Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2014
10/30/2014US20140319613 Semiconductor device
10/30/2014US20140319588 Semiconductor device
10/30/2014US20140319587 Through-Substrate Vias and Methods for Forming the Same
10/30/2014US20140319544 Apparatus and method for fabricating epi wafer and epi wafer
10/30/2014US20140319541 Voidlessly encapsulated semiconductor die package
10/30/2014US20140319523 Chip-on-film package and display device having the same
10/30/2014US20140319522 Far back end of the line metallization method and structures
10/30/2014US20140319447 Semiconductor Constructions and Memory Arrays
10/30/2014US20140319199 Multi-functional detachable and replaceable wire bonding heating plate
10/28/2014US8875083 Routing method for flip chip package and apparatus using the same
10/28/2014US8874926 Increasing security in inter-chip communication
10/28/2014US8873282 Interfaces and die packages, and appartuses including the same
10/28/2014US8873265 Semiconductor memory system
10/28/2014US8873247 Device and manufacturing method of the same
10/28/2014US8873244 Package structure
10/28/2014US8873237 Embedded heat pipe in a hybrid cooling system
10/28/2014US8873209 Integrated circuit and method of providing electrostatic discharge protection within such an integrated circuit
10/28/2014US8873032 Optical probing system having reliable temperature control
10/28/2014US8872600 High frequency circuit module with a filter disposed in a core layer of a circuit substrate
10/28/2014US8872577 Semiconductor device and power supply unit utilizing the same
10/28/2014US8872360 Multiple-qubit wave-activated controlled gate
10/28/2014US8872359 MEMS devices
10/28/2014US8872358 Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
10/28/2014US8872357 Anisotropic conductive film composition and semiconductor device bonded by the same
10/28/2014US8872356 Semiconductor structures comprising a dielectric material having a curvilinear profile
10/28/2014US8872355 Semiconductor device with pre-molding chip bonding
10/28/2014US8872354 Method of forming through silicon via of semiconductor device using low-K dielectric material
10/28/2014US8872353 Semiconductor device having groove-shaped via-hole
10/28/2014US8872352 Semiconductor device having groove-shaped via-hole
10/28/2014US8872351 Semiconductor devices having through electrodes
10/28/2014US8872350 Semiconductor device and manufacturing method thereof
10/28/2014US8872349 Bridge interconnect with air gap in package assembly
10/28/2014US8872348 Stack type semiconductor device
10/28/2014US8872347 Semiconductor device having groove-shaped via-hole
10/28/2014US8872346 Semiconductor device
10/28/2014US8872345 Forming grounded through-silicon vias in a semiconductor substrate
10/28/2014US8872344 Conductive via structures for routing porosity and low via resistance, and processes of making
10/28/2014US8872342 Barrier layer for copper interconnect
10/28/2014US8872341 Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same
10/28/2014US8872340 Substrate for semiconductor package which can prevent the snapping of a circuit trace despite physical deformation of a semiconductor package and semiconductor package having the same
10/28/2014US8872339 Semiconductors structure with elements having different widths and methods of making the same
10/28/2014US8872338 Trace routing within a semiconductor package substrate
10/28/2014US8872337 Semiconductor package and display apparatus using the same
10/28/2014US8872336 Conductive structure and method for forming the same
10/28/2014US8872335 Electronic device and method of manufacturing same
10/28/2014US8872334 Method for manufacturing semiconductor device
10/28/2014US8872333 System and method for integrated waveguide packaging
10/28/2014US8872332 Power module with directly attached thermally conductive structures
10/28/2014US8872331 Semiconductor device and method for manufacturing the same
10/28/2014US8872330 Thin-film semiconductor component and component assembly
10/28/2014US8872329 Extended landing pad substrate package structure and method
10/28/2014US8872328 Integrated power module package
10/28/2014US8872327 Semiconductor device
10/28/2014US8872326 Three dimensional (3D) fan-out packaging mechanisms
10/28/2014US8872325 Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer
10/28/2014US8872323 Stack package
10/28/2014US8872321 Semiconductor packages with integrated heat spreaders
10/28/2014US8872320 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
10/28/2014US8872319 Stacked package structure including insulating layer between two stacked packages
10/28/2014US8872318 Through interposer wire bond using low CTE interposer with coarse slot apertures
10/28/2014US8872317 Stacked package
10/28/2014US8872316 Manufacturing method of semiconductor device and semiconductor device
10/28/2014US8872315 Electronic device and method of fabricating an electronic device
10/28/2014US8872314 Method for producing a component and device comprising a component
10/28/2014US8872312 EMI package and method for making same
10/28/2014US8872311 Semiconductor device and a method of manufacture therefor
10/28/2014US8872310 Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication
10/28/2014US8872306 Electrical interconnection structures including stress buffer layers
10/28/2014US8872304 Semiconductor device and method of manufacturing the same
10/28/2014US8872303 Chip pad resistant to antenna effect and method
10/28/2014US8872301 Dual profile shallow trench isolation apparatus and system
10/28/2014US8872279 Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another
10/28/2014US8872249 Nonvolatile memory device and method for fabricating the same
10/28/2014US8872213 Semiconductor light emitting device
10/28/2014US8872178 IC with comparator receiving expected and mask data from pads
10/28/2014US8872177 Electric charge flow circuit for a time measurement
10/28/2014US8872176 Elastic encapsulated carbon nanotube based electrical contacts
10/28/2014US8872040 Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof
10/28/2014US8872038 Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet
10/28/2014US8871890 Curable resin composition and cured article
10/28/2014US8871641 Low resistance through-wafer via
10/28/2014US8871640 Method of manufacturing semiconductor chip
10/28/2014US8871639 Semiconductor devices and methods of manufacture thereof
10/28/2014US8871638 Semiconductor device and method for fabricating the same
10/28/2014US8871637 Semiconductor structure with insulated through silicon via
10/28/2014US8871634 Chip package incorporating interfacial adhesion through conductor sputtering
10/28/2014US8871631 Method to form solder deposits on substrates
10/28/2014US8871630 Manufacturing electronic device having contact elements with a specified cross section
10/28/2014US8871627 Semiconductor device having low dielectric insulating film and manufacturing method of the same
10/28/2014US8871622 Semiconductor device and manufacturing method thereof
10/28/2014US8871614 Semiconductor die with protective layer and related method of processing a semiconductor wafer
10/28/2014US8871611 Method for molecular adhesion bonding at low pressure
10/28/2014US8871603 Semiconductor device and method for low resistive thin film resistor interconnect
10/28/2014US8871601 Diffusion barriers
10/28/2014US8871573 Method for forming a semiconductor device
10/28/2014US8871572 Lead frame having a perimeter recess within periphery of component terminal
10/28/2014US8871571 Apparatus for and methods of attaching heat slugs to package tops
10/28/2014US8871570 Method of fabricating integrated optoelectronic interconnects with side mounted transducer
10/28/2014US8871569 Semiconductor package and method of manufacturing the same
10/28/2014US8871568 Packages and method of forming the same
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