| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/23/2011 | CN101339940B Encapsulation construction and encapsulation method |
| 02/23/2011 | CN101330086B Noise suppression for open bit line DRAM architectures |
| 02/23/2011 | CN101312160B Semiconductor memory device and its manufacture method |
| 02/23/2011 | CN101271856B Etch depth determination and formation of shield gate groove and MOSFET wafer |
| 02/23/2011 | CN101189925B 嵌入式电容结构 Embedded capacitor structure |
| 02/23/2011 | CN101026163B 半导体装置以及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/22/2011 | USRE42158 Semiconductor device and manufacturing method thereof |
| 02/22/2011 | US7894660 Image processing alignment method and method of manufacturing semiconductor device |
| 02/22/2011 | US7894203 Multilayer printed wiring board |
| 02/22/2011 | US7894033 Semiconductor device including a particular dummy terminal |
| 02/22/2011 | US7893550 Semiconductor package comprising alignment members |
| 02/22/2011 | US7893549 Microelectronic lithographic alignment using high contrast alignment mark |
| 02/22/2011 | US7893548 SiP substrate |
| 02/22/2011 | US7893547 Semiconductor package with a support structure and fabrication method thereof |
| 02/22/2011 | US7893546 Ball grid array package enhanced with a thermal and electrical connector |
| 02/22/2011 | US7893545 Semiconductor device |
| 02/22/2011 | US7893544 Semiconductor device having improved contacts |
| 02/22/2011 | US7893543 Semiconductor module |
| 02/22/2011 | US7893542 Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board |
| 02/22/2011 | US7893541 Optically initiated silicon carbide high voltage switch |
| 02/22/2011 | US7893540 Semiconductor memory device and manufacturing method thereof |
| 02/22/2011 | US7893539 Semiconductor apparatus and mobile apparatus |
| 02/22/2011 | US7893538 Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device |
| 02/22/2011 | US7893537 Semiconductor device |
| 02/22/2011 | US7893536 Semiconductor device |
| 02/22/2011 | US7893535 Semiconductor device and method for fabricating the same |
| 02/22/2011 | US7893534 Thermally insulating bonding pad structure for solder reflow connection |
| 02/22/2011 | US7893533 Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component |
| 02/22/2011 | US7893532 External contact material for external contacts of a semiconductor device and method of making the same |
| 02/22/2011 | US7893531 Integrated-circuit package for proximity communication |
| 02/22/2011 | US7893530 Circuit substrate and the semiconductor package having the same |
| 02/22/2011 | US7893529 Thermoelectric 3D cooling |
| 02/22/2011 | US7893528 Package structure of compound semiconductor device and fabricating method thereof |
| 02/22/2011 | US7893527 Semiconductor plastic package and fabricating method thereof |
| 02/22/2011 | US7893526 Semiconductor package apparatus |
| 02/22/2011 | US7893524 Wiring substrate and semiconductor device and method of manufacturing the same |
| 02/22/2011 | US7893523 Microarray package with plated contact pedestals |
| 02/22/2011 | US7893522 Structural body and manufacturing method thereof |
| 02/22/2011 | US7893518 Method for generating a layout, use of a transistor layout, and semiconductor circuit |
| 02/22/2011 | US7893514 Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package |
| 02/22/2011 | US7893498 Semiconductor device |
| 02/22/2011 | US7893497 Semiconductor device |
| 02/22/2011 | US7893478 Semiconductor storage device and driving method thereof |
| 02/22/2011 | US7893465 Semiconductor device and method of manufacturing same |
| 02/22/2011 | US7893455 Semiconductor light emitting device with stress absorber, LED printhead, and image forming apparatus |
| 02/22/2011 | US7893439 Silicon nitride film and semiconductor device |
| 02/22/2011 | US7893432 Thermal interface |
| 02/22/2011 | US7893365 Weather resistant variable enclosure frame |
| 02/22/2011 | US7893360 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 02/22/2011 | US7892976 Semiconductor device and method for manufacturing the same |
| 02/22/2011 | US7892965 Post passivation interconnection schemes on top of IC chip |
| 02/22/2011 | US7892963 Integrated circuit packaging system and method of manufacture thereof |
| 02/22/2011 | US7892962 Nail-shaped pillar for wafer-level chip-scale packaging |
| 02/22/2011 | US7892940 Device and methodology for reducing effective dielectric constant in semiconductor devices |
| 02/22/2011 | US7892897 TFT-LCD pixel unit and method for manufacturing the same |
| 02/22/2011 | US7892895 Diode junction poly fuse |
| 02/22/2011 | US7892893 Semiconductor device and manufacturing method thereof |
| 02/22/2011 | US7892890 Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof |
| 02/22/2011 | US7892884 High performance multi-chip flip chip package |
| 02/22/2011 | US7892635 Closed cell polymeric foam material and heat decomposible porogen; providing larger processing window; integrated circuit devices and packaging; heat resistance, noncracking; photolithographic stable |
| 02/22/2011 | US7891864 Method, device and system for controlling heating circuits |
| 02/22/2011 | CA2498133C A scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 02/17/2011 | WO2011020038A2 Variable feature interface that allows a balanced stress to prevent thin die warpage |
| 02/17/2011 | WO2011019805A2 Heatsink having one or more ozone catalyzing fins |
| 02/17/2011 | WO2011019719A1 Fully-cured thermally or electrically-conductive form-in-place gap filler |
| 02/17/2011 | WO2011019562A2 Fin anti-fuse with reduced programming voltage |
| 02/17/2011 | WO2011019080A1 Circuit board and method for producing same |
| 02/17/2011 | WO2011019005A1 Heat-resistant polysiloxane composition |
| 02/17/2011 | WO2011018938A1 Multilayer printed circuit board |
| 02/17/2011 | WO2011018882A1 Semiconductor module and cooling unit |
| 02/17/2011 | WO2011018861A1 Solder precoat film forming method and device therefor |
| 02/17/2011 | WO2011018374A1 Oxygen scavengers |
| 02/17/2011 | WO2011017994A1 High frequency fast recovery diode |
| 02/17/2011 | WO2010144848A3 Stress balance layer on semiconductor wafer backside |
| 02/17/2011 | US20110040527 Process condition sensing wafer and data analysis system |
| 02/17/2011 | US20110037490 Dielectric Film and Layer Testing |
| 02/17/2011 | US20110037181 Underfill method and chip package |
| 02/17/2011 | US20110037180 Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same |
| 02/17/2011 | US20110037179 Semiconductor package |
| 02/17/2011 | US20110037178 Integrated circuit |
| 02/17/2011 | US20110037177 Device under bonding pad using single metallization |
| 02/17/2011 | US20110037176 Method of manufacturing a semiconductor device module, semiconductor device connecting device, semiconductor device module manufacturing device, semiconductor device module |
| 02/17/2011 | US20110037175 Interconnection between sublithographic-pitched structures and lithographic-pitched structures |
| 02/17/2011 | US20110037174 Method of manufacturing semiconductor component, and semiconductor component |
| 02/17/2011 | US20110037173 Semiconductor device |
| 02/17/2011 | US20110037172 Ultra Thin Bumped Wafer With Under-Film |
| 02/17/2011 | US20110037171 Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods |
| 02/17/2011 | US20110037170 Electronic device and manufacturing method therefor |
| 02/17/2011 | US20110037169 Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structures |
| 02/17/2011 | US20110037168 Semiconductor Device and Method of Providing a Thermal Dissipation Path Through RDL and Conductive Via |
| 02/17/2011 | US20110037167 Method and package for circuit chip packaging |
| 02/17/2011 | US20110037166 Semiconductor device and semiconductor device manufacturing method |
| 02/17/2011 | US20110037165 Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die |
| 02/17/2011 | US20110037164 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module |
| 02/17/2011 | US20110037163 Device including a ring-shaped metal structure and method |
| 02/17/2011 | US20110037162 Hermetic packaging and method of forming the same |
| 02/17/2011 | US20110037161 Electrostatic chucking of an insulator handle substrate |
| 02/17/2011 | US20110037160 Microelectronic device and fabricating method thereof and mems package structure and fabricating method thereof |
| 02/17/2011 | US20110037159 Electrically Interconnected Stacked Die Assemblies |
| 02/17/2011 | US20110037158 Ball-grid-array package, electronic system and method of manufacture |