H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2011
03/15/2011	US7906854 Semiconductor device having spacer formed on semiconductor chip connected with wire
03/15/2011	US7906853 Package structure for multiple die stack
03/15/2011	US7906852 Semiconductor device and manufacturing method of the same
03/15/2011	US7906851 Semiconductor device having groove-shaped via-hole
03/15/2011	US7906850 Structure of circuit board and method for fabricating same
03/15/2011	US7906849 Chip structure and process for forming the same
03/15/2011	US7906847 Semiconductor device
03/15/2011	US7906846 Semiconductor device for implementing signal transmission and/or power supply by means of the induction of a coil
03/15/2011	US7906845 Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
03/15/2011	US7906844 Multiple integrated circuit die package with thermal performance
03/15/2011	US7906843 Substrate having a functionally gradient coefficient of thermal expansion
03/15/2011	US7906842 Wafer level system in package and fabrication method thereof
03/15/2011	US7906841 Wafer level incapsulation chip and encapsulation chip manufacturing method
03/15/2011	US7906840 Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure
03/15/2011	US7906839 Semiconductor device and method of shunt test measurement for passive circuits
03/15/2011	US7906838 Electronic component package and method of manufacturing same
03/15/2011	US7906837 Robust leaded molded packages and methods for forming the same
03/15/2011	US7906836 Heat spreader structures in scribe lines
03/15/2011	US7906835 Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package
03/15/2011	US7906834 Display device having thin film semiconductor device and manufacturing method of thin film semiconductor device
03/15/2011	US7906833 Semiconductor device and manufacturing method thereof
03/15/2011	US7906812 Tunable voltage isolation ground to ground ESD clamp
03/15/2011	US7906811 Semiconductor device with protection element disposed around a formation region of a transistor
03/15/2011	US7906810 LDMOS device for ESD protection circuit
03/15/2011	US7906425 Fluxless bumping process
03/15/2011	US7906422 Chip structure and process for forming the same
03/15/2011	US7906418 Semiconductor device having substantially planar contacts and body
03/15/2011	US7906375 Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
03/15/2011	US7906373 Thermally enhanced electrically insulative adhesive paste
03/10/2011	WO2011028806A1 Integrated voltage regulator with embedded passive device(s)
03/10/2011	WO2011028348A2 Die location compensation
03/10/2011	WO2011028245A1 Wafer level compliant packages for rear-face illuminated solid state image sensors
03/10/2011	WO2011028042A2 Packing material containing tungsten and integrated package
03/10/2011	WO2011027958A1 Apparatus for forming solder bumps
03/10/2011	WO2011027884A1 Substrate for mounting semiconductor chip and method for producing same
03/10/2011	WO2011027834A1 METHOD FOR FORMING Co FILM AND METHOD FOR FORMING Cu WIRING FILM
03/10/2011	WO2011027820A1 Lead-free solder alloy, joining member and manufacturing method thereof, and electronic component
03/10/2011	WO2011027762A1 Wiring connection method and functional device
03/10/2011	WO2011027704A1 Piezoelectric fan and air-cooling device using piezoelectric fan
03/10/2011	WO2011027583A1 Circuit board for electronic device, method for producing same, and touch panel
03/10/2011	WO2011027523A1 Semiconductor device and method for producing same
03/10/2011	WO2011027193A1 Reduction of fluorine contamination of bond pads of semiconductor devices
03/10/2011	WO2011027186A1 Package structure
03/10/2011	WO2011027185A1 Package structure
03/10/2011	WO2011026261A1 Ic package and method for manufacturing the same
03/10/2011	WO2011026218A1 Using interrupted through-silicon-vias in integrated circuits adapted for stacking
03/10/2011	WO2010147336A3 Chip on board module
03/10/2011	WO2010127370A3 Series current limiting device
03/10/2011	US20110059606 Method of manufacturing semiconductor device and mask
03/10/2011	US20110057819 Semiconductor device having plural semiconductor chips laminated to each other
03/10/2011	US20110057333 Method for the real-time monitoring of integrated circuit manufacture through localized monitoring structures in opc model space
03/10/2011	US20110057332 Semiconductor chip with conductive adhesive layer and method of manufacturing the same, and method of manufacturing semiconductor device
03/10/2011	US20110057331 Thermosetting die bonding film, dicing die bonding film and semiconductor device
03/10/2011	US20110057330 Electronic device and method of manufacturing electronic device
03/10/2011	US20110057329 Electronic device and manufacturing method of electronic device
03/10/2011	US20110057327 Semiconductor device and method of manufacturing the same
03/10/2011	US20110057326 Method for forming through electrode and semiconductor device
03/10/2011	US20110057325 Chip-size double side connection package and method for manufacturing the same
03/10/2011	US20110057324 Structure And Method Of Making Interconnect Element Having Metal Traces Embedded In Surface Of Dielectric
03/10/2011	US20110057323 Packaging structure having embedded semiconductor element and method for fabricating the same
03/10/2011	US20110057322 Carbon nanotube interconnect and method of manufacturing the same
03/10/2011	US20110057321 3-d multi-wafer stacked semiconductor structure and method for manufacturing the same
03/10/2011	US20110057320 Semiconductor integrated circuit and design method thereof
03/10/2011	US20110057319 Arranging through silicon vias in ic layout
03/10/2011	US20110057318 Die Package
03/10/2011	US20110057317 Contact plug structure, semiconductor device, and method for forming contact plug
03/10/2011	US20110057316 Copper wiring line of semiconductor device and method for forming the same
03/10/2011	US20110057315 Memory device peripheral interconnects
03/10/2011	US20110057313 Enhanced Copper Posts for Wafer Level Chip Scale Packaging
03/10/2011	US20110057312 Contact structure and method for producing a contact structure
03/10/2011	US20110057311 Semiconductor device and manufacturing method therefor
03/10/2011	US20110057310 Semiconductor package having memory devices stacked on logic device
03/10/2011	US20110057309 Structure, method and system for assessing bonding of electrodes in fcb packaging
03/10/2011	US20110057308 Integrated circuit packaging system with conductive pillars and method of manufacture thereof
03/10/2011	US20110057307 Semiconductor Chip with Stair Arrangement Bump Structures
03/10/2011	US20110057306 Edge mounted integrated circuits with heat sink
03/10/2011	US20110057305 Package substrate having semiconductor component embedded therein and fabrication method thereof
03/10/2011	US20110057304 Method for fabricating a semiconductor and semiconductor package
03/10/2011	US20110057303 Package for an Integrated Circuit
03/10/2011	US20110057302 Impedance optimized chip system
03/10/2011	US20110057301 Semiconductor package
03/10/2011	US20110057300 Direct contact leadless flip chip package for high current devices
03/10/2011	US20110057299 Method of manufacturing semiconductor device and semiconductor device
03/10/2011	US20110057298 Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
03/10/2011	US20110057297 Semiconductor chips having guard rings and methods of fabricating the same
03/10/2011	US20110057296 Delamination resistant packaged die having support and shaped die having protruding lip on support
03/10/2011	US20110057292 Capacitors and interconnects including at least two portions of a metal nitride material, methods of forming such structures, and semiconductor devices including such structures
03/10/2011	US20110057291 Ultra high speed signal transmission/recepton
03/10/2011	US20110057290 Fuse of semiconductor device and method for forming the same
03/10/2011	US20110057287 Semiconductor device having dual-sti and manufacturing method thereof
03/10/2011	US20110057281 Wafer level packaged integrated circuit
03/10/2011	US20110057205 Led with phosphor tile and overmolded phosphor in lens
03/10/2011	US20110056740 Through-hole electrode substrate and manufacturing method thereof
03/10/2011	DE202010016431U1 Wärmeleitelement gegen Materialverwechselung und Spannvorrichtung Heat-conducting material mix up and chuck
03/10/2011	DE10345556B4 Halbleiterbauelement und Halbleiterbauelementanordnung mit verbessertem Temperaturverhalten Semiconductor device and semiconductor device assembly with improved temperature behavior
03/10/2011	DE102009040835A1 Verfahren zum thermischen Kontaktieren einander gegenüberliegender elektrischer Anschlüsse einer Halbleiterbauelement-Anordnung Process for the thermal contact of opposing electrical terminals of a semiconductor component arrangement
03/10/2011	DE102009040078A1 Metallpaste mit CO-Vorläufern Metal paste with CO precursors
03/10/2011	DE102009039982A1 Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
03/10/2011	DE102009039890A1 Optoelektronisches Bauelement mit einem Halbleiterkörper, einer Isolationsschicht und einer planaren Leitstruktur und Verfahren zu dessen Herstellung Optoelectronic component having a semiconductor body, an insulating layer and a planar conductive structure and process for its preparation
03/10/2011	DE102009010816B4 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device

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