| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/24/2011 | DE202010016764U1 Vorrichtung und Anordnung zum Kühlen eines Prozessors The apparatus and arrangement for cooling a processor |
| 02/24/2011 | DE202010012950U1 Befestigungsmechanismus zum Befestigen eines Thermomoduls an einer Basis und dazugehörige elektronische Vorrichtung Fixing mechanism for fixing a thermal module to a base and associated electronic device |
| 02/24/2011 | DE102010039148A1 Elektronische Vorrichtung und Verfahren zu deren Fertigung An electronic device and method for its manufacturing |
| 02/24/2011 | DE102010038933A1 Halbleitervorrichtung mit Halbleiterchip und Metallplatte und Verfahren zu deren Fertigung A semiconductor device having semiconductor chip and metal plate, and methods for their production |
| 02/24/2011 | DE102010038910A1 Halbleitervorrichtung mit Durchgangselektrode und Herstellungsverfahren A semiconductor device having through-electrode and production method |
| 02/24/2011 | DE102010036915A1 Eingebettetes lamininiertes Bauelement Embedded lamininiertes component |
| 02/24/2011 | DE102010036812A1 Mehrchipmodul und Verfahren zu seiner Herstellung A multi-chip module and method for its preparation |
| 02/24/2011 | DE102010036678A1 Multichip-Modul und Verfahren zu seiner Herstellung Multi-chip module and method for its preparation |
| 02/24/2011 | DE102010036402A1 Lufthohlraum-Baustein mit Kupferkühlkörper und keramischem Fensterrahmen Air cavity block with copper heat sink and ceramic window frame |
| 02/24/2011 | DE102010025506A1 Halbleitervorrichtung Semiconductor device |
| 02/24/2011 | DE102009054535A1 Light emitting diode is provided with housing, where light emitting diode chip is provided with electrostatic discharge protection diode |
| 02/24/2011 | DE102009037914A1 Cooling body for use in electronic industry for discharging surplus heat from CPU, has set of ribs comprising holes that engage into pins of another set of ribs for permitting heat transfer from latter set of ribs to former set of ribs |
| 02/24/2011 | DE102009032219A1 Verfahren zum Herstellen einer integrierten Schaltung und resultierender Folienchip A method of fabricating an integrated circuit chip and resulting film |
| 02/24/2011 | DE102009028814A1 Leistungshalbleitermodul und Verfahren zur Montage eines Leistungshalbleitermoduls The power semiconductor module and method for assembling a power semiconductor module |
| 02/24/2011 | DE102009027677A1 Tastkopf und Verfahren zu seiner Verwendung Probe and method of use |
| 02/24/2011 | DE102009023251B4 Verfahren zur Herstellung eines Kontaktelements mit großem Aspektverhältnis und mit einer günstigeren Form in einem Halbleiterbauelement zur Verbesserung der Abscheidung einer Beschichtung A process for producing a contact element with a high aspect ratio and with a more favorable form in a semiconductor device for improving the deposition of a coating |
| 02/24/2011 | DE102009003936B4 Licht emittierendes Bauelement mit einer Konverterkeramik und einer Kühleinrichtung The light emitting device having a ceramic converter and a cooling device |
| 02/24/2011 | DE102008005932B4 Halbleiter-ESD-Bauelement und Verfahren zum Betreiben desselben Of the same semiconductor ESD device and method of operating |
| 02/24/2011 | DE102004004539B4 Waferverbindung unter Verwendung von Reaktivfolien zum Häusen mikro-elektromechhanischer Systeme Wafer bonding using reactive foils for housing micro-elektromechhanischer systems |
| 02/24/2011 | CA2676495A1 Mechanical barrier element for improved thermal reliability of electronic components |
| 02/23/2011 | EP2288244A1 Wiring circuit substrate |
| 02/23/2011 | EP2287916A2 Method of contacting and housing integrated circuits |
| 02/23/2011 | EP2287907A2 Semiconductor integrated circuit |
| 02/23/2011 | EP2287906A2 Semiconductor integrated circuit |
| 02/23/2011 | EP2287905A2 High frequency circuit having multi-chip module structure |
| 02/23/2011 | EP2287904A1 Method for assembling two electronic components |
| 02/23/2011 | EP2287903A2 Suspended lead frame electronic package |
| 02/23/2011 | EP2287899A1 Solder connection with a multilayered solderable layer |
| 02/23/2011 | EP2287898A2 Shrink Package on Board |
| 02/23/2011 | EP2287897A2 Circuit member for semiconductor device, semiconductor device using the same, and process for producing said circuit member and said semiconductor device |
| 02/23/2011 | EP2287891A2 High performance system-on-chip using post passivation process |
| 02/23/2011 | EP2287890A2 High performance system-on-chip using post passivation process |
| 02/23/2011 | EP2287889A2 High performance system-on-chip using post passivation process |
| 02/23/2011 | EP2287586A2 Integrated sensor-chip unit |
| 02/23/2011 | EP2286929A1 Methods of nanotube films and articles |
| 02/23/2011 | EP2286644A1 Method for integrating at least one electronic component into a printed circuit board, and printed circuit board |
| 02/23/2011 | EP2286452A1 3-d integrated circuit lateral heat dissipation |
| 02/23/2011 | EP2286451A2 Foil based semiconductor package |
| 02/23/2011 | EP2286449A1 Thermo-mechanical stress in semiconductor wafers |
| 02/23/2011 | EP2286446A1 Electronic device and method of manufacturing an electronic device |
| 02/23/2011 | EP2286445A1 Method for manufacturing an electronic device |
| 02/23/2011 | EP2286444A2 Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor |
| 02/23/2011 | EP2286409A1 Proximity optical memory module |
| 02/23/2011 | EP1878809B1 ELEMENT STRUCTURE USING A Al-Ni-B ALLOY WIRING MATERIAL |
| 02/23/2011 | EP1368858B1 Module and electronic device |
| 02/23/2011 | CN201752013U Packaging structure capable of directly placing multi-ring pin by chip and passive device |
| 02/23/2011 | CN201752012U Base island exposed and embedded type base island multi-turn pin encapsulation structure |
| 02/23/2011 | CN201752011U Foundation island-free and multi-ring pin packaging structure |
| 02/23/2011 | CN201752010U Base-island-free electrostatic discharge ring packaging structure |
| 02/23/2011 | CN201752009U Lead frame structure of static discharge coil with multiple circles of pins but without base island |
| 02/23/2011 | CN201752008U Paddle-free lead frame structure with static discharge ring |
| 02/23/2011 | CN201752007U Lead frame structure with base island and multiple circles of pins |
| 02/23/2011 | CN201752006U Encapsulation structure with base island and multiple circles of pins |
| 02/23/2011 | CN201752005U Direct chip arrangement multi-ring pin mode lead frame structure |
| 02/23/2011 | CN201752004U Packaging structure for arranging chip directly |
| 02/23/2011 | CN201752003U Lead frame structure for flip chip |
| 02/23/2011 | CN201752002U Thin type bridge rectifier |
| 02/23/2011 | CN201752001U Rectifier diode |
| 02/23/2011 | CN201752000U Overlay packaged diode |
| 02/23/2011 | CN201751999U Packaging structure for inversely mounting chips and attaching passive elements on carrier plate chip |
| 02/23/2011 | CN201751998U Packaging structure with flip chip on carrier chip |
| 02/23/2011 | CN201751997U Encapsulation structure provided with embedded inner feet, invertedly-installed chip, radiation block with lock hole, and radiation panel |
| 02/23/2011 | CN201751996U Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole |
| 02/23/2011 | CN201751995U Packaging structure of flipped chip heat radiation block externally connected with radiator for printed circuit board |
| 02/23/2011 | CN201751994U Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip |
| 02/23/2011 | CN201751993U Externally connected radiator encapsulation structure of inner pin embedded chip inversion locking hole heat dissipation block convex column |
| 02/23/2011 | CN201751992U Encapsulation structure with inversely-mounted printed circuit board and chip, as well as rectangular heat dissipation block and external connected radiator |
| 02/23/2011 | CN201751991U Encapsulation structure provided with embedded inner feet, invertedly-installed chip, radiation block and external radiation cap |
| 02/23/2011 | CN201751990U Packaging structure for printed circuit board chip provided with external radiation cap, convex column, and radiating block with locking hole |
| 02/23/2011 | CN201751989U Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block |
| 02/23/2011 | CN201751988U Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip |
| 02/23/2011 | CN201751987U Resin circuit board inverted-T lockhole heat dissipation block external radiator capsulation structure with inverted chip |
| 02/23/2011 | CN201751986U Resin circuit board chip normally-assembled heat slug external radiator packaging structure |
| 02/23/2011 | CN201751985U Encapsulation structure provided with embedded inner feet, invertedly-installed chip, radiation block with lock hole, and external radiation cap |
| 02/23/2011 | CN201751984U Resin circuit board chip flipped lockhole heat slug convex-column external radiating cap packaging structure |
| 02/23/2011 | CN201751983U Resin circuit board chip inverted lock hole rectangular heat-radiating block external radiator encapsulation structure |
| 02/23/2011 | CN201751982U Encapsulation structure provided with embedded inner feet, invertedly-installed chip, rectangular radiation block with lock hole, and external radiator |
| 02/23/2011 | CN201751981U Inner lead-embedded flipped chip inverted T-shaped lockhole heat slug external radiator packaging structure |
| 02/23/2011 | CN201751980U Encapsulation structure provided with exposed inner feet, invertedly-installed chip, radiation block and external radiator |
| 02/23/2011 | CN1905180B 半导体器件 Semiconductor devices |
| 02/23/2011 | CN1862805B Ground shield and related method |
| 02/23/2011 | CN1822362B Device and method for preventing an integrated circuit from malfunctioning due to a surge voltage |
| 02/23/2011 | CN1783473B Insulating substrate and semiconductor device |
| 02/23/2011 | CN101981692A Insulating substrate and method for producing the same |
| 02/23/2011 | CN101981691A Package on package using a bump-less build up layer (bbul) package |
| 02/23/2011 | CN101981686A Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device |
| 02/23/2011 | CN101981680A Flip chip assembly process for ultra thin substrate and package on package assembly |
| 02/23/2011 | CN101981214A Copper alloy material for electric and electronic apparatuses, and electric and electronic components |
| 02/23/2011 | CN101981213A Copper alloy material for electric and electronic apparatuses, and electric and electronic components |
| 02/23/2011 | CN101981096A Sealing resin sheet |
| 02/23/2011 | CN101980862A Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |
| 02/23/2011 | CN101980861A Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
| 02/23/2011 | CN101980361A Ic having wafer paste sheet adhesive tape and encapsulation method tehreof |
| 02/23/2011 | CN101980360A 半导体结构及其制作方法 The semiconductor structure and method of making |
| 02/23/2011 | CN101980359A Semiconductor package and manufacturing method thereof |
| 02/23/2011 | CN101980357A Semiconductor device and mold for resin-molding semiconductor device |
| 02/23/2011 | CN101553914B Method of manufacturing openings in a substrate, a via in a substrate, and a semiconductor device comprising such a via |
| 02/23/2011 | CN101552225B Manufacturing method of contact portion and thin film transistor array panel |
| 02/23/2011 | CN101490839B Integrated circuit, transponder, method of producing an integrated circuit and method of producing a transponder |
| 02/23/2011 | CN101483183B Image sensor and method for manufacturing the same |