| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/08/2011 | US7902546 Rare earth-oxides, rare earth -nitrides, rare earth -phosphides and ternary alloys with silicon |
| 03/08/2011 | US7902481 Method of manufacturing sealed electronic component and sealed electronic component |
| 03/08/2011 | US7902083 Passivation layer for a circuit device and method of manufacture |
| 03/08/2011 | US7902067 Post passivation interconnection schemes on top of the IC chips |
| 03/08/2011 | US7902062 Electrodepositing a metal in integrated circuit applications |
| 03/08/2011 | US7902038 Detachable substrate with controlled mechanical strength and method of producing same |
| 03/08/2011 | US7901996 Integrated circuit package system with interconnection support and method of manufacture thereof |
| 03/08/2011 | US7901991 Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system |
| 03/08/2011 | US7901990 Method of forming a molded array package device having an exposed tab and structure |
| 03/08/2011 | US7901983 Bump-on-lead flip chip interconnection |
| 03/08/2011 | US7901783 Low κ dielectric inorganic/organic hybrid films and method of making |
| 03/08/2011 | US7901045 Ink jet recording head and method for manufacturing the same |
| 03/08/2011 | US7900347 Method of making a compliant interconnect assembly |
| 03/03/2011 | WO2011025988A2 Architecture for gas cooled parallel microchannel array cooler |
| 03/03/2011 | WO2011025897A1 Transformer signal coupling for flip-chip integration |
| 03/03/2011 | WO2011025894A1 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers |
| 03/03/2011 | WO2011025654A1 Controlling integrated circuits including remote activation or deactivation |
| 03/03/2011 | WO2011025579A2 Electronic package system |
| 03/03/2011 | WO2011025487A1 Heat storage by phase-change material |
| 03/03/2011 | WO2011025299A2 Heat sink including silicon carbide and manufacturing method thereof |
| 03/03/2011 | WO2011025020A1 Paper sheet radiator |
| 03/03/2011 | WO2011024939A1 Semiconductor device and manufacturing method therefor |
| 03/03/2011 | WO2011024851A1 Semiconductor integrated circuit device |
| 03/03/2011 | WO2011024820A1 Electronic device and method for manufacturing electronic device |
| 03/03/2011 | WO2011024795A1 Electronic device and membrane filtration device comprising same |
| 03/03/2011 | WO2011024790A1 Multiple resin-layered substrate and method of manufacture of multiple resin-layered substrate |
| 03/03/2011 | WO2011024770A1 Semiconductor device, liquid crystal display device equipped with semiconductor device, and process for production of semiconductor device |
| 03/03/2011 | WO2011024704A1 Wiring layer, semiconductor device, liquid crystal display device |
| 03/03/2011 | WO2011024452A1 Radiation imaging apparatus |
| 03/03/2011 | WO2011024377A1 Semiconductor module and heat radiation member |
| 03/03/2011 | WO2011024045A1 Method for fabricating a through interconnect on a semiconductor substrate |
| 03/03/2011 | WO2011023922A1 Improved pn junctions and methods |
| 03/03/2011 | WO2011023556A1 Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer |
| 03/03/2011 | WO2011023519A1 Selective nanotube growth inside vias using an ion beam |
| 03/03/2011 | WO2011023325A1 Cooling element and method for producing the cooling element |
| 03/03/2011 | WO2011022949A1 High-density memory assembly |
| 03/03/2011 | WO2011022923A1 Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| 03/03/2011 | WO2010147728A3 Non-snapback scr for electrostatic discharge protection |
| 03/03/2011 | WO2010143896A3 Heat-dissipating device and electronic apparatus having the same |
| 03/03/2011 | WO2010141624A3 Modified pillar design for improved flip chip packaging |
| 03/03/2011 | WO2010141482A3 Nanofiber covered micro components and method for micro component cooling |
| 03/03/2011 | WO2010048653A3 Method for integrating an electronic component into a printed circuit board |
| 03/03/2011 | WO2009001170A3 Filter having impedance matching circuits |
| 03/03/2011 | WO2008026077A3 Flip chip semiconductor package with encapsulant retaining structure and strip |
| 03/03/2011 | US20110053297 Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants |
| 03/03/2011 | US20110052879 Encapsulation device and method, microcapsule incorporating this device |
| 03/03/2011 | US20110050357 Transformer Signal Coupling for Flip-Chip Integration |
| 03/03/2011 | US20110050320 Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
| 03/03/2011 | US20110049731 Materials and methods for stress reduction in semiconductor wafer passivation layers |
| 03/03/2011 | US20110049730 Device Comprising an Encapsulation Unit |
| 03/03/2011 | US20110049729 Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm |
| 03/03/2011 | US20110049728 Method to perform electrical testing and assembly of electronic devices |
| 03/03/2011 | US20110049727 Recessed interlayer dielectric in a metallization structure of a semiconductor device |
| 03/03/2011 | US20110049726 Semiconductor package and manufacturing method of the semiconductor package |
| 03/03/2011 | US20110049725 Semiconductor Chip with Contoured Solder Structure Opening |
| 03/03/2011 | US20110049724 Beol interconnect structures and related fabrication methods |
| 03/03/2011 | US20110049723 Methods and structures for controlling wafer curvature |
| 03/03/2011 | US20110049722 Semiconductor Circuit Structure and Layout Method thereof |
| 03/03/2011 | US20110049721 Metal density aware signal routing |
| 03/03/2011 | US20110049720 Refractory metal nitride capped electrical contact and method for frabricating same |
| 03/03/2011 | US20110049719 Semiconductor device and method for manufacturing the same |
| 03/03/2011 | US20110049718 Method of manufacturing semiconductor device, semiconductor device, electronic instrument, semiconductor manufacturing apparatus, and storage medium |
| 03/03/2011 | US20110049717 Integrated circuits having tsvs including metal gettering dielectric liners |
| 03/03/2011 | US20110049716 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects |
| 03/03/2011 | US20110049715 Method for depositing metal oxide films |
| 03/03/2011 | US20110049714 Illuminant |
| 03/03/2011 | US20110049713 Dual contact metallization including electroless plating in a semiconductor device |
| 03/03/2011 | US20110049712 Wafer Level Stacked Die Packaging |
| 03/03/2011 | US20110049711 Elliptic c4 with optimal orientation for enhanced reliability in electronic packages |
| 03/03/2011 | US20110049710 Interconnect layouts for electronic assemblies |
| 03/03/2011 | US20110049709 Method of manufacturing a semiconductor device |
| 03/03/2011 | US20110049708 Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same |
| 03/03/2011 | US20110049707 Semiconductor device and method of manufacturing the semiconductor device |
| 03/03/2011 | US20110049706 Front Side Copper Post Joint Structure for Temporary Bond in TSV Application |
| 03/03/2011 | US20110049705 Self-aligned protection layer for copper post structure |
| 03/03/2011 | US20110049704 Semiconductor device packages with integrated heatsinks |
| 03/03/2011 | US20110049703 Flip-Chip Package Structure |
| 03/03/2011 | US20110049702 Semiconductor package and method of producing the same |
| 03/03/2011 | US20110049701 Semiconductor device and method of manufacturing the same |
| 03/03/2011 | US20110049700 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers |
| 03/03/2011 | US20110049699 Method of semiconductor device protection, package of semiconductor device |
| 03/03/2011 | US20110049698 Semiconductor package and method of fabricating the same |
| 03/03/2011 | US20110049697 Electronic package system |
| 03/03/2011 | US20110049695 Semiconductor Device and Method of Forming Pre-Molded Semiconductor Die Having Bumps Embedded in Encapsulant |
| 03/03/2011 | US20110049693 Semiconductor device, method of manufacturing semiconductor device, and lead frame thereof |
| 03/03/2011 | US20110049692 Connection device bewteen transistor and lead frame |
| 03/03/2011 | US20110049691 Semiconductor package and method for packaging the same |
| 03/03/2011 | US20110049690 Direct contract leadless package for high current devices |
| 03/03/2011 | US20110049689 Semiconductor device with acene heat spreader |
| 03/03/2011 | US20110049688 TCP-type semiconductor device |
| 03/03/2011 | US20110049687 Encapsulant interposer system with integrated passive devices and manufacturing method therefor |
| 03/03/2011 | US20110049686 Semiconductor package and method of manufacturing the same |
| 03/03/2011 | US20110049685 Semiconductor device with electromagnetic interference shielding |
| 03/03/2011 | US20110049684 Anticounterfeiting system and method for integrated circuits |
| 03/03/2011 | US20110049676 Method, structure, and design structure for a through-silicon-via wilkinson power divider |
| 03/03/2011 | US20110049671 Bonding pad structure and integrated circuit chip using such bonding pad structure |
| 03/03/2011 | US20110049667 Semiconductor Component With Dielectric Layer Stack |
| 03/03/2011 | US20110049596 Semiconductor Device Having Impurity Doped Polycrystalline Layer Including Impurity Diffusion Prevention Layer and Dynamic Random Memory Device Including the Semiconductor Device |
| 03/03/2011 | US20110049580 Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET |
| 03/03/2011 | US20110049578 Electric component and method of manufacturing the electric component |