H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2011
03/10/2011	DE102006023429B4 ESD-Schutz-Element zur Verwendung in einem elektrischen Schaltkreis ESD protection element for use in an electrical circuit
03/09/2011	EP2293657A1 Electronic component and method of forming an electronic component
03/09/2011	EP2293330A1 On-chip power switches implementation.
03/09/2011	EP2293329A1 Refrigeration apparatus
03/09/2011	EP2293328A1 Power semiconductor circuit device and method for manufacturing the same
03/09/2011	EP2293325A2 Semiconductor electronic device and method of manufacturing thereof
03/09/2011	EP2293324A1 Packaging structure and method for manufacturing packaging structure
03/09/2011	EP2293322A1 Method for forming a metal nitride layer
03/09/2011	EP2292707A1 Ink composition for forming an insulating film and an insulating film formed from said ink composition
03/09/2011	EP2291859A1 Cooling system, in particular for electronic structural units
03/09/2011	EP2291858A1 Packaged semiconductor product and method for manufacture thereof
03/09/2011	EP2291857A2 Wire on wire stitch bonding in a semiconductor device
03/09/2011	EP2291477A2 Adhesive encapsulating composition and electronic devices made therewith
03/09/2011	EP2189051B1 Device for disassembling electronic power components and method for implementing said device
03/09/2011	EP1649736B1 Cooling device for an electronic component, especially for a microprocessor
03/09/2011	EP1340258B1 Thermally enhanced microcircuit package and method of forming same
03/09/2011	CN201758491U High heat-conducting circuit board manufactured by oil printing method
03/09/2011	CN201758490U Circuit board with high-thermal conductivity manufactured with plating method
03/09/2011	CN201758486U Metal base high conductivity circuit board
03/09/2011	CN201758485U High-thermal conductivity circuit board made by using hot-press method
03/09/2011	CN201758124U Aluminum-based packaging fast-recovery single-phase bridge
03/09/2011	CN201758123U Triode lead wire frame
03/09/2011	CN201758122U Chip circuit utilizing reasonable distribution of transverse pads and longitudinal pads
03/09/2011	CN201758121U Low bump chip size packaging structure
03/09/2011	CN201758120U Axial-type surface contact glass packaging rectifying tube
03/09/2011	CN201758119U Controllable silicon cooling structure of garment steamer
03/09/2011	CN201755723U Semiconductor cooling welding machine
03/09/2011	CN1976023B Output match transistor
03/09/2011	CN1910596B Semiconductor device
03/09/2011	CN101984507A Novel water-cooled radiator for thyristor
03/09/2011	CN101668880B Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
03/09/2011	CN101621057B Active assembly array base plate
03/09/2011	CN101548377B Packaged integrated circuit with enhanced thermal dissipation
03/09/2011	CN101512026B Cu-ni-si alloy
03/09/2011	CN101488499B Semiconductor integrated circuit and switch arranging and wiring method apparatus
03/09/2011	CN101484992B Cooling semiconductor-based devices arranged in a greenhouse
03/09/2011	CN101369569B 载体衬底和集成电路 Carrier substrate and integrated circuit
03/09/2011	CN101114641B Assembly with a power semiconductor element and a contact device
03/08/2011	US7904770 Testing circuit split between tiers of through silicon stacking chips
03/08/2011	US7904731 Integrated circuit that uses a dynamic characteristic of the circuit
03/08/2011	US7903421 Locking device and electronic device using the same
03/08/2011	US7903420 Fixing structure of fixing a thermal module
03/08/2011	US7903419 Heat dissipation device having a back plate unit
03/08/2011	US7903417 Electrical circuit assembly for high-power electronics
03/08/2011	US7903413 Coupling system and method for attaching thermal components in association with a board-mounted integrated circuit
03/08/2011	US7903410 Package board and method for manufacturing thereof
03/08/2011	US7903409 System and method for cooling an electronic device
03/08/2011	US7903404 Data centers
03/08/2011	US7903225 Display and tape carrier package structure
03/08/2011	US7903067 Driver chip and display apparatus having the same
03/08/2011	US7903054 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device
03/08/2011	US7902683 Semiconductor arrangement and method for producing a semiconductor arrangement
03/08/2011	US7902682 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
03/08/2011	US7902681 Semiconductor device, production method for the same, and substrate
03/08/2011	US7902680 Layered structure, electron device, and an electron device array having a variable wettability layer and semiconductor layer formed thereon
03/08/2011	US7902679 Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
03/08/2011	US7902678 Semiconductor device and manufacturing method thereof
03/08/2011	US7902677 Composite layered chip package and method of manufacturing same
03/08/2011	US7902676 Stacked semiconductor device and fabricating method thereof
03/08/2011	US7902675 Capillary underfill of stacked wafers
03/08/2011	US7902673 Semiconductor device
03/08/2011	US7902672 Semiconductor device and method of manufacturing same
03/08/2011	US7902670 Display panel structure and manufacture method thereof
03/08/2011	US7902669 Semiconductor device and method for manufacturing the same
03/08/2011	US7902668 Flip chip semiconductor device including an unconnected neutralizing electrode
03/08/2011	US7902666 Flip chip device having soldered metal posts by surface mounting
03/08/2011	US7902665 Semiconductor device having a suspended isolating interconnect
03/08/2011	US7902664 Semiconductor package having passive component and semiconductor memory module including the same
03/08/2011	US7902663 Semiconductor package having stepwise depression in substrate
03/08/2011	US7902662 Power core devices and methods of making thereof
03/08/2011	US7902661 Integrated circuit micro-module
03/08/2011	US7902660 Substrate for semiconductor device and manufacturing method thereof
03/08/2011	US7902659 Conductive connecting pin and package substrate
03/08/2011	US7902658 Integrated circuit having wide power lines
03/08/2011	US7902657 Self locking and aligning clip structure for semiconductor die package
03/08/2011	US7902656 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
03/08/2011	US7902655 Multichip package leadframe including electrical bussing
03/08/2011	US7902654 System and method of silicon switched power delivery using a package
03/08/2011	US7902653 Semiconductor module
03/08/2011	US7902652 Semiconductor package and semiconductor system in package using the same
03/08/2011	US7902651 Apparatus and method for stacking integrated circuits
03/08/2011	US7902650 Semiconductor package and method for manufacturing the same
03/08/2011	US7902649 Leadframe for leadless package, structure and manufacturing method using the same
03/08/2011	US7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods
03/08/2011	US7902647 TAB package connecting host device element
03/08/2011	US7902646 Multiphase synchronous buck converter
03/08/2011	US7902645 Semiconductor device, semiconductor element, and substrate
03/08/2011	US7902644 Integrated circuit package system for electromagnetic isolation
03/08/2011	US7902643 Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
03/08/2011	US7902642 Resin composition for sealing light-emitting device and lamp
03/08/2011	US7902641 Semiconductor device and manufacturing method therefor
03/08/2011	US7902638 Semiconductor die with through-hole via on saw streets and through-hole via in active area of die
03/08/2011	US7902629 Integrated BEOL thin film resistor
03/08/2011	US7902611 Integrated circuit well isolation structures
03/08/2011	US7902609 Semiconductor devices including multiple stress films in interface area
03/08/2011	US7902604 Configuration of gate to drain (GD) clamp and ESD protection circuit for power device breakdown protection
03/08/2011	US7902583 Capacitor pair structure for increasing the match thereof
03/08/2011	US7902573 Semiconductor device including vertical MOS transistors
03/08/2011	US7902558 Substrate of liquid crystal device and method for manufacturing the same
03/08/2011	US7902550 Semiconductor device and manufacturing method thereof

1 ... 531 532 533 534 535 536 537 538 539 540 541 542 543 544 545 546 547 548 549 550 551 ... 2262