Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/21/2014US8866287 Embedded structures for package-on-package architecture
10/21/2014US8866286 Single layer coreless substrate
10/21/2014US8866285 Fan-out package comprising bulk metal
10/21/2014US8866284 Semiconductor device comprising an extended semiconductor chip having an extension
10/21/2014US8866283 Chip package structure and method of making the same
10/21/2014US8866282 Semiconductor apparatus, signal transmission system and signal transmission method
10/21/2014US8866281 Three-dimensional integrated circuits and fabrication thereof
10/21/2014US8866280 Chip package
10/21/2014US8866279 Semiconductor device
10/21/2014US8866278 Semiconductor device with increased I/O configuration
10/21/2014US8866277 Package substrate, module and electric/electronic devices using the same
10/21/2014US8866276 Semiconductor chip device with polymeric filler trench
10/21/2014US8866275 Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
10/21/2014US8866274 Semiconductor packages and methods of formation thereof
10/21/2014US8866273 Lead frame and semiconductor package structure thereof
10/21/2014US8866272 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
10/21/2014US8866269 Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
10/21/2014US8866268 Semiconductor package structure and manufacturing method thereof
10/21/2014US8866267 Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
10/21/2014US8866263 Emitter ballasting by contact area segmentation in ESD bipolar based semiconductor component
10/21/2014US8866260 MIM decoupling capacitors under a contact pad
10/21/2014US8866259 Inductor device and fabrication method
10/21/2014US8866258 Interposer structure with passive component and method for fabricating same
10/21/2014US8866256 Unbalanced parallel circuit protection fuse device
10/21/2014US8866252 Power semiconductor devices and fabrication methods
10/21/2014US8866248 Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
10/21/2014US8866239 IC manufacturing method, IC and apparatus
10/21/2014US8866236 Package structure having MEMS element
10/21/2014US8866231 Nitride semiconductor device
10/21/2014US8866229 Semiconductor structure for an electrostatic discharge protection circuit
10/21/2014US8866228 Diode and electrostatic discharge protection circuit including the same
10/21/2014US8866218 Wafer level MOSFET metallization
10/21/2014US8866202 Device with gaps for capacitance reduction
10/21/2014US8866181 Method for producing a component with at least one organic material and component with at least one organic material
10/21/2014US8866171 Light-emitting element and light-emitting device
10/21/2014US8866170 Light emitting diode display
10/21/2014US8866157 Semiconductor device and method of fabricating the semiconductor device
10/21/2014US8866150 Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts
10/21/2014US8866144 Thin film semiconductor device having silicon nitride film
10/21/2014US8866026 Construction of reliable stacked via in electronic substrates—vertical stiffness control method
10/21/2014US8866025 Multilayer wiring board
10/21/2014US8865597 Ta—TaN selective removal process for integrated device fabrication
10/21/2014US8865592 Silicided semiconductor structure and method of forming the same
10/21/2014US8865589 Semiconductor device and manufacturing method of semiconductor device
10/21/2014US8865587 Multi-chip-scale package
10/21/2014US8865586 UBM formation for integrated circuits
10/21/2014US8865584 Semiconductor device and manufacturing method thereof
10/21/2014US8865583 Manufacturing method of a semiconductor device and method for creating a layout thereof
10/21/2014US8865566 Method of cutting semiconductor substrate
10/21/2014US8865564 Process for producing vertical interconnections through structured layers
10/21/2014US8865563 Film embedding method and semiconductor device
10/21/2014US8865537 Differential excitation of ports to control chip-mode mediated crosstalk
10/21/2014US8865527 Lid attach process
10/21/2014US8865526 Semiconductor device and method for manufacturing a semiconductor device
10/21/2014US8865525 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/21/2014US8865524 Lead carrier with print-formed package components
10/21/2014US8865523 Semiconductor package and fabrication method thereof
10/21/2014US8865522 Method for manufacturing semiconductor devices having a glass substrate
10/21/2014US8865521 3D semiconductor package interposer with die cavity
10/21/2014US8865489 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
10/21/2014US8865482 Method of detecting the circular uniformity of the semiconductor circular contact holes
10/21/2014US8865393 Printed circuit board and method of manufacturing the same
10/21/2014US8865110 Method for producing graphite film and graphite film produced by the method
10/21/2014US8864121 Adaptive clamp width adjusting device
10/21/2014US8864090 Fixing apparatus for waveguide plate
10/21/2014US8864011 Apparatus for thermal melting process and method of thermal melting process
10/21/2014US8863821 Dissipation utilizing flow of refrigerant
10/21/2014US8863383 Integrated heat spreader and method of fabrication
10/21/2014US8863378 Method for manufacturing a wiring board
10/16/2014US20140308820 Method of depositing silicon oxide film and silicon nitride film and method of manufacturing semiconductor device
10/16/2014US20140308809 Bundled memory and manufacture method for a bundled memory with an external input/output bus
10/16/2014US20140308780 Fabrication method of semiconductor package
10/16/2014US20140308779 Integrated circuit package with voltage distributor
10/16/2014US20140308764 Adjusting Sizes of Connectors of Package Components
10/16/2014US20140306750 Semiconductor device
10/16/2014US20140306732 Detection of defective electrical connections
10/16/2014US20140306357 Dicing die-bonding film and method of forming a cut on the dicing die-bonding film
10/16/2014US20140306356 Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
10/16/2014US20140306355 Chip interposer, semiconductor device, and method for manufacturing a semiconductor device
10/16/2014US20140306354 Semiconductor package
10/16/2014US20140306353 3d memory array
10/16/2014US20140306352 Semiconductor device and fabrication method
10/16/2014US20140306351 Semiconductor device with air gap and method of fabricating the same
10/16/2014US20140306350 Method of manufacturing through-glass vias
10/16/2014US20140306349 Low cost interposer comprising an oxidation layer
10/16/2014US20140306348 Chip on film and display device having the same
10/16/2014US20140306347 Semiconductor Device with an Insulation Layer Having a Varying Thickness
10/16/2014US20140306346 Semiconductor device having groove-shaped via-hole
10/16/2014US20140306345 Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same
10/16/2014US20140306344 Wiring structure, semiconductor device including wiring structure, and method of manufacturing semiconductor device
10/16/2014US20140306343 Chip package and method for fabricating the same
10/16/2014US20140306342 Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
10/16/2014US20140306341 3D Packages and Methods for Forming the Same
10/16/2014US20140306340 Package structure having embedded electronic component
10/16/2014US20140306339 Semiconductor device and manufacturing method of semiconductor device
10/16/2014US20140306338 Die-die stacking structure and method for making the same
10/16/2014US20140306337 Semiconductor device having a buffer material and stiffener
10/16/2014US20140306336 Fluid cooled semiconductor die package
10/16/2014US20140306335 Thermal management for solid-state drive
10/16/2014US20140306334 Semiconductor package
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