Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/28/2014US8871532 Method of manufacturing semiconductor device
10/28/2014US8869877 Monolithic cold plate configuration
10/28/2014US8869389 Method of manufacturing an electronic device package
10/28/2014US8869387 Methods for making microelectronic die systems
10/23/2014US20140315384 Method of processing a device substrate
10/23/2014US20140315355 Manufacturing method of wafer level package
10/23/2014US20140315353 Fabrication method of packaging substrate, and fabrication method of semiconductor package
10/23/2014US20140315352 Semiconductor device fabricating method
10/23/2014US20140315351 Fabrication method of semiconductor package without chip carrier
10/23/2014US20140315350 Wafer process for molded chip scale package (mcsp) with thick backside metallization
10/23/2014US20140315016 Adhesive substance, in particular for encapsulating an electronic assembly
10/23/2014US20140313669 Liquid cooling system for modular electronic systems
10/23/2014US20140312514 Semiconductor device
10/23/2014US20140312513 Semiconductor device, substrate and semiconductor device manufacturing method
10/23/2014US20140312512 Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer
10/23/2014US20140312511 Manufacturing method for semiconductor device
10/23/2014US20140312510 Semiconductor Device
10/23/2014US20140312509 Semiconductor memory device and method of manufacturing the same
10/23/2014US20140312508 Semiconductor interconnect structures
10/23/2014US20140312507 Semiconductor device having a multilayer interconnection structure
10/23/2014US20140312506 Semiconductor device and method for manufacturing same
10/23/2014US20140312505 Semiconductor devices and fabrication methods thereof
10/23/2014US20140312504 Interconnect line selectively isolated from an underlying contact plug
10/23/2014US20140312503 Semiconductor packages and methods of fabricating the same
10/23/2014US20140312502 Through-vias for wiring layers of semiconductor devices
10/23/2014US20140312501 Non-random array anisotropic conductive film (acf) and manufacturing processes
10/23/2014US20140312500 Combining cut mask lithography and conventional lithography to achieve sub-threshold pattern features
10/23/2014US20140312499 Semiconductor device and manufacturing method thereof
10/23/2014US20140312498 Semiconductor device and method of manufacturing same
10/23/2014US20140312497 Molding Material and Method for Packaging Semiconductor Chips
10/23/2014US20140312496 Semiconductor package and semiconductor device
10/23/2014US20140312495 Fan out integrated circuit device packages on large panels
10/23/2014US20140312494 Wafer Backside Interconnect Structure Connected to TSVs
10/23/2014US20140312493 Semiconductor device and a method of manufacturing the same
10/23/2014US20140312492 Package with a Fan-out Structure and Method of Forming the Same
10/23/2014US20140312491 Semiconductor device, semiconductor package, and electronic system
10/23/2014US20140312490 Electrical system and core module thereof
10/23/2014US20140312489 Flip-chip semiconductor package
10/23/2014US20140312488 Method of manufacturing wiring board unit, method of manufacturing insertion base, wiring board unit, and insertion base
10/23/2014US20140312487 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing
10/23/2014US20140312486 Chip-on-film package and display device having the same
10/23/2014US20140312485 Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
10/23/2014US20140312484 Electronic assembly for mounting on electronic board
10/23/2014US20140312482 Wafer level array of chips and method thereof
10/23/2014US20140312480 Double-side exposed semiconductor device
10/23/2014US20140312479 Escape routes
10/23/2014US20140312478 Chip package and manufacturing method thereof
10/23/2014US20140312477 Lead And Lead Frame For Power Package
10/23/2014US20140312476 No-exposed-pad ball grid array (bga) packaging structures and method for manufacturing the same
10/23/2014US20140312475 Die reuse in electrical circuits
10/23/2014US20140312474 Semiconductor package with wire bonding
10/23/2014US20140312473 Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
10/23/2014US20140312472 Method of manufacturing semiconductor device and semiconductor device
10/23/2014US20140312470 Seal ring structure with capacitor
10/23/2014US20140312468 Semiconductor structure and manufacturing method thereof
10/23/2014US20140312467 Through-vias for wiring layers of semiconductor devices
10/23/2014US20140312466 Integrated circuit sealing system with broken seal ring
10/23/2014US20140312464 Semiconductor device manufacturing method and semiconductor device
10/23/2014US20140312456 Semiconductor devices and methods of fabricating the same
10/23/2014US20140312454 Structure Designs and Methods for Integrated Circuit Alignment
10/23/2014US20140312394 Semiconductor Device Including a Material to Absorb Thermal Energy
10/23/2014US20140312392 Solid-state imaging device, method of manufacturing the same, method of driving the same, and electronic apparatus
10/23/2014US20140312390 Layout Structure of Heterojunction Bipolar Transistors
10/23/2014US20140312361 Semiconductor element, semiconductor device and method for manufacturing semiconductor element
10/23/2014US20140312360 Semiconductor Power Device Having a Heat Sink
10/23/2014US20140312359 Method for bonding semiconductor substrates
10/23/2014US20140312101 Materials, structures and methods for microelectronic packaging
10/21/2014US8869079 Semiconductor device and layout design method for the same
10/21/2014US8867871 Optical printed circuit board and method of fabricating the same
10/21/2014US8867227 Electronic component
10/21/2014US8867219 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
10/21/2014US8867210 Cooling apparatus for an electrical substrate
10/21/2014US8867209 Two-phase, water-based immersion-cooling apparatus with passive deionization
10/21/2014US8867208 Electronic device
10/21/2014US8866829 Integrated circuit device and electronic equipment
10/21/2014US8866313 Substrate, semiconductor construction, and manufacturing method thereof
10/21/2014US8866312 Semiconductor apparatus, method for manufacturing the same and electric device
10/21/2014US8866311 Semiconductor package substrates having pillars and related methods
10/21/2014US8866310 Semiconductor device
10/21/2014US8866309 Chip package structure
10/21/2014US8866308 High density interconnect device and method
10/21/2014US8866307 Deposition and selective removal of conducting helplayer for nanostructure processing
10/21/2014US8866306 Signal path and method of manufacturing a multiple-patterned semiconductor device
10/21/2014US8866305 Methods of forming bonded semiconductor structures
10/21/2014US8866304 Integrated circuit device with stitched interposer
10/21/2014US8866303 Semiconductor device with configurable through-silicon vias
10/21/2014US8866301 Package systems having interposers with interconnection structures
10/21/2014US8866300 Devices and methods for solder flow control in three-dimensional microstructures
10/21/2014US8866299 Backside processing of semiconductor devices
10/21/2014US8866298 Bonded system with coated copper conductor
10/21/2014US8866297 Air-gap formation in interconnect structures
10/21/2014US8866296 Semiconductor device comprising thin-film terminal with deformed portion
10/21/2014US8866295 Semiconductor memory modules and methods of fabricating the same
10/21/2014US8866294 Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
10/21/2014US8866293 Semiconductor structure and fabrication method thereof
10/21/2014US8866292 Semiconductor packages with integrated antenna and methods of forming thereof
10/21/2014US8866291 Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
10/21/2014US8866290 Molded heat spreaders
10/21/2014US8866289 Bonding process and bonded structures
10/21/2014US8866288 Semiconductor package
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