structure |
| 02/16/2011 | CN201749846U Lead frame for welding diode grain |
| 02/16/2011 | CN201749845U Plastic-packaged surface mount rectifier for circuit boards |
| 02/16/2011 | CN101978800A Component-incorporating wiring board |
| 02/16/2011 | CN101978493A Semiconductor assembly having reduced thermal spreading resistance and methods of making same |
| 02/16/2011 | CN101978492A Method for manufacturing electronic component module |
| 02/16/2011 | CN101978491A Semiconductor chip package assembly method and apparatus for countering leadfinger deformation |
| 02/16/2011 | CN101978490A Electronic component module and method of manufacturing the electronic component module |
| 02/16/2011 | CN101978483A In-situ cavity integrated circuit package |
| 02/16/2011 | CN101978480A Multilayer wiring, semiconductor device, substrate for display and display |
| 02/16/2011 | CN101978171A Piezoelectric fan and cooling device using piezoelectric fan |
| 02/16/2011 | CN101977487A Large-power electronic product cooling device |
| 02/16/2011 | CN101976664A Semiconductor packaging structure and manufacture process thereof |
| 02/16/2011 | CN101976663A Substrate-free chip size package structure of face down chip |
| 02/16/2011 | CN101976662A Output-end fan-out type flip-chip packaging structure without baseplate |
| 02/16/2011 | CN101976661A High-power chip liquid cooling device |
| 02/16/2011 | CN101976660A Silicon-on-insulator (SOI) substrate silicon wafer with heat-radiating structure and preparation method thereof |
| 02/16/2011 | CN101976659A Outer package-free crystal device and manufacturing method thereof |
| 02/16/2011 | CN101976658A Passivation layer and production method thereof |
| 02/16/2011 | CN101976657A Substrate structure for semiconductor device fabrication and method for fabricating the same |
| 02/16/2011 | CN101976652A Semiconductor packaging structure and manufacture process thereof |
| 02/16/2011 | CN101976104A Heat radiating fin group for electronic product |
| 02/16/2011 | CN101974206A Epoxy resin composition |
| 02/16/2011 | CN101728403B Back-illuminated mercury cadmium telluride long-wave light-guide type infrared flat-panel detector |
| 02/16/2011 | CN101593740B Conductive clip for semiconductor device package |
| 02/16/2011 | CN101572257B Chip packaging tape and chip packaging structure containing same |
| 02/16/2011 | CN101569003B Semiconductor device and method for manufacturing the same |
| 02/16/2011 | CN101552254B Multilayer wiring substrate, semiconductor package, and methods of manufacturing semiconductor package |
| 02/16/2011 | CN101521372B Integrated circuit with electrostatic discharge protecting circuit |
| 02/16/2011 | CN101521253B Solid luminous element and light source module |
| 02/16/2011 | CN101515575B Rectification circuit lead frame copper strip and manufacturing method thereof |
| 02/16/2011 | CN101482231B High-power LED tube light |
| 02/16/2011 | CN101356640B Electronic component mounting board and method for manufacturing such board |
| 02/16/2011 | CN101355051B Semiconductor device having a copper metal line and method of forming the same |
| 02/16/2011 | CN101290918B Chip packaging structure |
| 02/16/2011 | CN101226925B Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| 02/16/2011 | CN101217149B A multi-bit programmable non-volatile memory unit, array and the corresponding manufacturing method |
| 02/16/2011 | CN101170072B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/16/2011 | CN101140975B 发光装置 Light-emitting device |
| 02/16/2011 | CN101136380B Semiconductor package structure having multiple heat dissipation paths and method of manufacture |
| 02/16/2011 | CN101115375B Electronic apparatus |
| 02/15/2011 | US7890203 Wiring forming system and wiring forming method for forming wiring on wiring board |
| 02/15/2011 | US7889778 Device for detecting an attack against an integrated circuit chip |
| 02/15/2011 | US7889503 Electronic appliance having an electronic component and a heat-dissipating plate |
| 02/15/2011 | US7889134 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards |