| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/01/2011 | US7898074 Electronic devices including flexible electrical circuits and related methods |
| 03/01/2011 | US7898073 Semiconductor device and semiconductor module employing thereof |
| 03/01/2011 | US7898072 Package stacking system with mold contamination prevention |
| 03/01/2011 | US7898071 Apparatus and method for housing micromechanical systems |
| 03/01/2011 | US7898070 Image sensor package and fabrication method thereof |
| 03/01/2011 | US7898069 Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate |
| 03/01/2011 | US7898068 Integrated circuit micro-module |
| 03/01/2011 | US7898067 Pre-molded, clip-bonded multi-die semiconductor package |
| 03/01/2011 | US7898066 Semiconductor device having EMI shielding and method therefor |
| 03/01/2011 | US7898065 Structure and method for device-specific fill for improved anneal uniformity |
| 03/01/2011 | US7898063 Through substrate annular via including plug filler |
| 03/01/2011 | US7898058 Integrated chip package structure using organic substrate and method of manufacturing the same |
| 03/01/2011 | US7898057 Radio frequency power semiconductor device package comprising dielectric platform and shielding plate |
| 03/01/2011 | US7898056 Seal ring for reducing noise coupling within a system-on-a-chip (SoC) |
| 03/01/2011 | US7898035 Semiconductor device |
| 03/01/2011 | US7898034 Semiconductor chips having improved electrostatic discharge protection circuit arrangement |
| 03/01/2011 | US7898007 Semiconductor devices including line patterns separated by cutting regions |
| 03/01/2011 | US7897973 Display device and manufacturing method thereof |
| 03/01/2011 | US7897972 Electronic circuit |
| 03/01/2011 | US7897970 Lower substrate, display apparatus having the same and method of manufacturing the same |
| 03/01/2011 | US7897967 Anti-fuse device |
| 03/01/2011 | US7897965 Display substrate, display panel having the same, and method of testing a display substrate |
| 03/01/2011 | US7897437 Thermal interconnect systems methods of production and uses thereof |
| 03/01/2011 | US7897435 Re-assembly process for MEMS structures |
| 03/01/2011 | US7897433 Semiconductor chip with reinforcement layer and method of making the same |
| 03/01/2011 | US7897431 Stacked semiconductor device and method |
| 03/01/2011 | US7897066 Conductor paste for ceramic substrate and electric circuit |
| 02/24/2011 | WO2011022492A1 Adding symmetrical filling material in an integrated circuit layout |
| 02/24/2011 | WO2011021690A1 Semiconductor device having power supply-side metal reinforcing member and ground-side metal reinforcing member insulated from each other |
| 02/24/2011 | WO2011021506A1 Silicon structure having bonding pad |
| 02/24/2011 | WO2011021425A1 Array substrate, method for manufacturing array substrate, and display device |
| 02/24/2011 | WO2011021411A1 Esd protection device |
| 02/24/2011 | WO2011021384A1 Electronic device cooling structure |
| 02/24/2011 | WO2011021364A1 Semiconductor device and manufacturing method therefor |
| 02/24/2011 | WO2011021342A1 Semiconductor device |
| 02/24/2011 | WO2011021328A1 Semiconductor device having shield layer and element-side power supply terminal capacitively coupled therein |
| 02/24/2011 | WO2011021317A1 Semiconductor device and semiconductor apparatus using same |
| 02/24/2011 | WO2011021245A1 Copper alloy and lead frame material for electronic equipment |
| 02/24/2011 | WO2011021244A1 Semiconductor device manufacturing method |
| 02/24/2011 | WO2011020752A1 Top actuated, force limiting heatsink retention system |
| 02/24/2011 | WO2011020341A1 Electronic module and packaging method thereof |
| 02/24/2011 | WO2010138326A3 Esd protection structure |
| 02/24/2011 | WO2010137899A3 Leadframe and method for manufacturing the same |
| 02/24/2011 | WO2010136974A3 Semiconductor chip and method of manufacturing a semiconductor chip |
| 02/24/2011 | WO2010136898A4 Cooling device |
| 02/24/2011 | WO2010129423A3 Esd protection utilizing radiated thermal relief |
| 02/24/2011 | US20110045759 Rack enclosure |
| 02/24/2011 | US20110044369 Silicon carrier optoelectronic packaging |
| 02/24/2011 | US20110044084 Multi-chip memory device with stacked memory chips, method of stacking memory chips, and method of controlling operation of multi-chip package memory |
| 02/24/2011 | US20110044009 Semiconductor device |
| 02/24/2011 | US20110044007 Heat sink, semiconductor device, and method of manufacturing heat sink |
| 02/24/2011 | US20110042832 Extendable connector and network |
| 02/24/2011 | US20110042831 Layered Chip For Use In Soldering |
| 02/24/2011 | US20110042830 Chip card, and method for the production thereof |
| 02/24/2011 | US20110042829 IC Interconnect |
| 02/24/2011 | US20110042828 Wiring board, semiconductor device and method for manufacturing semiconductor device |
| 02/24/2011 | US20110042827 Bonding structures and methods of forming bonding structures |
| 02/24/2011 | US20110042826 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
| 02/24/2011 | US20110042824 Multi-chip module and method of manufacturing the same |
| 02/24/2011 | US20110042823 Interposer chip and manufacturing method thereof |
| 02/24/2011 | US20110042822 Semiconductor device and method for manufacturing the same |
| 02/24/2011 | US20110042821 Vias and conductive routing layers in semiconductor substrates |
| 02/24/2011 | US20110042820 3d silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport |
| 02/24/2011 | US20110042819 Chip package and method for forming the same |
| 02/24/2011 | US20110042818 Adding Symmetrical Filling Material In An Integrated Circuit Layout |
| 02/24/2011 | US20110042817 Solder joint structure, and joining method of the same |
| 02/24/2011 | US20110042815 Semiconductor device and on-vehicle ac generator |
| 02/24/2011 | US20110042814 Semiconductor device and method for production of semiconductor device |
| 02/24/2011 | US20110042813 Printed electronics |
| 02/24/2011 | US20110042812 Electronic device and method of manufacturing the same |
| 02/24/2011 | US20110042811 Semiconductor device and method of manufacturing the same |
| 02/24/2011 | US20110042810 Stacked packaging improvements |
| 02/24/2011 | US20110042809 Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers |
| 02/24/2011 | US20110042808 Semiconductor device and method for manufacturing same |
| 02/24/2011 | US20110042807 Chip package and fabrication method thereof |
| 02/24/2011 | US20110042806 Multi-chip module and method of manufacturing the same |
| 02/24/2011 | US20110042805 Package structures for integrating thermoelectric components with stacking chips |
| 02/24/2011 | US20110042804 Chip package and fabrication method thereof |
| 02/24/2011 | US20110042803 Method For Fabricating A Through Interconnect On A Semiconductor Substrate |
| 02/24/2011 | US20110042802 Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal |
| 02/24/2011 | US20110042801 Mems packaging scheme using dielectric fence |
| 02/24/2011 | US20110042800 Package structure |
| 02/24/2011 | US20110042799 Die package and method of manufacturing the same |
| 02/24/2011 | US20110042798 Semiconductor Device and Method of Stacking Die on Leadframe Electrically Connected by Conductive Pillars |
| 02/24/2011 | US20110042797 Semiconductor package and method of manufacturing the same |
| 02/24/2011 | US20110042796 Chip package and fabrication method thereof |
| 02/24/2011 | US20110042795 Three-Dimensional Silicon Interposer for Low Voltage Low Power Systems |
| 02/24/2011 | US20110042794 Qfn semiconductor package and circuit board structure adapted for the same |
| 02/24/2011 | US20110042793 Lead frame assembly for a semiconductor package |
| 02/24/2011 | US20110042792 Flexible contactless wire bonding structure and methodology for semiconductor device |
| 02/24/2011 | US20110042789 Material for chemical vapor deposition, silicon-containing insulating film and method for production of the silicon-containing insulating film |
| 02/24/2011 | US20110042784 Mechanical Barrier Element for Improved Thermal Reliability of Electronic Components |
| 02/24/2011 | US20110042781 Chip package and fabrication method thereof |
| 02/24/2011 | US20110042779 Fuse link structures using film stress for programming and methods of manufacture |
| 02/24/2011 | US20110042761 Eutectic flow containment in a semiconductor fabrication process |
| 02/24/2011 | US20110042741 Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same |
| 02/24/2011 | US20110042733 Semiconductor device and method of forming the same |
| 02/24/2011 | US20110042671 Semiconductor Device Test Structures and Methods |
| 02/24/2011 | US20110042137 Suspended lead frame electronic package |
| 02/24/2011 | US20110042046 Integrated coolant circuit arrangement, operating method and production method |