| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/03/2011 | US20110049577 System comprising a semiconductor device and structure |
| 03/03/2011 | US20110049552 Light emitting diode package |
| 03/03/2011 | US20110049531 Power semiconductor device and manufacturing method for the same |
| 03/03/2011 | US20110049525 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device |
| 03/03/2011 | US20110049516 Multi-project wafer and method of making same |
| 03/03/2011 | US20110049515 Chip structure with bumps and testing pads |
| 03/03/2011 | US20110049514 Tcp type semiconductor device |
| 03/03/2011 | US20110049513 Semiconductor device having multilayer wiring structure and method of fabricating the same |
| 03/03/2011 | US20110049505 Devices and method for manufacturing a device |
| 03/03/2011 | US20110048797 Surface mounted electronic component |
| 03/03/2011 | US20110048796 Connector, Package Using the Same and Electronic Device |
| 03/03/2011 | US20110048679 Heat dissipation device |
| 03/03/2011 | US20110048527 Silver thick film paste compositions and their use in conductors for photovoltaic cells |
| 03/03/2011 | DE202010015506U1 Wärmeaustauscher Heat exchanger |
| 03/03/2011 | DE202010015503U1 Verschlußstruktur eines plattenförmigen Wärmerohrs Closure structure of a plate-shaped heat pipe |
| 03/03/2011 | DE112009001079T5 Hermetisch abdichtende Kappe Hermetically sealing cap |
| 03/03/2011 | DE102010038826A1 Leistungshalbleitervorrichtung und Verfahren zum Herstellen derselben Power semiconductor device and method of manufacturing the same |
| 03/03/2011 | DE102010036978A1 Bauelement mit einer ringförmigen Metallstruktur und Verfahren Component with an annular metal structure and procedures |
| 03/03/2011 | DE102010033789A1 Multichipmodul und Verfahren zum Herstellen desselben Of the same multi-chip module and method of producing |
| 03/03/2011 | DE102009045068A1 Semiconductor arrangement has semiconductor device supported on carrier with connecting surface, where contact area is arranged on carrier |
| 03/03/2011 | DE102009039421A1 Doppelkontaktmetallisierung mit stromloser Plattierung in einem Halbleiterbauelement Doppelkontaktmetallisierung with electroless plating in a semiconductor device |
| 03/03/2011 | DE102009037691A1 Dielektrische Schutzschicht für eine selbstorganisierende Monolage (SAM) Dielectric protective layer for a self-assembled monolayer (SAM) |
| 03/03/2011 | DE102009029054A1 New nanoscale silicon particles that are functionalized by covalently bonded organic groups, useful to produce or in electronic components e.g. a solar cell, sensor, thin film transistor and conducting path, and for producing dispersion |
| 03/03/2011 | DE102009029040A1 Vorrichtung und Verfahren zur Herstellung einer Vorrichtung Apparatus and method for manufacturing a device |
| 03/03/2011 | DE102009028966A1 Drucksensor Pressure sensor |
| 03/03/2011 | DE102009028961A1 Thin chip comprises connection pads formed in the chip topside for electrical contacting, and electrically conductive coating that extends itself from the connection pad up to chip side surface and functions as electrical connecting line |
| 03/03/2011 | DE102006046425B4 Verfahren zur Bildung einer Justiermarke eines Halbleiterbauelements A method of forming an alignment mark of a semiconductor device |
| 03/02/2011 | EP2291067A1 Electric power converter for railway traction vehicle |
| 03/02/2011 | EP2291066A1 Heat radiation sheet and heat radiation device |
| 03/02/2011 | EP2290688A2 Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents |
| 03/02/2011 | EP2290687A1 Designing packaged integrated circuits for reducing impedance discontinuities |
| 03/02/2011 | EP2290686A2 Method to perform electrical testing and assembly of electronic devices |
| 03/02/2011 | EP2290685A1 Package substrate |
| 03/02/2011 | EP2290684A1 Method to provide a protective layer on an integrated circuit and integrated circuit fabricated according to said method |
| 03/02/2011 | EP2290683A1 Wiring of an electronic module |
| 03/02/2011 | EP2290682A2 Package with a chip embedded between two substrates and method of manufacturing the same |
| 03/02/2011 | EP2290681A2 Power conversion device |
| 03/02/2011 | EP2290680A1 Power semiconductor module |
| 03/02/2011 | EP2290676A1 Method for joining substrate and object to be mounted using solder paste |
| 03/02/2011 | EP2290590A2 Portable data carrier |
| 03/02/2011 | EP2289861A1 Carbon fiber carbon composite molded body, carbon fiber-reinforced carbon composite material and manufacturing method thereof |
| 03/02/2011 | EP2289844A2 Thermally enhanced microcircuit package and method of forming same |
| 03/02/2011 | EP2289700A1 Liquid discharge head and method for manufacturing the same |
| 03/02/2011 | EP2289100A2 Method for the manufacture of an electronic assembly |
| 03/02/2011 | EP2289099A1 Electromigration-compliant high performance fet layout |
| 03/02/2011 | EP2289098A1 Liquid cooler and method of its manufacture |
| 03/02/2011 | EP1883962B1 Ubm pad, solder contact and method for production of a solder connection |
| 03/02/2011 | EP1468447B1 Adaptive threshold voltage control with positive body bias for n and p-channel transistors |
| 03/02/2011 | EP1018160B1 Method of fabricating a hydrogenated oxidized silicon carbon film |
| 03/02/2011 | CN201754404U Surface-mounted type surface-contact glass packaging rectifier tube |
| 03/02/2011 | CN201754403U 散热器 Heat sink |
| 03/02/2011 | CN201754402U Normal printed circuit board chip packaging structure with rectangular heat sink having locking hole |
| 03/02/2011 | CN1584720B Thin film transistor array panels manufacture method |
| 03/02/2011 | CN101983429A Electronic component used for wiring and method for manufacturing the same |
| 03/02/2011 | CN101983427A Inductor with patterned ground plane |
| 03/02/2011 | CN101983426A Movable electrical conductor |
| 03/02/2011 | CN101983425A Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board |
| 03/02/2011 | CN101983424A Semiconductor package and method for manufacturing the same |
| 03/02/2011 | CN101983223A Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film |
| 03/02/2011 | CN101982880A Registration measurement pattern |
| 03/02/2011 | CN101982879A Low dielectric constant medium and copper interconnection structure and integration method thereof |
| 03/02/2011 | CN101982878A Embedded type assembly substrate and manufacturing method thereof |
| 03/02/2011 | CN101982877A Semiconductor device |
| 03/02/2011 | CN101982876A Semiconductor packaging part and manufacturing method thereof |
| 03/02/2011 | CN101982875A Packaging structure of N substrate diode half bridges with common anodes in TO-220 |
| 03/02/2011 | CN101566301B Vehicle lamp |
| 03/02/2011 | CN101529583B Lid for functional part and process for producing the same |
| 03/02/2011 | CN101471379B Semiconductor device and process for manufacturing same |
| 03/02/2011 | CN101382994B Touching and sliding type packaging structure for thin type finger print identifier |
| 03/02/2011 | CN101355081B 半导体器件 Semiconductor devices |
| 03/02/2011 | CN101350381B Salient point LED and manufacturing method thereof |
| 03/02/2011 | CN101336066B Heat radiator |
| 03/02/2011 | CN101335269B Transistor of semiconductor device and method for fabricating the same |
| 03/02/2011 | CN101334686B Redundancy cooling system and its operation method |
| 03/02/2011 | CN101217136B Wiring structure and method for manufacturing the same |
| 03/02/2011 | CN101207116B Semiconductor package on package having plug-socket type wire connection between packages |
| 03/02/2011 | CN101123262B Display substrate, method of fabricating the same, and liquid crystal display device having the same |
| 03/01/2011 | US7899333 Communication semiconductor component |
| 03/01/2011 | US7898724 Thermal conduction by encapsulation |
| 03/01/2011 | US7898572 Methods and apparatuses for identifying opportunities to capture content |
| 03/01/2011 | US7898275 Known good die using existing process infrastructure |
| 03/01/2011 | US7898269 Semiconductor device and method for measuring analog channel resistance thereof |
| 03/01/2011 | US7898095 Fiducial scheme adapted for stacked integrated circuits |
| 03/01/2011 | US7898094 Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith |
| 03/01/2011 | US7898093 Exposed die overmolded flip chip package and fabrication method |
| 03/01/2011 | US7898091 Multi-host interface controller with USB PHY/analog functions integrated in a single package |
| 03/01/2011 | US7898090 General purpose ball grid array security cap |
| 03/01/2011 | US7898088 I/O pad structures for integrated circuit devices |
| 03/01/2011 | US7898087 Integrated chip carrier with compliant interconnects |
| 03/01/2011 | US7898085 Solid-state imaging device and manufacturing method thereof |
| 03/01/2011 | US7898084 Semiconductor device |
| 03/01/2011 | US7898083 Method for low stress flip-chip assembly of fine-pitch semiconductor devices |
| 03/01/2011 | US7898082 Nitrogen rich barrier layers and methods of fabrication thereof |
| 03/01/2011 | US7898081 MEMS device and method of making the same |
| 03/01/2011 | US7898080 Power semiconductor device comprising a semiconductor chip stack and method for producing the same |
| 03/01/2011 | US7898079 Nanotube materials for thermal management of electronic components |
| 03/01/2011 | US7898078 Power connector/decoupler integrated in a heat sink |
| 03/01/2011 | US7898077 Adjustable threaded cores for LED thermal management |
| 03/01/2011 | US7898076 Structure and methods of processing for solder thermal interface materials for chip cooling |
| 03/01/2011 | US7898075 Semiconductor package having resin substrate with recess and method of fabricating the same |