Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/16/2014US20140306333 Cavity package with die attach pad
10/16/2014US20140306332 Integrating Multi-Output Power Converters Having Vertically Stacked Semiconductor Chips
10/16/2014US20140306331 Chip and chip arrangement
10/16/2014US20140306330 Low Profile Leaded Semiconductor Package
10/16/2014US20140306329 Semiconductor package
10/16/2014US20140306328 Semiconductor device
10/16/2014US20140306327 Semiconductor device and method of manufacturing thereof
10/16/2014US20140306326 Tunable Semiconductor Component Provided with a Current Barrier
10/16/2014US20140306324 Semiconductor device with a polymer substrate and methods of manufacturing the same
10/16/2014US20140306322 Reliable back-side-metal structure
10/16/2014US20140306321 Semiconductor device fabrication method and semiconductor device
10/16/2014US20140306316 Semiconductor device and method of manufacturing the same
10/16/2014US20140306279 Semiconductor devices including word line interconnecting structures
10/16/2014US20140306227 Display apparatus, array substrate, and method for producing the array substrate
10/16/2014US20140306224 Display Device and Method for Manufacturing the Same
10/16/2014US20140306218 Display device and electronic device
10/16/2014US20140306016 Contact smart card
10/14/2014US8863071 De-pop on-device decoupling for BGA
10/14/2014US8861728 Integrated circuit tamper detection and response
10/14/2014US8861242 Stacked device identification assignment
10/14/2014US8861221 Integrated circuit packaging system with a shield and method of manufacture thereof
10/14/2014US8861216 Fixing mechanism and related electronic device
10/14/2014US8861203 Adjustable heat sink assembly
10/14/2014US8861202 Integrated thermal and structural management solution for Rechargeable Energy Storage System assembly
10/14/2014US8861159 Semiconductor device and systems including the same
10/14/2014US8861158 ESD trigger for system level ESD events
10/14/2014US8860635 Self assembling display with substrate
10/14/2014US8860607 Gain enhanced LTCC system-on-package for UMRR applications
10/14/2014US8860519 Device having inductor and memcapacitor
10/14/2014US8860496 Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices
10/14/2014US8860233 Resin composition for encapsulation and semiconductor unit encapsulated with resin
10/14/2014US8860232 Electronic device having electrodes bonded with each other
10/14/2014US8860231 Semiconductor integrated circuit having multilayer structure
10/14/2014US8860230 Back-side contact formation
10/14/2014US8860229 Hybrid bonding with through substrate via (TSV)
10/14/2014US8860228 Electronic device including electrically conductive vias having different cross-sectional areas and related methods
10/14/2014US8860226 Method of manufacturing semiconductor device
10/14/2014US8860225 Devices formed with dual damascene process
10/14/2014US8860224 Preventing the cracking of passivation layers on ultra-thick metals
10/14/2014US8860223 Resistive random access memory
10/14/2014US8860222 Techniques for wafer-level processing of QFN packages
10/14/2014US8860221 Electrode connecting structures containing copper
10/14/2014US8860220 Semiconductor device and method for manufacturing the same
10/14/2014US8860219 Chip assembly and chip assembling method
10/14/2014US8860218 Semiconductor device having improved contact structure
10/14/2014US8860217 Electronic device package
10/14/2014US8860216 Method and system for providing a laser submount for an energy assisted magnetic recording head
10/14/2014US8860215 Semiconductor device and method of manufacturing the same
10/14/2014US8860213 Power converter
10/14/2014US8860212 Fluid cooled semiconductor die package
10/14/2014US8860211 Semiconductor device, semiconductor device manufacturing method, and electronic device
10/14/2014US8860210 Semiconductor device
10/14/2014US8860209 LED luminaire having front and rear convective heat sinks
10/14/2014US8860208 Heat spreader structures in scribe lines
10/14/2014US8860207 Method of fabricating land grid array semiconductor package
10/14/2014US8860206 Multichip electronic packages and methods of manufacture
10/14/2014US8860205 Method of stiffening coreless package substrate
10/14/2014US8860204 Semiconductor device and package with bit cells and power supply electrodes
10/14/2014US8860203 Stretchable base plate and stretchable organic light-emitting display device
10/14/2014US8860202 Chip stack structure and manufacturing method thereof
10/14/2014US8860201 Stacked integrated circuit package using a window substrate
10/14/2014US8860200 Stacked electronic device and method of making such an electronic device
10/14/2014US8860199 Multi-die processor
10/14/2014US8860198 Semiconductor package with temperature sensor
10/14/2014US8860197 Integrated circuits secure from invasion and methods of manufacturing the same
10/14/2014US8860196 Semiconductor package and method of fabricating the same
10/14/2014US8860195 Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package
10/14/2014US8860194 Buck converter power package
10/14/2014US8860193 Pad configurations for an electronic package assembly
10/14/2014US8860192 Power device having high switching speed
10/14/2014US8860191 On-chip transmission line structures with balanced phase delay
10/14/2014US8860190 Semiconductor device
10/14/2014US8860188 Semiconductor device having a wafer level through silicon via (TSV)
10/14/2014US8860187 Semiconductor device
10/14/2014US8860186 Method for manufacturing an integrated circuit comprising vias crossing the substrate
10/14/2014US8860185 Crack-arresting structure for through-silicon vias
10/14/2014US8860184 Spacer assisted pitch division lithography
10/14/2014US8860182 Resistance random access memory device
10/14/2014US8860179 Inductive loop formed by through silicon via interconnection
10/14/2014US8860178 Semiconductor device having an inductor
10/14/2014US8860177 Semiconductor device and method for manufacturing the same
10/14/2014US8860176 Multi-doped silicon antifuse device for integrated circuit
10/14/2014US8860175 Fuse of semiconductor device and method for forming the same
10/14/2014US8860147 Semiconductor interconnect
10/14/2014US8860135 Semiconductor structure having aluminum layer with high reflectivity
10/14/2014US8860112 finFET eDRAM strap connection structure
10/14/2014US8860110 Semiconductor devices including spacers on sidewalls of conductive lines and methods of manufacturing the same
10/14/2014US8860095 Interconnect wiring switches and integrated circuits including the same
10/14/2014US8860094 Semiconductor device with power supply line system of reduced resistance
10/14/2014US8860093 Semiconductor device and radio communication device
10/14/2014US8860079 Semiconductor packages and methods of packaging semiconductor devices
10/14/2014US8860072 Light emitting device and light unit having the same
10/14/2014US8860064 Light emitting device
10/14/2014US8860060 Light emitting diode integrated cable and heat sink
10/14/2014US8860035 Organic light emitting diode display and manufacturing method thereof
10/14/2014US8859907 Method for assembling a circuit board
10/14/2014US8859426 Semiconductor device and manufacturing method thereof
10/14/2014US8859421 Manganese oxide film forming method, semiconductor device manufacturing method and semiconductor device
10/14/2014US8859420 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
10/14/2014US8859419 Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device
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